Information: Join today and make your research activities more affordable! Technical workshop participation fees and annual registration fees are available at member rates.
Notice: [Important] Announcement of Changes to Registration Fee Payment and Manuscript Upload Procedures for IEICE Technical Meetings
IEICE Technical Committee Submission System
Conference Paper's Information		 Online Proceedings
[Sign in]
Tech. Rep. Archives
 Go Top Page Go Previous   [Japanese] / [English] 

Paper Abstract and Keywords
Presentation 2010-11-12 10:45
3D Temperature Field Simulation & Analysis of Pantograph
Chen Hui-juan, Xu Zhi-hong (Fuzhou Univ.) EMD2010-105
Abstract (in Japanese) (See Japanese page) 
(in English) Temperature rise of contact strip is the dominate factor determines its wear and friction mechanism. To organize experimental researches into contact strip temperature field on a running electrical vehicle」ャ there will be a great variety of practical difficulties. Therefore, with ANSYS Parametric Design Language, this paper set up a 3D finite element model of pantograph collector head, compiled cyclic loading and solution program to simulate the sliding contact between contact wire and contact strip when the vehicle receives current and moves. Based on numerous calculations and analysis, the basic regular pattern of contact strip temperature rise was studied, influences of various heat sources and materials of the strip were compared. It founded a basis for further study on the pantograph work situation and its electrical life prediction.
Keyword (in Japanese) (See Japanese page) 
(in English) pantograph / electrical contact / FEA / multiple load steps / temperature field / / /  
Reference Info. IEICE Tech. Rep., vol. 110, no. 270, EMD2010-105, pp. 159-162, Nov. 2010.
Paper # EMD2010-105 
Date of Issue 2010-11-04 (EMD) 
ISSN Print edition: ISSN 0913-5685    Online edition: ISSN 2432-6380
Copyright
and
reproduction		 All rights are reserved and no part of this publication may be reproduced or transmitted in any form or by any means, electronic or mechanical, including photocopy, recording, or any information storage and retrieval system, without permission in writing from the publisher. Notwithstanding, instructors are permitted to photocopy isolated articles for noncommercial classroom use without fee. (License No.: 10GA0019/12GB0052/13GB0056/17GB0034/18GB0034)
Download PDF EMD2010-105

Conference Information
Committee EMD  
Conference Date 2010-11-11 - 2010-11-12 
Place (in Japanese) (See Japanese page) 
Place (in English) Xi'an Jiaotong University 
Topics (in Japanese) (See Japanese page) 
Topics (in English) IS-EMD2010 (10th International Session in Electro-Mechanical Devices) 
Paper Information
Registration To EMD 
Conference Code 2010-11-EMD 
Language English 
Title (in Japanese) (See Japanese page) 
Sub Title (in Japanese) (See Japanese page) 
Title (in English) 3D Temperature Field Simulation & Analysis of Pantograph 
Sub Title (in English)  
Keyword(1) pantograph  
Keyword(2) electrical contact  
Keyword(3) FEA  
Keyword(4) multiple load steps  
Keyword(5) temperature field  
Keyword(6)  
Keyword(7)  
Keyword(8)  
1st Author's Name Chen Hui-juan  
1st Author's Affiliation Fuzhou University (Fuzhou Univ.)
2nd Author's Name Xu Zhi-hong  
2nd Author's Affiliation Fuzhou University (Fuzhou Univ.)
3rd Author's Name  
3rd Author's Affiliation ()
4th Author's Name  
4th Author's Affiliation ()
5th Author's Name  
5th Author's Affiliation ()
6th Author's Name  
6th Author's Affiliation ()
7th Author's Name  
7th Author's Affiliation ()
8th Author's Name  
8th Author's Affiliation ()
9th Author's Name  
9th Author's Affiliation ()
10th Author's Name  
10th Author's Affiliation ()
11th Author's Name  
11th Author's Affiliation ()
12th Author's Name  
12th Author's Affiliation ()
13th Author's Name  
13th Author's Affiliation ()
14th Author's Name  
14th Author's Affiliation ()
15th Author's Name  
15th Author's Affiliation ()
16th Author's Name  
16th Author's Affiliation ()
17th Author's Name  
17th Author's Affiliation ()
18th Author's Name  
18th Author's Affiliation ()
19th Author's Name  
19th Author's Affiliation ()
20th Author's Name  
20th Author's Affiliation ()
21st Author's Name  
21st Author's Affiliation ()
22nd Author's Name  
22nd Author's Affiliation ()
23rd Author's Name  
23rd Author's Affiliation ()
24th Author's Name  
24th Author's Affiliation ()
25th Author's Name  
25th Author's Affiliation ()
26th Author's Name / /
26th Author's Affiliation ()
()
27th Author's Name / /
27th Author's Affiliation ()
()
28th Author's Name / /
28th Author's Affiliation ()
()
29th Author's Name / /
29th Author's Affiliation ()
()
30th Author's Name / /
30th Author's Affiliation ()
()
31st Author's Name / /
31st Author's Affiliation ()
()
32nd Author's Name / /
32nd Author's Affiliation ()
()
33rd Author's Name / /
33rd Author's Affiliation ()
()
34th Author's Name / /
34th Author's Affiliation ()
()
35th Author's Name / /
35th Author's Affiliation ()
()
36th Author's Name / /
36th Author's Affiliation ()
()
Speaker Author-1 
Date Time 2010-11-12 10:45:00 
Presentation Time 15 minutes 
Registration for EMD 
Paper # EMD2010-105 
Volume (vol) vol.110 
Number (no) no.270 
Page pp.159-162 
#Pages 4 
Date of Issue 2010-11-04 (EMD) 

[Return to Top Page]

[Return to IEICE Web Page]
The Institute of Electronics, Information and Communication Engineers (IEICE), Japan