IEICE Technical Committee Submission System
Conference Paper's Information
Online Proceedings
[Sign in]
Tech. Rep. Archives
 Go Top Page Go Previous   [Japanese] / [English] 

Paper Abstract and Keywords
Presentation 2009-01-23 14:15
High Density Multi-Fiber Connector for Optical Interconnection
Naoya Nishimura, Katsuki Suematsu, Masao Shinoda, Masato Shiino (The Furukawa Electric Co. Ltd.,) EMD2008-114 Link to ES Tech. Rep. Archives: EMD2008-114
Abstract (in Japanese) (See Japanese page) 
(in English) The performance limits of electrical interconnection in such equipment as servers and routers comes to be discussed, and optical interconnection technology is drawing attention. In this paper, compact multi-fiber ferrule μ-Joint ® will be presented, along with MU-type plug and backplane connector, both based on μ-Joint in anticipation of application to optical interconnection, optical high-density multi-fiber connectors. The μ-Joint has a cross section about one quarter of conventional MT ferrule, so that it allows for high-density mounting with a low insertion loss of 0.5 dB or lower. Tests in conformity to Telcordia GR-1435-CORE have been carried out to confirm that the ferrule has high long-term reliability.
Keyword (in Japanese) (See Japanese page) 
(in English) Optical Interconnection / Multi-Fiber Connectors / Backplane / / / / /  
Reference Info. IEICE Tech. Rep., vol. 108, no. 404, EMD2008-114, pp. 5-9, Jan. 2009.
Paper # EMD2008-114 
Date of Issue 2009-01-16 (EMD) 
ISSN Print edition: ISSN 0913-5685    Online edition: ISSN 2432-6380
Copyright
and
reproduction
All rights are reserved and no part of this publication may be reproduced or transmitted in any form or by any means, electronic or mechanical, including photocopy, recording, or any information storage and retrieval system, without permission in writing from the publisher. Notwithstanding, instructors are permitted to photocopy isolated articles for noncommercial classroom use without fee. (License No.: 10GA0019/12GB0052/13GB0056/17GB0034/18GB0034)
Download PDF EMD2008-114 Link to ES Tech. Rep. Archives: EMD2008-114

Conference Information
Committee EMD  
Conference Date 2009-01-23 - 2009-01-23 
Place (in Japanese) (See Japanese page) 
Place (in English)  
Topics (in Japanese) (See Japanese page) 
Topics (in English)  
Paper Information
Registration To EMD 
Conference Code 2009-01-EMD 
Language Japanese 
Title (in Japanese) (See Japanese page) 
Sub Title (in Japanese) (See Japanese page) 
Title (in English) High Density Multi-Fiber Connector for Optical Interconnection 
Sub Title (in English)  
Keyword(1) Optical Interconnection  
Keyword(2) Multi-Fiber Connectors  
Keyword(3) Backplane  
Keyword(4)  
Keyword(5)  
Keyword(6)  
Keyword(7)  
Keyword(8)  
1st Author's Name Naoya Nishimura  
1st Author's Affiliation The Furukawa Electric Co., Ltd. (The Furukawa Electric Co. Ltd.,)
2nd Author's Name Katsuki Suematsu  
2nd Author's Affiliation The Furukawa Electric Co., Ltd. (The Furukawa Electric Co. Ltd.,)
3rd Author's Name Masao Shinoda  
3rd Author's Affiliation The Furukawa Electric Co., Ltd. (The Furukawa Electric Co. Ltd.,)
4th Author's Name Masato Shiino  
4th Author's Affiliation The Furukawa Electric Co., Ltd. (The Furukawa Electric Co. Ltd.,)
5th Author's Name  
5th Author's Affiliation ()
6th Author's Name  
6th Author's Affiliation ()
7th Author's Name  
7th Author's Affiliation ()
8th Author's Name  
8th Author's Affiliation ()
9th Author's Name  
9th Author's Affiliation ()
10th Author's Name  
10th Author's Affiliation ()
11th Author's Name  
11th Author's Affiliation ()
12th Author's Name  
12th Author's Affiliation ()
13th Author's Name  
13th Author's Affiliation ()
14th Author's Name  
14th Author's Affiliation ()
15th Author's Name  
15th Author's Affiliation ()
16th Author's Name  
16th Author's Affiliation ()
17th Author's Name  
17th Author's Affiliation ()
18th Author's Name  
18th Author's Affiliation ()
19th Author's Name  
19th Author's Affiliation ()
20th Author's Name  
20th Author's Affiliation ()
Speaker Author-1 
Date Time 2009-01-23 14:15:00 
Presentation Time 25 minutes 
Registration for EMD 
Paper # EMD2008-114 
Volume (vol) vol.108 
Number (no) no.404 
Page pp.5-9 
#Pages
Date of Issue 2009-01-16 (EMD) 


[Return to Top Page]

[Return to IEICE Web Page]


The Institute of Electronics, Information and Communication Engineers (IEICE), Japan