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Paper Abstract and Keywords
Presentation 2010-11-12 14:00
Research onTemperature Rise and Surface Deformation of Electrical Contacts by FEM
Hiroki Ryobuchi, Koichiro Sawa, Noboru Morita, Takefumi Hiraguri, Kenya Jin'no, Takahiro Ueno (Nippon Inst. of Tech.) EMD2010-114
Abstract (in Japanese) (See Japanese page) 
(in English) Recently, sliding contact mechanisms are being used to supply current to rotating or moving objects in a number of industrial applications. In this paper, we examine the heating and deformation that affects the contact areas of these sliding contact mechanisms by means of experiment and numerical analysis. In both the experiments and the finite element method (FEM) analysis, deformation was observed in the contact surfaces as mechanical stress. Moreover, a strong temperature distribution was found around the contact area with the formation of hot spots. In this work, we focused on the temperature rise under stress in the actual contact area. We also analyzed the heat transfer and stress at the point of contact between the copper pin and the copper disk that constitute the contact area by FEM analysis and experiments. It was found that heat is generated from the tip of the pin. The FEM analysis results indicated that that the maximum mechanical stress occurred around the periphery of the contact area, leading to significant deformation in this region.
Keyword (in Japanese) (See Japanese page) 
(in English) a-spot / Contact resistance / FEM / stress analysis / Heat transfer analysis / Coupling analysis / /  
Reference Info. IEICE Tech. Rep., vol. 110, no. 270, EMD2010-114, pp. 197-200, Nov. 2010.
Paper # EMD2010-114 
Date of Issue 2010-11-04 (EMD) 
ISSN Print edition: ISSN 0913-5685    Online edition: ISSN 2432-6380
Copyright
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reproduction		 All rights are reserved and no part of this publication may be reproduced or transmitted in any form or by any means, electronic or mechanical, including photocopy, recording, or any information storage and retrieval system, without permission in writing from the publisher. Notwithstanding, instructors are permitted to photocopy isolated articles for noncommercial classroom use without fee. (License No.: 10GA0019/12GB0052/13GB0056/17GB0034/18GB0034)
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Conference Information
Committee EMD  
Conference Date 2010-11-11 - 2010-11-12 
Place (in Japanese) (See Japanese page) 
Place (in English) Xi'an Jiaotong University 
Topics (in Japanese) (See Japanese page) 
Topics (in English) IS-EMD2010 (10th International Session in Electro-Mechanical Devices) 
Paper Information
Registration To EMD 
Conference Code 2010-11-EMD 
Language English 
Title (in Japanese) (See Japanese page) 
Sub Title (in Japanese) (See Japanese page) 
Title (in English) Research onTemperature Rise and Surface Deformation of Electrical Contacts by FEM 
Sub Title (in English)  
Keyword(1) a-spot  
Keyword(2) Contact resistance  
Keyword(3) FEM  
Keyword(4) stress analysis  
Keyword(5) Heat transfer analysis  
Keyword(6) Coupling analysis  
Keyword(7)  
Keyword(8)  
1st Author's Name Hiroki Ryobuchi  
1st Author's Affiliation Nippon Institute of Technology (Nippon Inst. of Tech.)
2nd Author's Name Koichiro Sawa  
2nd Author's Affiliation Nippon Institute of Technology (Nippon Inst. of Tech.)
3rd Author's Name Noboru Morita  
3rd Author's Affiliation Nippon Institute of Technology (Nippon Inst. of Tech.)
4th Author's Name Takefumi Hiraguri  
4th Author's Affiliation Nippon Institute of Technology (Nippon Inst. of Tech.)
5th Author's Name Kenya Jin'no  
5th Author's Affiliation Nippon Institute of Technology (Nippon Inst. of Tech.)
6th Author's Name Takahiro Ueno  
6th Author's Affiliation Nippon Institute of Technology (Nippon Inst. of Tech.)
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Speaker Author-1 
Date Time 2010-11-12 14:00:00 
Presentation Time 15 minutes 
Registration for EMD 
Paper # EMD2010-114 
Volume (vol) vol.110 
Number (no) no.270 
Page pp.197-200 
#Pages 4 
Date of Issue 2010-11-04 (EMD) 

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