| Paper Abstract and Keywords |
| Presentation |
2006-06-30 14:25
A Consideration of relation between solbility parameters for polymer material and adhesion
Makito Morii (OMRON) |
| Abstract |
(in Japanese) |
(See Japanese page) |
| (in English) |
The mechanical device combines various materials, and achieves the function. The joint by the oak and bonding is used as the miniaturization of the equipment advances.
As for the joint by bonding, the method of using the adhesive is general. The method of dissolving with the solvent when the object is a polymeric material and making it connect is used. It is difficult to still clarify the true cause though a lot of researches have been performed as for the mechanism of bonding since the past. The author evaluated bonding by using the wet character and the solubility parameter of the material as one parameter that took part in the mechanism of bonding. As a result, it was confirmed that the wet character became excellent in the solvent that in the wet character and the solubility parameter of the resin material the correlations, and approached the solubility parameter, and adhesive power grew, too |
| Keyword |
(in Japanese) |
(See Japanese page) |
| (in English) |
solubility parameter / adhesive / polymer / solvent / resin / wetting parameter / / |
| Reference Info. |
IEICE Tech. Rep., vol. 106, no. 130, EMD2006-10, pp. 29-32, June 2006. |
| Paper # |
EMD2006-10 |
| Date of Issue |
2006-06-23 (EMD, CPM, OME) |
| ISSN |
Print edition: ISSN 0913-5685 |
| Download PDF |
|
| Conference Information |
| Committee |
CPM EMD OME |
| Conference Date |
2006-06-30 - 2006-06-30 |
| Place (in Japanese) |
(See Japanese page) |
| Place (in English) |
Kikai-Shinko-Kaikan Bldg. |
| Topics (in Japanese) |
(See Japanese page) |
| Topics (in English) |
Piezoelectric Devices, Piezoelectric Materials, Ferroelectric Materials, Organic Electronics, etc. (ES Summer Meeting of Materials and Devices) |
| Paper Information |
| Registration To |
EMD |
| Conference Code |
2006-06-CPM-EMD-OME |
| Language |
Japanese |
| Title (in Japanese) |
(See Japanese page) |
| Sub Title (in Japanese) |
(See Japanese page) |
| Title (in English) |
A Consideration of relation between solbility parameters for polymer material and adhesion |
| Sub Title (in English) |
|
| Keyword(1) |
solubility parameter |
| Keyword(2) |
adhesive |
| Keyword(3) |
polymer |
| Keyword(4) |
solvent |
| Keyword(5) |
resin |
| Keyword(6) |
wetting parameter |
| Keyword(7) |
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| Keyword(8) |
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| 1st Author's Name |
Makito Morii |
| 1st Author's Affiliation |
Omron Corporation (OMRON) |
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| Speaker |
Author-1 |
| Date Time |
2006-06-30 14:25:00 |
| Presentation Time |
25 minutes |
| Registration for |
EMD |
| Paper # |
EMD2006-10, CPM2006-34, OME2006-44 |
| Volume (vol) |
vol.106 |
| Number (no) |
no.130(EMD), no.131(CPM), no.132(OME) |
| Page |
pp.29-32 |
| #Pages |
4 |
| Date of Issue |
2006-06-23 (EMD, CPM, OME) |