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| 講演名 | 2008-11-15 17:40 The Numerical Thermal Analysis for Electromechanical Relay Li Zhenbiao・Zheng Bicheng・He Zhengjie（Huazhong Univ. of Science & Tech.）・○Makoto Hasegawa（Chitose Inst. of Science Tech.）  EMD2008-85 |
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| 抄録 | （和） | The thermal analysis is becoming more and more important with the development of miniaturization of electromechanical relay. In this paper the transient temperature field in the selected relay was simulated at the switching operation duration 3s on and 3s off, and the effect of convection and radiation are studied. The result shows that convection and radiation have little effect on temperature rise in short time (less operations) but become more and more important with the heating time going. Convection is more effective for temperature change than radiation |
| （英） | The thermal analysis is becoming more and more important with the development of miniaturization of electromechanical relay. In this paper the transient temperature field in the selected relay was simulated at the switching operation duration 3s on and 3s off, and the effect of convection and radiation are studied. The result shows that convection and radiation have little effect on temperature rise in short time (less operations) but become more and more important with the heating time going. Convection is more effective for temperature change than radiation | |
| キーワード | （和） | Relay / Transient Temperature Field / Heat Conduction / Radiation / Convection / / / |
| （英） | Relay / Transient Temperature Field / Heat Conduction / Radiation / Convection / / / | |
| 文献情報 | 信学技報, vol. 108, no. 296, EMD2008-85, pp. 81-84, 2008年11月. | |
| 資料番号 | EMD2008-85 | |
| 発行日 | 2008-11-08 (EMD) | |
| ISSN | Print edition: ISSN 0913-5685 Online edition: ISSN 2432-6380 | |
| 著作権に ついて |
技術研究報告に掲載された論文の著作権は電子情報通信学会に帰属します．(許諾番号：10GA0019/12GB0052/13GB0056/17GB0034/18GB0034) | |
| PDFダウンロード | EMD2008-85 |
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