| Paper Abstract and Keywords |
| Presentation |
2012-08-03 09:25
[Invited Talk]
Nanocarbon Interconnects
-- Aiming to replace ultra-fine metal interconnects -- Akihiro Kajita, Makoto Wada, Tatsuro Saito, Masayuki Kitamura, Yuichi Yamazaki, Masayuki Katagiri, Ban Ito, Daisuke Nishide, Takashi Matsumoto, Atsunobu Isobayashi, Mariko Suzuki, Atsuko Sakata, Masahito Watanabe, Naoshi Sakuma, Tadashi Sakai (LEAP) SDM2012-78 ICD2012-46 |
| Abstract |
(in Japanese) |
(See Japanese page) |
| (in English) |
The width of interconnects has been shrinking toward 10nm in accordance with LSI devices shrinkage. The resistivity of such ultra-fine metal interconnects increases steeply, because the size effect on the resistivity becomes pronounced. On the other hand, interconnects with nano-carbon materials like graphene and CNT are expected to have the resistance which doesn’t depend on the size due to their unique conduction mechanism. So, nano-carbon interconnects have a potential to substitute urtra-fine metal interconnects and/or metal vias with very high aspect ratio. LEAP has developed both graphene wires and CNT vias in order to be applied to the future interconnects. Some challenges to grow graphene and CNT by CVD, which is suitable for LSI fabrication process, are shown. |
| Keyword |
(in Japanese) |
(See Japanese page) |
| (in English) |
Interconnect / Nanocarbon / Graphene / Carbon Nano Tube / / / / |
| Reference Info. |
IEICE Tech. Rep., vol. 112, no. 169, SDM2012-78, pp. 83-87, Aug. 2012. |
| Paper # |
SDM2012-78 |
| Date of Issue |
2012-07-26 (SDM, ICD) |
| ISSN |
Print edition: ISSN 0913-5685 Online edition: ISSN 2432-6380 |
Copyright and reproduction |
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| Download PDF |
SDM2012-78 ICD2012-46 |