| Paper Abstract and Keywords |
| Presentation |
2006-06-27 11:20
60GHz Subharmonic Mixer Module Using Stud Bump Bonding Technology
Kohei Masuda, Futoshi Takeuchi (Tohoku Univ.), Yasuhiro Hamada, Kenichi Maruhashi (NEC), Hiroshi Oguma, Suguru Kameda, Hiroyuki Nakase, Tadashi Takagi, Kazuo Tsubouchi (Tohoku Univ.) |
| Abstract |
(in Japanese) |
(See Japanese page) |
| (in English) |
60-GHz band is expected to be used for wireless personal area network with a data rate of more than 3Gbit/s. We are aiming to fabricate ultra-small and low-cost wireless 3-dimentional system-in-package including 60GHz radio frequency components. A 60-GHz-band Integrated Circuit (IC) was mounted on an any layer interstitial via hole (ALIVH) substrate using stud bump bonding technology. Both single and double balanced mixer ICs using antiparallel diode pair were fabricated on GaAs substrates. Characteristics of fabricated mixer ICs in a package were measured. Measured conversion loss of both mixers was 20dB. Degradation of packaged mixer ICs characteristics was found to be negligibly small compared with bare chip characteristics. |
| Keyword |
(in Japanese) |
(See Japanese page) |
| (in English) |
millimeter-wave / wireless module / flip-chip bonding / SBB(Stud Bump Bonding) / / / / |
| Reference Info. |
IEICE Tech. Rep., vol. 106, no. 129, MW2006-27, pp. 11-16, June 2006. |
| Paper # |
MW2006-27 |
| Date of Issue |
2006-06-20 (MW) |
| ISSN |
Print edition: ISSN 0913-5685 |
| Download PDF |
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| Conference Information |
| Committee |
MW |
| Conference Date |
2006-06-27 - 2006-06-27 |
| Place (in Japanese) |
(See Japanese page) |
| Place (in English) |
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| Topics (in Japanese) |
(See Japanese page) |
| Topics (in English) |
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| Paper Information |
| Registration To |
MW |
| Conference Code |
2006-06-MW |
| Language |
Japanese |
| Title (in Japanese) |
(See Japanese page) |
| Sub Title (in Japanese) |
(See Japanese page) |
| Title (in English) |
60GHz Subharmonic Mixer Module Using Stud Bump Bonding Technology |
| Sub Title (in English) |
|
| Keyword(1) |
millimeter-wave |
| Keyword(2) |
wireless module |
| Keyword(3) |
flip-chip bonding |
| Keyword(4) |
SBB(Stud Bump Bonding) |
| Keyword(5) |
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| Keyword(6) |
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| Keyword(7) |
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| Keyword(8) |
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| 1st Author's Name |
Kohei Masuda |
| 1st Author's Affiliation |
Tohoku University (Tohoku Univ.) |
| 2nd Author's Name |
Futoshi Takeuchi |
| 2nd Author's Affiliation |
Tohoku University (Tohoku Univ.) |
| 3rd Author's Name |
Yasuhiro Hamada |
| 3rd Author's Affiliation |
System Devices Research Laboratories, NEC Corporation (NEC) |
| 4th Author's Name |
Kenichi Maruhashi |
| 4th Author's Affiliation |
System Devices Research Laboratories, NEC Corporation (NEC) |
| 5th Author's Name |
Hiroshi Oguma |
| 5th Author's Affiliation |
Tohoku University (Tohoku Univ.) |
| 6th Author's Name |
Suguru Kameda |
| 6th Author's Affiliation |
Tohoku University (Tohoku Univ.) |
| 7th Author's Name |
Hiroyuki Nakase |
| 7th Author's Affiliation |
Tohoku University (Tohoku Univ.) |
| 8th Author's Name |
Tadashi Takagi |
| 8th Author's Affiliation |
Tohoku University (Tohoku Univ.) |
| 9th Author's Name |
Kazuo Tsubouchi |
| 9th Author's Affiliation |
Tohoku University (Tohoku Univ.) |
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| Speaker |
Author-1 |
| Date Time |
2006-06-27 11:20:00 |
| Presentation Time |
25 minutes |
| Registration for |
MW |
| Paper # |
MW2006-27 |
| Volume (vol) |
vol.106 |
| Number (no) |
no.129 |
| Page |
pp.11-16 |
| #Pages |
6 |
| Date of Issue |
2006-06-20 (MW) |