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Paper Abstract and Keywords
Presentation 2008-11-16 09:20
Prediction of resistance of electrical contact with plated layer(2) -- Contact area by FEM analysis --
Kaori Shimizu (AutoNetworks Technologies, Ltd.), Shigeki Shimada (Sumitomo Electric Industries, Ltd.), Shigeru Sawada, Yasuhiro Hattori (AutoNetworks Technologies, Ltd.) EMD2008-89 Link to ES Tech. Rep. Archives: EMD2008-89
Abstract (in Japanese) (See Japanese page) 
(in English) Electrical contacts are the most important parts of electrical circuits, and many reliability problems of the circuits are related to contact failure. The contact resistance is one of the important factors for assessing connector reliability, and thus the prediction of contact resistance is essential to designing electrical terminals. In this study, embossments, each 1mm to 3 mm in radius, were brought into contact with flat planes to simulate the point of contact on a terminal, and the contact resistance was measured using a four-probe method under the load up to 40N. Copper alloy samples, each plated with tin or silver and having an embossment 1mm to 3mm in radius, were used and the visually clear indentations resulting from the embossment to plane contact were measured to determine their areas.
Since the contact resistance is dependent on the contact area, an FEM analysis must be carried out to determine the contact areas correctly. In this paper, an elasto-plastic FEM analysis was performed taking the plating layers into account and a method was established to make precise determination of the contact areas for different shapes of contacts and loads. The resultant contact areas were used to calculate the contact resistance, which showed a good agreement with experimental results. It was established that the load-resistance curves can be predicted on the basis of the shapes of the contacts as well as plating.
Keyword (in Japanese) (See Japanese page) 
(in English) electrical contact / contact resistance / plating / contact load / FEM analysis / / /  
Reference Info. IEICE Tech. Rep., vol. 108, no. 296, EMD2008-89, pp. 97-100, Nov. 2008.
Paper # EMD2008-89 
Date of Issue 2008-11-08 (EMD) 
ISSN Print edition: ISSN 0913-5685    Online edition: ISSN 2432-6380
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All rights are reserved and no part of this publication may be reproduced or transmitted in any form or by any means, electronic or mechanical, including photocopy, recording, or any information storage and retrieval system, without permission in writing from the publisher. Notwithstanding, instructors are permitted to photocopy isolated articles for noncommercial classroom use without fee. (License No.: 10GA0019/12GB0052/13GB0056/17GB0034/18GB0034)
Download PDF EMD2008-89 Link to ES Tech. Rep. Archives: EMD2008-89

Conference Information
Committee EMD  
Conference Date 2008-11-15 - 2008-11-16 
Place (in Japanese) (See Japanese page) 
Place (in English) Tohoku Bunka Gakuin University (Sendai) 
Topics (in Japanese) (See Japanese page) 
Topics (in English) International Session on Electro-Mechanical Devices 2008 
Paper Information
Registration To EMD 
Conference Code 2008-11-EMD 
Language English (Japanese title is available) 
Title (in Japanese) (See Japanese page) 
Sub Title (in Japanese) (See Japanese page) 
Title (in English) Prediction of resistance of electrical contact with plated layer(2) 
Sub Title (in English) Contact area by FEM analysis 
Keyword(1) electrical contact  
Keyword(2) contact resistance  
Keyword(3) plating  
Keyword(4) contact load  
Keyword(5) FEM analysis  
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1st Author's Name Kaori Shimizu  
1st Author's Affiliation AutoNetworks Technologies, Ltd. (AutoNetworks Technologies, Ltd.)
2nd Author's Name Shigeki Shimada  
2nd Author's Affiliation Sumitomo Electric Industries, Ltd. (Sumitomo Electric Industries, Ltd.)
3rd Author's Name Shigeru Sawada  
3rd Author's Affiliation AutoNetworks Technologies, Ltd. (AutoNetworks Technologies, Ltd.)
4th Author's Name Yasuhiro Hattori  
4th Author's Affiliation AutoNetworks Technologies, Ltd. (AutoNetworks Technologies, Ltd.)
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Speaker Author-1 
Date Time 2008-11-16 09:20:00 
Presentation Time 20 minutes 
Registration for EMD 
Paper # EMD2008-89 
Volume (vol) vol.108 
Number (no) no.296 
Page pp.97-100 
#Pages
Date of Issue 2008-11-08 (EMD) 


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