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Paper Abstract and Keywords
Presentation 2007-09-27 17:30
[Special Talk] Issues for the Jisso (Electronic Packaging) Technology to accommodate Electronic Equipments to Comfortable World
Hidetaka Hayashi (School of Engineering the University of Tokyo) CQ2007-53 OIS2007-43 IE2007-50
Abstract (in Japanese) (See Japanese page) 
(in English) Nowadays we are facing to the environmental impact caused by electronic products that had been useful products as explosively aspiring ownership and explosive consumption of them. What is the key issue and evolution for Jisso technology as the basic technology to produce electronic hardware to keep global environment to be safe and comfortable? A lot of work has been done including legal system preparation to provide (1) proper countermeasure for toxic substances, (2) saving energy during both production process, usage and discarding, (3) recycling and saving resources. This article reviews the above work and claims that the view on the population trend and purchasing pressure of under developing countries should be more focused for the future work.
Keyword (in Japanese) (See Japanese page) 
(in English) Eco-Design / Recycling Sociey / Dematerialization / EPR / Global Warming / World Population Increase / EU directives / UEEE  
Reference Info. IEICE Tech. Rep., vol. 107, no. 229, CQ2007-53, pp. 95-100, Sept. 2007.
Paper # CQ2007-53 
Date of Issue 2007-09-20 (CQ, OIS, IE) 
ISSN Print edition: ISSN 0913-5685    Online edition: ISSN 2432-6380
Copyright
and
reproduction		 All rights are reserved and no part of this publication may be reproduced or transmitted in any form or by any means, electronic or mechanical, including photocopy, recording, or any information storage and retrieval system, without permission in writing from the publisher. Notwithstanding, instructors are permitted to photocopy isolated articles for noncommercial classroom use without fee. (License No.: 10GA0019/12GB0052/13GB0056/17GB0034/18GB0034)
Download PDF CQ2007-53 OIS2007-43 IE2007-50

Conference Information
Committee CQ LOIS IE IEE-CMN ITE-ME  
Conference Date 2007-09-27 - 2007-09-28 
Place (in Japanese) (See Japanese page) 
Place (in English) The university of Tokushima 
Topics (in Japanese) (See Japanese page) 
Topics (in English) Multimedia communication, multimedia system, IP broadcast/video transmission, etc 
Paper Information
Registration To CQ 
Conference Code 2007-09-CQ-OIS-IE-IEE-CMN-ITE-ME 
Language Japanese 
Title (in Japanese) (See Japanese page) 
Sub Title (in Japanese) (See Japanese page) 
Title (in English) Issues for the Jisso (Electronic Packaging) Technology to accommodate Electronic Equipments to Comfortable World 
Sub Title (in English)  
Keyword(1) Eco-Design  
Keyword(2) Recycling Sociey  
Keyword(3) Dematerialization  
Keyword(4) EPR  
Keyword(5) Global Warming  
Keyword(6) World Population Increase  
Keyword(7) EU directives  
Keyword(8) UEEE  
1st Author's Name Hidetaka Hayashi  
1st Author's Affiliation School of Engineering the University of Tokyo (School of Engineering the University of Tokyo)
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Speaker Author-1 
Date Time 2007-09-27 17:30:00 
Presentation Time 55 minutes 
Registration for CQ 
Paper # CQ2007-53, OIS2007-43, IE2007-50 
Volume (vol) vol.107 
Number (no) no.229(CQ), no.230(OIS), no.231(IE) 
Page pp.95-100 
#Pages 6 
Date of Issue 2007-09-20 (CQ, OIS, IE) 

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