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Paper Abstract and Keywords
Presentation 2007-10-30 15:00
Impact of Shear Strain and Quantum Confinement on <110> Channel nMOSFET with High-Stress CESL
Hiroyuki Takashino, Takeshi Okagaki, Tetsuya Uchida, Takashi Hayashi, Motoaki Tanizawa, Eiji Tsukuda, Katsumi Eikyu, Shoji Wakahara, Kiyoshi Ishikawa, Osamu Tsuchiya, Yasuo Inoue (Renesas Technology Corp.) VLD2007-57 SDM2007-201 Link to ES Tech. Rep. Archives: SDM2007-201
Abstract (in Japanese) (See Japanese page) 
(in English) Numerical study in conjunction with comprehensive bending
experiments has demonstrated that \orientation{100}-Si has the optimum
channel direction along <110> in terms of the device performance
of strained 65nm-node nMOSFETs with Contact Etch Stop Layer (CESL),
and that both
the shear strain component and the quantum confinement effect play an
important role in this superiority.
Keyword (in Japanese) (See Japanese page) 
(in English) Shear Strain / Quantum Confinement Effect / CESL / Drift-Diffusion Simulator / / / /  
Reference Info. IEICE Tech. Rep., vol. 107, no. 297, SDM2007-201, pp. 33-36, Oct. 2007.
Paper # SDM2007-201 
Date of Issue 2007-10-23 (VLD, SDM) 
ISSN Print edition: ISSN 0913-5685    Online edition: ISSN 2432-6380
Copyright
and
reproduction
All rights are reserved and no part of this publication may be reproduced or transmitted in any form or by any means, electronic or mechanical, including photocopy, recording, or any information storage and retrieval system, without permission in writing from the publisher. Notwithstanding, instructors are permitted to photocopy isolated articles for noncommercial classroom use without fee. (License No.: 10GA0019/12GB0052/13GB0056/17GB0034/18GB0034)
Download PDF VLD2007-57 SDM2007-201 Link to ES Tech. Rep. Archives: SDM2007-201

Conference Information
Committee SDM VLD  
Conference Date 2007-10-30 - 2007-10-31 
Place (in Japanese) (See Japanese page) 
Place (in English) Kikai-Shinko-Kaikan Bldg. 
Topics (in Japanese) (See Japanese page) 
Topics (in English) Process, Device, Circuit Simulation, etc. 
Paper Information
Registration To SDM 
Conference Code 2007-10-SDM-VLD 
Language Japanese 
Title (in Japanese) (See Japanese page) 
Sub Title (in Japanese) (See Japanese page) 
Title (in English) Impact of Shear Strain and Quantum Confinement on <110> Channel nMOSFET with High-Stress CESL 
Sub Title (in English)  
Keyword(1) Shear Strain  
Keyword(2) Quantum Confinement Effect  
Keyword(3) CESL  
Keyword(4) Drift-Diffusion Simulator  
Keyword(5)  
Keyword(6)  
Keyword(7)  
Keyword(8)  
1st Author's Name Hiroyuki Takashino  
1st Author's Affiliation Renesas Technology Corporation (Renesas Technology Corp.)
2nd Author's Name Takeshi Okagaki  
2nd Author's Affiliation Renesas Technology Corporation (Renesas Technology Corp.)
3rd Author's Name Tetsuya Uchida  
3rd Author's Affiliation Renesas Technology Corporation (Renesas Technology Corp.)
4th Author's Name Takashi Hayashi  
4th Author's Affiliation Renesas Technology Corporation (Renesas Technology Corp.)
5th Author's Name Motoaki Tanizawa  
5th Author's Affiliation Renesas Technology Corporation (Renesas Technology Corp.)
6th Author's Name Eiji Tsukuda  
6th Author's Affiliation Renesas Technology Corporation (Renesas Technology Corp.)
7th Author's Name Katsumi Eikyu  
7th Author's Affiliation Renesas Technology Corporation (Renesas Technology Corp.)
8th Author's Name Shoji Wakahara  
8th Author's Affiliation Renesas Technology Corporation (Renesas Technology Corp.)
9th Author's Name Kiyoshi Ishikawa  
9th Author's Affiliation Renesas Technology Corporation (Renesas Technology Corp.)
10th Author's Name Osamu Tsuchiya  
10th Author's Affiliation Renesas Technology Corporation (Renesas Technology Corp.)
11th Author's Name Yasuo Inoue  
11th Author's Affiliation Renesas Technology Corporation (Renesas Technology Corp.)
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Speaker Author-1 
Date Time 2007-10-30 15:00:00 
Presentation Time 25 minutes 
Registration for SDM 
Paper # VLD2007-57, SDM2007-201 
Volume (vol) vol.107 
Number (no) no.295(VLD), no.297(SDM) 
Page pp.33-36 
#Pages
Date of Issue 2007-10-23 (VLD, SDM) 


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