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| Presentation | 2013-03-07 11:00 Microstrip Type Slow-Wave Transmission Lines with Bi-Layered Cross-ties Connected by Staggered VIAs Yasuo Morimoto, Takeshi Yuasa, Tetsu Owada (Mitsubishi Electric Corp.)  MW2012-172 Link to ES Tech. Rep. Archives: MW2012-172 |
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| Abstract | (in Japanese) | (See Japanese page) |
| (in English) | Slow-wave transmission lines provide a large wavelength shortening effect and low-loss characteristic per wave length. They have periodic structure of low-impedance small segment with thin-rectangular ground conductor, ‘cross-tie’, and high-impedance small segment without a cross-tie. In this report, a new microstrip type slow-wave transmission line structure is proposed, including bi-layered cross-ties connected by staggered VIAs. We discuss its operating principle and frequency dependences of slow-wave factor, and so on. In addition, measurement results of some fabricated slow-wave transmission lines by the micro writing process on silicon chip are presented. Proposed lines have good characteristics in terms of slow wave factor, more than 6. On the other hand, its insertion loss is poor, since series resistance is large. Our next task to overcome is reduction of the insertion loss. | |
| Keyword | (in Japanese) | (See Japanese page) |
| (in English) | slow-wave transmission line / MMIC / RLGC equivalent circuit / / / / / | |
| Reference Info. | IEICE Tech. Rep., vol. 112, no. 459, MW2012-172, pp. 69-74, March 2013. | |
| Paper # | MW2012-172 | |
| Date of Issue | 2013-02-27 (MW) | |
| ISSN | Print edition: ISSN 0913-5685 Online edition: ISSN 2432-6380 | |
| Copyright and reproduction |
All rights are reserved and no part of this publication may be reproduced or transmitted in any form or by any means, electronic or mechanical, including photocopy, recording, or any information storage and retrieval system, without permission in writing from the publisher. Notwithstanding, instructors are permitted to photocopy isolated articles for noncommercial classroom use without fee. (License No.: 10GA0019/12GB0052/13GB0056/17GB0034/18GB0034) | |
| Download PDF | MW2012-172 Link to ES Tech. Rep. Archives: MW2012-172 |
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| Conference Information | |
| Committee | MW |
| Conference Date | 2013-03-06 - 2013-03-08 |
| Place (in Japanese) | (See Japanese page) |
| Place (in English) | Hiroshima Univ. |
| Topics (in Japanese) | (See Japanese page) |
| Topics (in English) | Microwave Technologies |
| Paper Information | |
| Registration To | MW |
| Conference Code | 2013-03-MW |
| Language | Japanese |
| Title (in Japanese) | (See Japanese page) |
| Sub Title (in Japanese) | (See Japanese page) |
| Title (in English) | Microstrip Type Slow-Wave Transmission Lines with Bi-Layered Cross-ties Connected by Staggered VIAs |
| Sub Title (in English) | |
| Keyword(1) | slow-wave transmission line |
| Keyword(2) | MMIC |
| Keyword(3) | RLGC equivalent circuit |
| Keyword(4) | |
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| Keyword(8) | |
| 1st Author's Name | Yasuo Morimoto |
| 1st Author's Affiliation | Mitsubishi Electric Corporation (Mitsubishi Electric Corp.) |
| 2nd Author's Name | Takeshi Yuasa |
| 2nd Author's Affiliation | Mitsubishi Electric Corporation (Mitsubishi Electric Corp.) |
| 3rd Author's Name | Tetsu Owada |
| 3rd Author's Affiliation | Mitsubishi Electric Corporation (Mitsubishi Electric Corp.) |
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| Speaker | Author-1 |
| Date Time | 2013-03-07 11:00:00 |
| Presentation Time | 25 minutes |
| Registration for | MW |
| Paper # | MW2012-172 |
| Volume (vol) | vol.112 |
| Number (no) | no.459 |
| Page | pp.69-74 |
| #Pages | 6 |
| Date of Issue | 2013-02-27 (MW) |
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