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Paper Abstract and Keywords
Presentation 2009-01-21 14:50
Development of a novel silicone compound with high thermal endurance
Hiroaki Cho, Fumito Sano, Shuhei Nakamura (Mie Univ.), Kazuyo Miyata (Japan Scie and Tech Agence Plaza Tokai), Wataru Shimizu, Yasushi Murakami (Shinshu Univ.) OME2008-90
Abstract (in Japanese) (See Japanese page) 
(in English) Poly(dimethylsiloxane) (PDMS) is a base polymer of silicone compound which used, for example, as sealants, adhesives or coatings for long term use because of being stable at high and low temperatures and a good weatherproof. Generally, silicone compounds are consisted of the base polymer, cross-linking agents, curing agents and fillers. In order to vulcanize the silicone compound, tin compound are normally used. But they are apt to promote the thermal degradation of silicone compounds in service, leading to a shorter lifetime of them. It has been found that the use of an organic additive instead of tin compound suppresses the thermal degradation of silicone compounds.
Keyword (in Japanese) (See Japanese page) 
(in English) poly(dimethylsiloxane) / thermal degradation / tin compound / organic additive / / / /  
Reference Info. IEICE Tech. Rep., vol. 108, no. 387, OME2008-90, pp. 43-48, Jan. 2009.
Paper # OME2008-90 
Date of Issue 2009-01-14 (OME) 
ISSN Print edition: ISSN 0913-5685    Online edition: ISSN 2432-6380
Copyright
and
reproduction		 All rights are reserved and no part of this publication may be reproduced or transmitted in any form or by any means, electronic or mechanical, including photocopy, recording, or any information storage and retrieval system, without permission in writing from the publisher. Notwithstanding, instructors are permitted to photocopy isolated articles for noncommercial classroom use without fee. (License No.: 10GA0019/12GB0052/13GB0056/17GB0034/18GB0034)
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Conference Information
Committee OME  
Conference Date 2009-01-21 - 2009-01-21 
Place (in Japanese) (See Japanese page) 
Place (in English) Ｎａｇｏｙａ Ｕｎｉｖ． 
Topics (in Japanese) (See Japanese page) 
Topics (in English)  
Paper Information
Registration To OME 
Conference Code 2009-01-OME 
Language Japanese 
Title (in Japanese) (See Japanese page) 
Sub Title (in Japanese) (See Japanese page) 
Title (in English) Development of a novel silicone compound with high thermal endurance 
Sub Title (in English)  
Keyword(1) poly(dimethylsiloxane)  
Keyword(2) thermal degradation  
Keyword(3) tin compound  
Keyword(4) organic additive  
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1st Author's Name Hiroaki Cho  
1st Author's Affiliation Mie University (Mie Univ.)
2nd Author's Name Fumito Sano  
2nd Author's Affiliation Mie University (Mie Univ.)
3rd Author's Name Shuhei Nakamura  
3rd Author's Affiliation Mie University (Mie Univ.)
4th Author's Name Kazuyo Miyata  
4th Author's Affiliation Japan Science and Technology Agency Plaza Tokai (Japan Scie and Tech Agence Plaza Tokai)
5th Author's Name Wataru Shimizu  
5th Author's Affiliation Shinshu University (Shinshu Univ.)
6th Author's Name Yasushi Murakami  
6th Author's Affiliation Shinshu University (Shinshu Univ.)
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Speaker Author-1 
Date Time 2009-01-21 14:50:00 
Presentation Time 25 minutes 
Registration for OME 
Paper # OME2008-90 
Volume (vol) vol.108 
Number (no) no.387 
Page pp.43-48 
#Pages 6 
Date of Issue 2009-01-14 (OME) 

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