Paper Abstract and Keywords |
Presentation |
2009-09-29 15:45
Sound Pressure Analysis of the Ultrasonic Cleaning Machine Using Waveguide mode Yoshikazu Koike (Shibaura Inst. of Tech.), Kazunari Suzuki (Shibaura Inst. of Tech./Kaijo corp.), Kenta Suzuki, Ryuta Machida (Shibaura Inst. of Tech.), Ki Han, Shoi-ichi Okano, Junichiro Soejima (Shibaura Inst. of Tech./Kaijo corp.) US2009-44 |
Abstract |
(in Japanese) |
(See Japanese page) |
(in English) |
Authors proposed ultrasonic cleaning machine using the ultrasonic waveguide mode in order to reduce damage of the LSI pattern. The sound pressure emitted at the end of the waveguide is applied to cleaning the wafer in the same way of the conventional cleaning equipment. Additionally, the sound pressure emitted through the side surface of the waveguide is also applied to the wafer cleaning process. In this report, authors analyzed the radiation of the waveguide of the cleaning machine to improve the cleaning efficiency of the proposed ultrasonic cleaning machine. The sound pressure level inside and outside of the waveguide was calculated by finite element method (FEM). It is found that the sound pressure level at 2mm apart from the side surface is less than one twentieth or one thirtieth of the waveguide center. |
Keyword |
(in Japanese) |
(See Japanese page) |
(in English) |
Ultrasonic cleaning / Waveguide mode / High frequency ultrasonic / Cavitation / wafer cleaning process / post CMP cleaning process / / |
Reference Info. |
IEICE Tech. Rep., vol. 109, no. 213, US2009-44, pp. 37-40, Sept. 2009. |
Paper # |
US2009-44 |
Date of Issue |
2009-09-22 (US) |
ISSN |
Print edition: ISSN 0913-5685 Online edition: ISSN 2432-6380 |
Copyright and reproduction |
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US2009-44 |