Paper Abstract and Keywords |
Presentation |
2011-07-14 11:20
Measurement of Self-Inductance of IC Package with THRU Pattern Embedded Instead of Chip Ayumi Tanimichi, Kengo Iokibe, Yoshitaka Toyota (Okayama Univ.) EMCJ2011-49 |
Abstract |
(in Japanese) |
(See Japanese page) |
(in English) |
In IC package modeling of electrical properties, to compare model parameters extracted from results
of electromagnetic calculations to those obtained from measurements is an important method for validation of the
model. Only direct probing methods for special package, however, had been reported in literature. There is no
method for actual packages molded with resin and mounted on printed circuit board. This paper proposes an ex-
traction method of self-inductance of actual IC packages. Four test packages consists of interposer and bonding wires
were employed for validation of the method. Self-inductances of the four packages were extracted from measured
impedance parameters obtained by a 2-port measurement at board level. The test package contained a THRU
line instead of IC-chip. By subtracting inductance of the THRU line from inductance between the two ports of
measurement, the package inductance was obtained. As a result, the self-inductance were obtained with absolute
errors between - 0.8 and - 0.2 nH in measurement, between - 0.9 ~ - 0.6 nH in electromagnetic calculations. |
Keyword |
(in Japanese) |
(See Japanese page) |
(in English) |
IC/LSI / Package / Self-Inductance / THRU pattern / / / / |
Reference Info. |
IEICE Tech. Rep., vol. 111, no. 131, EMCJ2011-49, pp. 31-36, July 2011. |
Paper # |
EMCJ2011-49 |
Date of Issue |
2011-07-07 (EMCJ) |
ISSN |
Print edition: ISSN 0913-5685 Online edition: ISSN 2432-6380 |
Copyright and reproduction |
All rights are reserved and no part of this publication may be reproduced or transmitted in any form or by any means, electronic or mechanical, including photocopy, recording, or any information storage and retrieval system, without permission in writing from the publisher. Notwithstanding, instructors are permitted to photocopy isolated articles for noncommercial classroom use without fee. (License No.: 10GA0019/12GB0052/13GB0056/17GB0034/18GB0034) |
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EMCJ2011-49 |
Conference Information |
Committee |
EMCJ |
Conference Date |
2011-07-14 - 2011-07-14 |
Place (in Japanese) |
(See Japanese page) |
Place (in English) |
Kikai-Shinko-Kaikan Bldg. |
Topics (in Japanese) |
(See Japanese page) |
Topics (in English) |
Young Scientists meeting |
Paper Information |
Registration To |
EMCJ |
Conference Code |
2011-07-EMCJ |
Language |
Japanese |
Title (in Japanese) |
(See Japanese page) |
Sub Title (in Japanese) |
(See Japanese page) |
Title (in English) |
Measurement of Self-Inductance of IC Package with THRU Pattern Embedded Instead of Chip |
Sub Title (in English) |
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Keyword(1) |
IC/LSI |
Keyword(2) |
Package |
Keyword(3) |
Self-Inductance |
Keyword(4) |
THRU pattern |
Keyword(5) |
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Keyword(6) |
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1st Author's Name |
Ayumi Tanimichi |
1st Author's Affiliation |
Okayama University (Okayama Univ.) |
2nd Author's Name |
Kengo Iokibe |
2nd Author's Affiliation |
Okayama University (Okayama Univ.) |
3rd Author's Name |
Yoshitaka Toyota |
3rd Author's Affiliation |
Okayama University (Okayama Univ.) |
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Speaker |
Author-1 |
Date Time |
2011-07-14 11:20:00 |
Presentation Time |
25 minutes |
Registration for |
EMCJ |
Paper # |
EMCJ2011-49 |
Volume (vol) |
vol.111 |
Number (no) |
no.131 |
Page |
pp.31-36 |
#Pages |
6 |
Date of Issue |
2011-07-07 (EMCJ) |
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