Information: Join today and make your research activities more affordable! Technical workshop participation fees and annual registration fees are available at member rates.
Notice: [Important] Announcement of Changes to Registration Fee Payment and Manuscript Upload Procedures for IEICE Technical Meetings
IEICE Technical Committee Submission System
Conference Paper's Information		 Online Proceedings
[Sign in]
Tech. Rep. Archives
 Go Top Page Go Previous   [Japanese] / [English] 

Paper Abstract and Keywords
Presentation 2010-10-22 14:15
Vapor deposition polymerization of epoxy polymer thin films
Shigekazu Fukui (Tokyo Univ. Agricul. & Technol.), Akio Sugiura, Akira Shintai, Kazuo Kato (DENSO), Kuniaki Tanaka, Hiroaki Usui (Tokyo Univ. Agricul. & Technol.) OME2010-49
Abstract (in Japanese) (See Japanese page) 
(in English) Thin films of epoxy resin were deposited by vapor deposition polymerization, coevaporating diepoxide monomer and diamine. Bisphenol-A diglycidyl ether (BADE) was used as the diepoxide monomer, and several types of diamines were used to investigate the effect of molecular structure on the film formation of epoxy resin. The reaction proceeded by annealing the codeposited film at 100oC for 1 h. The reaction was enhanced by depositing the diepoxide and diamine molecules at a molar ratio of 2:1. When aromatic and aliphatic compounds were compared for the diamine molecule, the latter gave higher reactivity. For the aromatic compounds of a similar structure, reactivity was enhanced by giving a flexibility to the molecular structure. Moreover, flexible monomer was favorable in obtaining uniform and flat thin films.
Keyword (in Japanese) (See Japanese page) 
(in English) Deposition polymerization / Epoxy / Diepoxide / Diamine / Electronic packaging / / /  
Reference Info. IEICE Tech. Rep., vol. 110, no. 243, OME2010-49, pp. 15-20, Oct. 2010.
Paper # OME2010-49 
Date of Issue 2010-10-15 (OME) 
ISSN Print edition: ISSN 0913-5685    Online edition: ISSN 2432-6380
Copyright
and
reproduction		 All rights are reserved and no part of this publication may be reproduced or transmitted in any form or by any means, electronic or mechanical, including photocopy, recording, or any information storage and retrieval system, without permission in writing from the publisher. Notwithstanding, instructors are permitted to photocopy isolated articles for noncommercial classroom use without fee. (License No.: 10GA0019/12GB0052/13GB0056/17GB0034/18GB0034)
Download PDF OME2010-49

Conference Information
Committee OME  
Conference Date 2010-10-22 - 2010-10-22 
Place (in Japanese) (See Japanese page) 
Place (in English) NTT Musashino R&D Center 
Topics (in Japanese) (See Japanese page) 
Topics (in English) Organic Devices, etc 
Paper Information
Registration To OME 
Conference Code 2010-10-OME 
Language Japanese 
Title (in Japanese) (See Japanese page) 
Sub Title (in Japanese) (See Japanese page) 
Title (in English) Vapor deposition polymerization of epoxy polymer thin films 
Sub Title (in English)  
Keyword(1) Deposition polymerization  
Keyword(2) Epoxy  
Keyword(3) Diepoxide  
Keyword(4) Diamine  
Keyword(5) Electronic packaging  
Keyword(6)  
Keyword(7)  
Keyword(8)  
1st Author's Name Shigekazu Fukui  
1st Author's Affiliation Tokyo University of Agriculture and Technology (Tokyo Univ. Agricul. & Technol.)
2nd Author's Name Akio Sugiura  
2nd Author's Affiliation DENSO Corporation (DENSO)
3rd Author's Name Akira Shintai  
3rd Author's Affiliation DENSO Corporation (DENSO)
4th Author's Name Kazuo Kato  
4th Author's Affiliation DENSO Corporation (DENSO)
5th Author's Name Kuniaki Tanaka  
5th Author's Affiliation Tokyo University of Agriculture and Technology (Tokyo Univ. Agricul. & Technol.)
6th Author's Name Hiroaki Usui  
6th Author's Affiliation Tokyo University of Agriculture and Technology (Tokyo Univ. Agricul. & Technol.)
7th Author's Name  
7th Author's Affiliation ()
8th Author's Name  
8th Author's Affiliation ()
9th Author's Name  
9th Author's Affiliation ()
10th Author's Name  
10th Author's Affiliation ()
11th Author's Name  
11th Author's Affiliation ()
12th Author's Name  
12th Author's Affiliation ()
13th Author's Name  
13th Author's Affiliation ()
14th Author's Name  
14th Author's Affiliation ()
15th Author's Name  
15th Author's Affiliation ()
16th Author's Name  
16th Author's Affiliation ()
17th Author's Name  
17th Author's Affiliation ()
18th Author's Name  
18th Author's Affiliation ()
19th Author's Name  
19th Author's Affiliation ()
20th Author's Name  
20th Author's Affiliation ()
21st Author's Name  
21st Author's Affiliation ()
22nd Author's Name  
22nd Author's Affiliation ()
23rd Author's Name  
23rd Author's Affiliation ()
24th Author's Name  
24th Author's Affiliation ()
25th Author's Name  
25th Author's Affiliation ()
26th Author's Name / /
26th Author's Affiliation ()
()
27th Author's Name / /
27th Author's Affiliation ()
()
28th Author's Name / /
28th Author's Affiliation ()
()
29th Author's Name / /
29th Author's Affiliation ()
()
30th Author's Name / /
30th Author's Affiliation ()
()
31st Author's Name / /
31st Author's Affiliation ()
()
32nd Author's Name / /
32nd Author's Affiliation ()
()
33rd Author's Name / /
33rd Author's Affiliation ()
()
34th Author's Name / /
34th Author's Affiliation ()
()
35th Author's Name / /
35th Author's Affiliation ()
()
36th Author's Name / /
36th Author's Affiliation ()
()
Speaker Author-6 
Date Time 2010-10-22 14:15:00 
Presentation Time 25 minutes 
Registration for OME 
Paper # OME2010-49 
Volume (vol) vol.110 
Number (no) no.243 
Page pp.15-20 
#Pages 6 
Date of Issue 2010-10-15 (OME) 

[Return to Top Page]

[Return to IEICE Web Page]
The Institute of Electronics, Information and Communication Engineers (IEICE), Japan