IEICE Technical Committee Submission System
Conference Paper's Information
Online Proceedings
[Sign in]
Tech. Rep. Archives
 Go Top Page Go Previous   [Japanese] / [English] 

Paper Abstract and Keywords
Presentation 2010-02-19 13:00
A Study on Improvement for Seal property of Electromechanical Devices -- The behavior of One-Part Epoxy Resin in a narrow gap --
Osamu Otani, Seiji Nakajima, Tomohiro Fukuhara (OMRON Corp.) R2009-51 EMD2009-118 Link to ES Tech. Rep. Archives: EMD2009-118
Abstract (in Japanese) (See Japanese page) 
(in English) Generally, one-part epoxy resin consists of liquid epoxy monomer, solid curing agent, and filler as a packing agent and so on. One-part epoxy resin is handled easy because the state of one-part epoxy resin is transformed from liquid to solid by the chemical reaction between liquid epoxy monomer and solid curing agent induced by just heating. One-part epoxy resin is widely used as a sealant of electro devices due to the above mentioned property and toughness and so on. With smaller size, higher density, and slimmer down of electro devices recently, the thickness and width of adhesion moieties in various parts come to be much smaller. In case of that the thickness of adhesion moieties is less than 100μm, solid epoxy resin and liquid epoxy monomer domains, which separated from the solid moieties, were observed even after heating. The liquid epoxy monomer domains were thought to be resulted in lowering of sealing property, but the separation mechanism has not been clarified. We report the separation mechanism and depression method of liquid epoxy monomer domains in narrow gap after heating.
Keyword (in Japanese) (See Japanese page) 
(in English) Electromechanical device / Adhesion reliability / One-part epoxy resin / / / / /  
Reference Info. IEICE Tech. Rep., vol. 109, no. 420, EMD2009-118, pp. 7-11, Feb. 2010.
Paper # EMD2009-118 
Date of Issue 2010-02-12 (R, EMD) 
ISSN Print edition: ISSN 0913-5685    Online edition: ISSN 2432-6380
All rights are reserved and no part of this publication may be reproduced or transmitted in any form or by any means, electronic or mechanical, including photocopy, recording, or any information storage and retrieval system, without permission in writing from the publisher. Notwithstanding, instructors are permitted to photocopy isolated articles for noncommercial classroom use without fee. (License No.: 10GA0019/12GB0052/13GB0056/17GB0034/18GB0034)
Download PDF R2009-51 EMD2009-118 Link to ES Tech. Rep. Archives: EMD2009-118

Conference Information
Committee EMD R  
Conference Date 2010-02-19 - 2010-02-19 
Place (in Japanese) (See Japanese page) 
Place (in English)  
Topics (in Japanese) (See Japanese page) 
Topics (in English)  
Paper Information
Registration To EMD 
Conference Code 2010-02-EMD-R 
Language Japanese 
Title (in Japanese) (See Japanese page) 
Sub Title (in Japanese) (See Japanese page) 
Title (in English) A Study on Improvement for Seal property of Electromechanical Devices 
Sub Title (in English) The behavior of One-Part Epoxy Resin in a narrow gap 
Keyword(1) Electromechanical device  
Keyword(2) Adhesion reliability  
Keyword(3) One-part epoxy resin  
1st Author's Name Osamu Otani  
1st Author's Affiliation OMRON Corporation (OMRON Corp.)
2nd Author's Name Seiji Nakajima  
2nd Author's Affiliation OMRON Corporation (OMRON Corp.)
3rd Author's Name Tomohiro Fukuhara  
3rd Author's Affiliation OMRON Corporation (OMRON Corp.)
4th Author's Name  
4th Author's Affiliation ()
5th Author's Name  
5th Author's Affiliation ()
6th Author's Name  
6th Author's Affiliation ()
7th Author's Name  
7th Author's Affiliation ()
8th Author's Name  
8th Author's Affiliation ()
9th Author's Name  
9th Author's Affiliation ()
10th Author's Name  
10th Author's Affiliation ()
11th Author's Name  
11th Author's Affiliation ()
12th Author's Name  
12th Author's Affiliation ()
13th Author's Name  
13th Author's Affiliation ()
14th Author's Name  
14th Author's Affiliation ()
15th Author's Name  
15th Author's Affiliation ()
16th Author's Name  
16th Author's Affiliation ()
17th Author's Name  
17th Author's Affiliation ()
18th Author's Name  
18th Author's Affiliation ()
19th Author's Name  
19th Author's Affiliation ()
20th Author's Name  
20th Author's Affiliation ()
Speaker Author-1 
Date Time 2010-02-19 13:00:00 
Presentation Time 25 minutes 
Registration for EMD 
Paper # R2009-51, EMD2009-118 
Volume (vol) vol.109 
Number (no) no.419(R), no.420(EMD) 
Page pp.7-11 
Date of Issue 2010-02-12 (R, EMD) 

[Return to Top Page]

[Return to IEICE Web Page]

The Institute of Electronics, Information and Communication Engineers (IEICE), Japan