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Paper Abstract and Keywords
Presentation 2008-11-15 13:40
Study on A Novel Method of Accelerated Life Test for Relay Reliability
Shujuan Wang, Qiong Yu, Li Ren (Harbin Inst. of Tech.) EMD2008-75 Link to ES Tech. Rep. Archives: EMD2008-75
Abstract (in Japanese) (See Japanese page) 
(in English) Electrical life is an important parameter to estimate the reliability of relay. Non-closing and Non-opening caused by arc erosion and/or material transfer are two primary contact failure modes in relay. Load current has great influence on the two modes and the life of relay. In this paper, load current stress accelerated life tests were carried out by a life test system designed for relay. During life test, the characteristic parameters such as contact resistance, closing time and opening time of the relay were measured for each operation to identify if the relay samples failed or not, thus the mechanisms and the modes of contact failures were determined. In addition, A Weibull statistical analysis was adopted to check the consistency of failure mechanisms under different load current stress. Finally, a statistical model for estimating the life during DC load current stress and investigating the acceleration factors of high current stresses was built.
Keyword (in Japanese) (See Japanese page) 
(in English) Relays / Accelerated life test / Load current stress / Reliability estimation / / / /  
Reference Info. IEICE Tech. Rep., vol. 108, no. 296, EMD2008-75, pp. 41-44, Nov. 2008.
Paper # EMD2008-75 
Date of Issue 2008-11-08 (EMD) 
ISSN Print edition: ISSN 0913-5685    Online edition: ISSN 2432-6380
Copyright
and
reproduction
All rights are reserved and no part of this publication may be reproduced or transmitted in any form or by any means, electronic or mechanical, including photocopy, recording, or any information storage and retrieval system, without permission in writing from the publisher. Notwithstanding, instructors are permitted to photocopy isolated articles for noncommercial classroom use without fee. (License No.: 10GA0019/12GB0052/13GB0056/17GB0034/18GB0034)
Download PDF EMD2008-75 Link to ES Tech. Rep. Archives: EMD2008-75

Conference Information
Committee EMD  
Conference Date 2008-11-15 - 2008-11-16 
Place (in Japanese) (See Japanese page) 
Place (in English) Tohoku Bunka Gakuin University (Sendai) 
Topics (in Japanese) (See Japanese page) 
Topics (in English) International Session on Electro-Mechanical Devices 2008 
Paper Information
Registration To EMD 
Conference Code 2008-11-EMD 
Language English 
Title (in Japanese) (See Japanese page) 
Sub Title (in Japanese) (See Japanese page) 
Title (in English) Study on A Novel Method of Accelerated Life Test for Relay Reliability 
Sub Title (in English)  
Keyword(1) Relays  
Keyword(2) Accelerated life test  
Keyword(3) Load current stress  
Keyword(4) Reliability estimation  
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1st Author's Name Shujuan Wang  
1st Author's Affiliation Harbin Institute Of Technology (Harbin Inst. of Tech.)
2nd Author's Name Qiong Yu  
2nd Author's Affiliation Harbin Institute Of Technology (Harbin Inst. of Tech.)
3rd Author's Name Li Ren  
3rd Author's Affiliation Harbin Institute Of Technology (Harbin Inst. of Tech.)
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Speaker Author-2 
Date Time 2008-11-15 13:40:00 
Presentation Time 20 minutes 
Registration for EMD 
Paper # EMD2008-75 
Volume (vol) vol.108 
Number (no) no.296 
Page pp.41-44 
#Pages
Date of Issue 2008-11-08 (EMD) 


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