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Paper Abstract and Keywords
Presentation 2009-06-05 14:50
Study for extracting the characteristics of LSI power supply at high frequency including the parasitic coupling between package and chip
Tomohiro Kita, Yuichi Mabuchi, Hiroshi Tanaka, Takashi Hisakado, Osami Wada (Kyoto Univ.), Atsushi Nakamura (Renesas Tech.) EMCJ2009-31
Abstract (in Japanese) (See Japanese page) 
(in English) To establish more efficient EMC designing method of electronic apparatuses, constructing a precise EMC macromodel of IC/LSI power supply blocks is needed for simulation of noise levels of current flowing through
the power distribution networks. For modeling in GHz frequency range, the characteristics between a chip and its package, or a package and a PCB should be considered. In this report, the impedance characteristics of a chip mounted on a BGA package is evaluated based on bare-chip characteristics extracted by measurement, package parameters identified by numerical simulation, and the estimated value of capacitance existing between the silicon die and the package plane. Good agreement between simulation and measurement is obtained up to about 4 GHz.
Keyword (in Japanese) (See Japanese page) 
(in English) LSI package / EMC macromodel / chip-package co-design / parasitic capacitance / LSI power distribution network / / /  
Reference Info. IEICE Tech. Rep., vol. 109, no. 76, EMCJ2009-31, pp. 51-56, June 2009.
Paper # EMCJ2009-31 
Date of Issue 2009-05-29 (EMCJ) 
ISSN Print edition: ISSN 0913-5685    Online edition: ISSN 2432-6380
Copyright
and
reproduction		 All rights are reserved and no part of this publication may be reproduced or transmitted in any form or by any means, electronic or mechanical, including photocopy, recording, or any information storage and retrieval system, without permission in writing from the publisher. Notwithstanding, instructors are permitted to photocopy isolated articles for noncommercial classroom use without fee. (License No.: 10GA0019/12GB0052/13GB0056/17GB0034/18GB0034)
Download PDF EMCJ2009-31

Conference Information
Committee EMCJ  
Conference Date 2009-06-05 - 2009-06-05 
Place (in Japanese) (See Japanese page) 
Place (in English) Tokyo Big Sight (Tokyo International Exihibition Center) 
Topics (in Japanese) (See Japanese page) 
Topics (in English) Young Scientists Award for Excellent Presentations 
Paper Information
Registration To EMCJ 
Conference Code 2009-06-EMCJ 
Language Japanese 
Title (in Japanese) (See Japanese page) 
Sub Title (in Japanese) (See Japanese page) 
Title (in English) Study for extracting the characteristics of LSI power supply at high frequency including the parasitic coupling between package and chip 
Sub Title (in English)  
Keyword(1) LSI package  
Keyword(2) EMC macromodel  
Keyword(3) chip-package co-design  
Keyword(4) parasitic capacitance  
Keyword(5) LSI power distribution network  
Keyword(6)  
Keyword(7)  
Keyword(8)  
1st Author's Name Tomohiro Kita  
1st Author's Affiliation Kyoto University (Kyoto Univ.)
2nd Author's Name Yuichi Mabuchi  
2nd Author's Affiliation Kyoto University (Kyoto Univ.)
3rd Author's Name Hiroshi Tanaka  
3rd Author's Affiliation Kyoto University (Kyoto Univ.)
4th Author's Name Takashi Hisakado  
4th Author's Affiliation Kyoto University (Kyoto Univ.)
5th Author's Name Osami Wada  
5th Author's Affiliation Kyoto University (Kyoto Univ.)
6th Author's Name Atsushi Nakamura  
6th Author's Affiliation Renesas Technology Corp. (Renesas Tech.)
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Speaker Author-1 
Date Time 2009-06-05 14:50:00 
Presentation Time 25 minutes 
Registration for EMCJ 
Paper # EMCJ2009-31 
Volume (vol) vol.109 
Number (no) no.76 
Page pp.51-56 
#Pages 6 
Date of Issue 2009-05-29 (EMCJ) 

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