Paper Abstract and Keywords |
Presentation |
2008-11-15 13:40
Study on A Novel Method of Accelerated Life Test for Relay Reliability Shujuan Wang, Qiong Yu, Li Ren (Harbin Inst. of Tech.) EMD2008-75 Link to ES Tech. Rep. Archives: EMD2008-75 |
Abstract |
(in Japanese) |
(See Japanese page) |
(in English) |
Electrical life is an important parameter to estimate the reliability of relay. Non-closing and Non-opening caused by arc erosion and/or material transfer are two primary contact failure modes in relay. Load current has great influence on the two modes and the life of relay. In this paper, load current stress accelerated life tests were carried out by a life test system designed for relay. During life test, the characteristic parameters such as contact resistance, closing time and opening time of the relay were measured for each operation to identify if the relay samples failed or not, thus the mechanisms and the modes of contact failures were determined. In addition, A Weibull statistical analysis was adopted to check the consistency of failure mechanisms under different load current stress. Finally, a statistical model for estimating the life during DC load current stress and investigating the acceleration factors of high current stresses was built. |
Keyword |
(in Japanese) |
(See Japanese page) |
(in English) |
Relays / Accelerated life test / Load current stress / Reliability estimation / / / / |
Reference Info. |
IEICE Tech. Rep., vol. 108, no. 296, EMD2008-75, pp. 41-44, Nov. 2008. |
Paper # |
EMD2008-75 |
Date of Issue |
2008-11-08 (EMD) |
ISSN |
Print edition: ISSN 0913-5685 Online edition: ISSN 2432-6380 |
Copyright and reproduction |
All rights are reserved and no part of this publication may be reproduced or transmitted in any form or by any means, electronic or mechanical, including photocopy, recording, or any information storage and retrieval system, without permission in writing from the publisher. Notwithstanding, instructors are permitted to photocopy isolated articles for noncommercial classroom use without fee. (License No.: 10GA0019/12GB0052/13GB0056/17GB0034/18GB0034) |
Download PDF |
EMD2008-75 Link to ES Tech. Rep. Archives: EMD2008-75 |
Conference Information |
Committee |
EMD |
Conference Date |
2008-11-15 - 2008-11-16 |
Place (in Japanese) |
(See Japanese page) |
Place (in English) |
Tohoku Bunka Gakuin University (Sendai) |
Topics (in Japanese) |
(See Japanese page) |
Topics (in English) |
International Session on Electro-Mechanical Devices 2008 |
Paper Information |
Registration To |
EMD |
Conference Code |
2008-11-EMD |
Language |
English |
Title (in Japanese) |
(See Japanese page) |
Sub Title (in Japanese) |
(See Japanese page) |
Title (in English) |
Study on A Novel Method of Accelerated Life Test for Relay Reliability |
Sub Title (in English) |
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Keyword(1) |
Relays |
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Accelerated life test |
Keyword(3) |
Load current stress |
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Reliability estimation |
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1st Author's Name |
Shujuan Wang |
1st Author's Affiliation |
Harbin Institute Of Technology (Harbin Inst. of Tech.) |
2nd Author's Name |
Qiong Yu |
2nd Author's Affiliation |
Harbin Institute Of Technology (Harbin Inst. of Tech.) |
3rd Author's Name |
Li Ren |
3rd Author's Affiliation |
Harbin Institute Of Technology (Harbin Inst. of Tech.) |
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Speaker |
Author-2 |
Date Time |
2008-11-15 13:40:00 |
Presentation Time |
20 minutes |
Registration for |
EMD |
Paper # |
EMD2008-75 |
Volume (vol) |
vol.108 |
Number (no) |
no.296 |
Page |
pp.41-44 |
#Pages |
4 |
Date of Issue |
2008-11-08 (EMD) |