Information: Join today and make your research activities more affordable! Technical workshop participation fees and annual registration fees are available at member rates.
Notice: [Important] Announcement of Changes to Registration Fee Payment and Manuscript Upload Procedures for IEICE Technical Meetings
IEICE Technical Committee Submission System
Conference Paper's Information
Online Proceedings
[Sign in]
Tech. Rep. Archives
 Go Top Page Go Previous   [Japanese] / [English] 

Paper Abstract and Keywords
Presentation 2010-12-16 16:45
Reduction Method for Residual Stress on Welded Joint Using Ultrasonic and Low Frequency Vibrations -- Simulation Using Model with Plastic Deformation --
Shigeru Aoki, Tadashi Nishimura, Tetsumaro Hiroi, Katsumi Kurita (TMCIT), Seiji Hirai (IOT), Shigeomi Koshimizu (AIIT) US2010-91
Abstract (in Japanese) (See Japanese page) 
(in English) Welding is widely used for construction of many structures. Residual stress is generated near the bead because of locally given heat. Tensile residual stress degrades fatigue strength. Reduction method for residual stress has been developed. In this paper, a new method using ultrasonic vibration and low frequency vibrations during welding is proposed. This method is applied to welding of thin plates. It is found that tensile residual stress is reduced. Because yield stress immediately after welding is low, an analytical model considering plastic deformation is introduced. It is demonstrated by simulation using the proposed model that tensile residual stress is reduced using ultrasonic and low frequency vibrations.
Keyword (in Japanese) (See Japanese page) 
(in English) Welding / Residual Stress / Vibration / Plastic Deformation / Analytical Model / / /  
Reference Info. IEICE Tech. Rep., vol. 110, no. 338, US2010-91, pp. 35-38, Dec. 2010.
Paper # US2010-91 
Date of Issue 2010-12-09 (US) 
ISSN Print edition: ISSN 0913-5685    Online edition: ISSN 2432-6380
Copyright
and
reproduction
All rights are reserved and no part of this publication may be reproduced or transmitted in any form or by any means, electronic or mechanical, including photocopy, recording, or any information storage and retrieval system, without permission in writing from the publisher. Notwithstanding, instructors are permitted to photocopy isolated articles for noncommercial classroom use without fee. (License No.: 10GA0019/12GB0052/13GB0056/17GB0034/18GB0034)
Download PDF US2010-91

Conference Information
Committee US  
Conference Date 2010-12-16 - 2010-12-16 
Place (in Japanese) (See Japanese page) 
Place (in English) Suzukakedai Campus, Tokyo Institute of Technology 
Topics (in Japanese) (See Japanese page) 
Topics (in English) High Power Ultrasound 
Paper Information
Registration To US 
Conference Code 2010-12-US 
Language Japanese 
Title (in Japanese) (See Japanese page) 
Sub Title (in Japanese) (See Japanese page) 
Title (in English) Reduction Method for Residual Stress on Welded Joint Using Ultrasonic and Low Frequency Vibrations 
Sub Title (in English) Simulation Using Model with Plastic Deformation 
Keyword(1) Welding  
Keyword(2) Residual Stress  
Keyword(3) Vibration  
Keyword(4) Plastic Deformation  
Keyword(5) Analytical Model  
Keyword(6)  
Keyword(7)  
Keyword(8)  
1st Author's Name Shigeru Aoki  
1st Author's Affiliation Tokyo Metropolitan College of Industrial Technology (TMCIT)
2nd Author's Name Tadashi Nishimura  
2nd Author's Affiliation Tokyo Metropolitan College of Industrial Technology (TMCIT)
3rd Author's Name Tetsumaro Hiroi  
3rd Author's Affiliation Tokyo Metropolitan College of Industrial Technology (TMCIT)
4th Author's Name Katsumi Kurita  
4th Author's Affiliation Tokyo Metropolitan College of Industrial Technology (TMCIT)
5th Author's Name Seiji Hirai  
5th Author's Affiliation Institute of Technologists (IOT)
6th Author's Name Shigeomi Koshimizu  
6th Author's Affiliation Advanced Institute of Industrial Technology (AIIT)
7th Author's Name  
7th Author's Affiliation ()
8th Author's Name  
8th Author's Affiliation ()
9th Author's Name  
9th Author's Affiliation ()
10th Author's Name  
10th Author's Affiliation ()
11th Author's Name  
11th Author's Affiliation ()
12th Author's Name  
12th Author's Affiliation ()
13th Author's Name  
13th Author's Affiliation ()
14th Author's Name  
14th Author's Affiliation ()
15th Author's Name  
15th Author's Affiliation ()
16th Author's Name  
16th Author's Affiliation ()
17th Author's Name  
17th Author's Affiliation ()
18th Author's Name  
18th Author's Affiliation ()
19th Author's Name  
19th Author's Affiliation ()
20th Author's Name  
20th Author's Affiliation ()
21st Author's Name  
21st Author's Affiliation ()
22nd Author's Name  
22nd Author's Affiliation ()
23rd Author's Name  
23rd Author's Affiliation ()
24th Author's Name  
24th Author's Affiliation ()
25th Author's Name  
25th Author's Affiliation ()
26th Author's Name / /
26th Author's Affiliation ()
()
27th Author's Name / /
27th Author's Affiliation ()
()
28th Author's Name / /
28th Author's Affiliation ()
()
29th Author's Name / /
29th Author's Affiliation ()
()
30th Author's Name / /
30th Author's Affiliation ()
()
31st Author's Name / /
31st Author's Affiliation ()
()
32nd Author's Name / /
32nd Author's Affiliation ()
()
33rd Author's Name / /
33rd Author's Affiliation ()
()
34th Author's Name / /
34th Author's Affiliation ()
()
35th Author's Name / /
35th Author's Affiliation ()
()
36th Author's Name / /
36th Author's Affiliation ()
()
Speaker Author-1 
Date Time 2010-12-16 16:45:00 
Presentation Time 30 minutes 
Registration for US 
Paper # US2010-91 
Volume (vol) vol.110 
Number (no) no.338 
Page pp.35-38 
#Pages
Date of Issue 2010-12-09 (US) 


[Return to Top Page]

[Return to IEICE Web Page]


The Institute of Electronics, Information and Communication Engineers (IEICE), Japan