| Paper Abstract and Keywords |
| Presentation |
2008-06-14 09:00
InP HEMT device technology for ultra-high-speed MMIC Naoki Hara, Tsuyoshi Takahashi, Kozo Makiyama (Fujitsu), Toshihiro Ohki (Fujitsu Lab) ED2008-32 |
| Abstract |
(in Japanese) |
(See Japanese page) |
| (in English) |
We have developed InP-based HEMT technology suitable for fabricating ultra-high-speed MMIC. Scaling of both vertical and lateral directions was investigated for enhancing transconductance, which enables us to realize high-speed characteristics without ultra-short-length gate electrodes. Parasitic capacitance originated from interlayer dielectric film for interconnection was reduced by using cavity structure, which was formed by removing the interlayer dielectric film around the gate electrodes. We successfully fabricated 45-nm gate InP HEMT with a cut-off frequency of 517 GHz by employing the above technologies. |
| Keyword |
(in Japanese) |
(See Japanese page) |
| (in English) |
MMIC / InP-based HEMT / millimeter wave / scaling / cavity structure / / / |
| Reference Info. |
IEICE Tech. Rep., vol. 108, no. 87, ED2008-32, pp. 55-60, June 2008. |
| Paper # |
ED2008-32 |
| Date of Issue |
2008-06-06 (ED) |
| ISSN |
Print edition: ISSN 0913-5685 Online edition: ISSN 2432-6380 |
Copyright and reproduction |
All rights are reserved and no part of this publication may be reproduced or transmitted in any form or by any means, electronic or mechanical, including photocopy, recording, or any information storage and retrieval system, without permission in writing from the publisher. Notwithstanding, instructors are permitted to photocopy isolated articles for noncommercial classroom use without fee. (License No.: 10GA0019/12GB0052/13GB0056/17GB0034/18GB0034) |
| Download PDF |
ED2008-32 |
| Conference Information |
| Committee |
ED |
| Conference Date |
2008-06-13 - 2008-06-14 |
| Place (in Japanese) |
(See Japanese page) |
| Place (in English) |
Kanazawa University |
| Topics (in Japanese) |
(See Japanese page) |
| Topics (in English) |
Process and device technology od semiconductors (surface, interface, reliability, etc.) |
| Paper Information |
| Registration To |
ED |
| Conference Code |
2008-06-ED |
| Language |
Japanese |
| Title (in Japanese) |
(See Japanese page) |
| Sub Title (in Japanese) |
(See Japanese page) |
| Title (in English) |
InP HEMT device technology for ultra-high-speed MMIC |
| Sub Title (in English) |
|
| Keyword(1) |
MMIC |
| Keyword(2) |
InP-based HEMT |
| Keyword(3) |
millimeter wave |
| Keyword(4) |
scaling |
| Keyword(5) |
cavity structure |
| Keyword(6) |
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| Keyword(7) |
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| Keyword(8) |
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| 1st Author's Name |
Naoki Hara |
| 1st Author's Affiliation |
Fujitsu Ltd. (Fujitsu) |
| 2nd Author's Name |
Tsuyoshi Takahashi |
| 2nd Author's Affiliation |
Fujitsu Ltd. (Fujitsu) |
| 3rd Author's Name |
Kozo Makiyama |
| 3rd Author's Affiliation |
Fujitsu Ltd. (Fujitsu) |
| 4th Author's Name |
Toshihiro Ohki |
| 4th Author's Affiliation |
Fujitsu Laboratories Ltd. (Fujitsu Lab) |
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| Speaker |
Author-1 |
| Date Time |
2008-06-14 09:00:00 |
| Presentation Time |
25 minutes |
| Registration for |
ED |
| Paper # |
ED2008-32 |
| Volume (vol) |
vol.108 |
| Number (no) |
no.87 |
| Page |
pp.55-60 |
| #Pages |
6 |
| Date of Issue |
2008-06-06 (ED) |