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Paper Abstract and Keywords
Presentation 2010-04-23 16:45
A Study of Highly Integrated Quasi-millimeter Front-end Circuits
Yo Yamaguchi, Takana Kaho, Kazuhiro Uehara (NTT), Kiyomichi Araki (Tokyo Inst. Tech.) SCE2010-12 MW2010-12
Abstract (in Japanese) (See Japanese page) 
(in English) In these days, broadband network infrastructure is increasing in urban areas. However, in rural areas the digital divide issue, which is caused by an inadequate broadband network infrastructure. To overcome this problem, a fixed wireless system at quasi-millimeter-wave band has developed. To miniature the equipment and to avoid the use of quasi-millimeter-wave interconnects between chips or components, we have developed highly integrated MMICs using three dimensional MMIC technology. In this paper, we discussed implementation technique using flip-chip technology.
Keyword (in Japanese) (See Japanese page) 
(in English) Fixed wireless system / Flip-chip technology / Three dimensional MMIC / Highly Integration / / / /  
Reference Info. IEICE Tech. Rep., vol. 110, no. 14, MW2010-12, pp. 63-67, April 2010.
Paper # MW2010-12 
Date of Issue 2010-04-16 (SCE, MW) 
ISSN Print edition: ISSN 0913-5685    Online edition: ISSN 2432-6380
Copyright
and
reproduction		 All rights are reserved and no part of this publication may be reproduced or transmitted in any form or by any means, electronic or mechanical, including photocopy, recording, or any information storage and retrieval system, without permission in writing from the publisher. Notwithstanding, instructors are permitted to photocopy isolated articles for noncommercial classroom use without fee. (License No.: 10GA0019/12GB0052/13GB0056/17GB0034/18GB0034)
Download PDF SCE2010-12 MW2010-12

Conference Information
Committee SCE MW  
Conference Date 2010-04-23 - 2010-04-23 
Place (in Japanese) (See Japanese page) 
Place (in English) Kikai-Shinko-Kaikan Bldg. 
Topics (in Japanese) (See Japanese page) 
Topics (in English)  
Paper Information
Registration To MW 
Conference Code 2010-04-SCE-MW 
Language Japanese 
Title (in Japanese) (See Japanese page) 
Sub Title (in Japanese) (See Japanese page) 
Title (in English) A Study of Highly Integrated Quasi-millimeter Front-end Circuits 
Sub Title (in English)  
Keyword(1) Fixed wireless system  
Keyword(2) Flip-chip technology  
Keyword(3) Three dimensional MMIC  
Keyword(4) Highly Integration  
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1st Author's Name Yo Yamaguchi  
1st Author's Affiliation NTT Corporation (NTT)
2nd Author's Name Takana Kaho  
2nd Author's Affiliation NTT Corporation (NTT)
3rd Author's Name Kazuhiro Uehara  
3rd Author's Affiliation NTT Corporation (NTT)
4th Author's Name Kiyomichi Araki  
4th Author's Affiliation Tokyo Institute of Technology (Tokyo Inst. Tech.)
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Speaker Author-1 
Date Time 2010-04-23 16:45:00 
Presentation Time 25 minutes 
Registration for MW 
Paper # SCE2010-12, MW2010-12 
Volume (vol) vol.110 
Number (no) no.13(SCE), no.14(MW) 
Page pp.63-67 
#Pages 5 
Date of Issue 2010-04-16 (SCE, MW) 

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