Information: Join today and make your research activities more affordable! Technical workshop participation fees and annual registration fees are available at member rates.
Notice: [Important] Announcement of Changes to Registration Fee Payment and Manuscript Upload Procedures for IEICE Technical Meetings
IEICE Technical Committee Submission System
Conference Paper's Information
Online Proceedings
[Sign in]
Tech. Rep. Archives
 Go Top Page Go Previous   [Japanese] / [English] 

Paper Abstract and Keywords
Presentation 2011-03-29 09:20
A study on the Relationship between Thermal-comfort and Skin-temperature of Palm Measured by Infrared-image
Jian LU, Shinichi Sawada, Hikaru Enomoto, Tetuo Tai, Tatsuo Oka, Akinori Yasuda (JNIOSH) IBISML2010-121
Abstract (in Japanese) (See Japanese page) 
(in English) In order to prevent the heat disorders during hot climate working, some measurements are needed to evaluate the thermal physiological strain and the hot comfort objectively for easy use on working field. By using infrared image taken from palms, the authors are investigating the relationship between the thermal comfort and the skin temperature of palms. The subjective experiments are performed in a hot climate chamber. The result shows the potential usability of the temperature deviation, while compared with the other statistic features.
Keyword (in Japanese) (See Japanese page) 
(in English) Infrared-image / Thermal-comfort / Skin-temperature / Pattern Analyzing / / / /  
Reference Info. IEICE Tech. Rep., vol. 110, no. 476, IBISML2010-121, pp. 123-124, March 2011.
Paper # IBISML2010-121 
Date of Issue 2011-03-21 (IBISML) 
ISSN Print edition: ISSN 0913-5685    Online edition: ISSN 2432-6380
Copyright
and
reproduction
All rights are reserved and no part of this publication may be reproduced or transmitted in any form or by any means, electronic or mechanical, including photocopy, recording, or any information storage and retrieval system, without permission in writing from the publisher. Notwithstanding, instructors are permitted to photocopy isolated articles for noncommercial classroom use without fee. (License No.: 10GA0019/12GB0052/13GB0056/17GB0034/18GB0034)
Download PDF IBISML2010-121

Conference Information
Committee IBISML  
Conference Date 2011-03-28 - 2011-03-29 
Place (in Japanese) (See Japanese page) 
Place (in English) Nakanoshima Center, Osaka Univ. 
Topics (in Japanese) (See Japanese page) 
Topics (in English) Text and Web mining, etc. 
Paper Information
Registration To IBISML 
Conference Code 2011-03-IBISML 
Language Japanese 
Title (in Japanese) (See Japanese page) 
Sub Title (in Japanese) (See Japanese page) 
Title (in English) A study on the Relationship between Thermal-comfort and Skin-temperature of Palm Measured by Infrared-image 
Sub Title (in English)  
Keyword(1) Infrared-image  
Keyword(2) Thermal-comfort  
Keyword(3) Skin-temperature  
Keyword(4) Pattern Analyzing  
Keyword(5)  
Keyword(6)  
Keyword(7)  
Keyword(8)  
1st Author's Name Jian LU  
1st Author's Affiliation Japan National Institute of Occupational Safety and Health (JNIOSH)
2nd Author's Name Shinichi Sawada  
2nd Author's Affiliation Japan National Institute of Occupational Safety and Health (JNIOSH)
3rd Author's Name Hikaru Enomoto  
3rd Author's Affiliation Japan National Institute of Occupational Safety and Health (JNIOSH)
4th Author's Name Tetuo Tai  
4th Author's Affiliation Japan National Institute of Occupational Safety and Health (JNIOSH)
5th Author's Name Tatsuo Oka  
5th Author's Affiliation Japan National Institute of Occupational Safety and Health (JNIOSH)
6th Author's Name Akinori Yasuda  
6th Author's Affiliation Japan National Institute of Occupational Safety and Health (JNIOSH)
7th Author's Name  
7th Author's Affiliation ()
8th Author's Name  
8th Author's Affiliation ()
9th Author's Name  
9th Author's Affiliation ()
10th Author's Name  
10th Author's Affiliation ()
11th Author's Name  
11th Author's Affiliation ()
12th Author's Name  
12th Author's Affiliation ()
13th Author's Name  
13th Author's Affiliation ()
14th Author's Name  
14th Author's Affiliation ()
15th Author's Name  
15th Author's Affiliation ()
16th Author's Name  
16th Author's Affiliation ()
17th Author's Name  
17th Author's Affiliation ()
18th Author's Name  
18th Author's Affiliation ()
19th Author's Name  
19th Author's Affiliation ()
20th Author's Name  
20th Author's Affiliation ()
21st Author's Name  
21st Author's Affiliation ()
22nd Author's Name  
22nd Author's Affiliation ()
23rd Author's Name  
23rd Author's Affiliation ()
24th Author's Name  
24th Author's Affiliation ()
25th Author's Name  
25th Author's Affiliation ()
26th Author's Name / /
26th Author's Affiliation ()
()
27th Author's Name / /
27th Author's Affiliation ()
()
28th Author's Name / /
28th Author's Affiliation ()
()
29th Author's Name / /
29th Author's Affiliation ()
()
30th Author's Name / /
30th Author's Affiliation ()
()
31st Author's Name / /
31st Author's Affiliation ()
()
32nd Author's Name / /
32nd Author's Affiliation ()
()
33rd Author's Name / /
33rd Author's Affiliation ()
()
34th Author's Name / /
34th Author's Affiliation ()
()
35th Author's Name / /
35th Author's Affiliation ()
()
36th Author's Name / /
36th Author's Affiliation ()
()
Speaker Author-1 
Date Time 2011-03-29 09:20:00 
Presentation Time 20 minutes 
Registration for IBISML 
Paper # IBISML2010-121 
Volume (vol) vol.110 
Number (no) no.476 
Page pp.123-124 
#Pages
Date of Issue 2011-03-21 (IBISML) 


[Return to Top Page]

[Return to IEICE Web Page]


The Institute of Electronics, Information and Communication Engineers (IEICE), Japan