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Paper Abstract and Keywords
Presentation 2007-06-22 13:00
A study on decoupling characteristic of processor power distribution network
Tomokazu Ikenaga, Satoshi Kazama, Masayuki Shimizu, Naoto Yokoyama (Taiyo Yuden Co.,Ltd) EMCJ2007-24
Abstract (in Japanese) (See Japanese page) 
(in English) We compared characteristics of the transmission line decoupling device and combination of Ta cap and MLCC in the processor power distribution network. We measured frequency characteristics of total impedance including PCB for the evaluation of the total decoupling ability of the circuit board. We confirm that some combination of Ta Cap and MLCC shows better characteristics than transmission line device. We evaluated the amount of change of the voltage at the power distribution network by using the current load change device. From measured results, we found that the power supply ability decreased when we cut the power supply line for mounting device in order to reduce noise. We thought that the current concentrated in the device.
Keyword (in Japanese) (See Japanese page) 
(in English) Decoupling / Load line Impedance / Resistance / High slew rate DC electronic load / Voltage / / /  
Reference Info. IEICE Tech. Rep., vol. 107, no. 107, EMCJ2007-24, pp. 33-38, June 2007.
Paper # EMCJ2007-24 
Date of Issue 2007-06-15 (EMCJ) 
ISSN Print edition: ISSN 0913-5685    Online edition: ISSN 2432-6380
Copyright
and
reproduction		 All rights are reserved and no part of this publication may be reproduced or transmitted in any form or by any means, electronic or mechanical, including photocopy, recording, or any information storage and retrieval system, without permission in writing from the publisher. Notwithstanding, instructors are permitted to photocopy isolated articles for noncommercial classroom use without fee. (License No.: 10GA0019/12GB0052/13GB0056/17GB0034/18GB0034)
Download PDF EMCJ2007-24

Conference Information
Committee EMCJ  
Conference Date 2007-06-22 - 2007-06-22 
Place (in Japanese) (See Japanese page) 
Place (in English) Kikai-Shinko-Kaikan Bldg 
Topics (in Japanese) (See Japanese page) 
Topics (in English)  
Paper Information
Registration To EMCJ 
Conference Code 2007-06-EMCJ 
Language Japanese 
Title (in Japanese) (See Japanese page) 
Sub Title (in Japanese) (See Japanese page) 
Title (in English) A study on decoupling characteristic of processor power distribution network 
Sub Title (in English)  
Keyword(1) Decoupling  
Keyword(2) Load line Impedance  
Keyword(3) Resistance  
Keyword(4) High slew rate DC electronic load  
Keyword(5) Voltage  
Keyword(6)  
Keyword(7)  
Keyword(8)  
1st Author's Name Tomokazu Ikenaga  
1st Author's Affiliation Taiyo Yuden Corporation (Taiyo Yuden Co.,Ltd)
2nd Author's Name Satoshi Kazama  
2nd Author's Affiliation Taiyo Yuden Corporation (Taiyo Yuden Co.,Ltd)
3rd Author's Name Masayuki Shimizu  
3rd Author's Affiliation Taiyo Yuden Corporation (Taiyo Yuden Co.,Ltd)
4th Author's Name Naoto Yokoyama  
4th Author's Affiliation Taiyo Yuden Corporation (Taiyo Yuden Co.,Ltd)
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Speaker Author-1 
Date Time 2007-06-22 13:00:00 
Presentation Time 25 minutes 
Registration for EMCJ 
Paper # EMCJ2007-24 
Volume (vol) vol.107 
Number (no) no.107 
Page pp.33-38 
#Pages 6 
Date of Issue 2007-06-15 (EMCJ) 

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