Paper Abstract and Keywords |
Presentation |
2013-05-17 11:10
Evaluation of 3D on-chip network structures suitable to a data center Takahide Ikeda, Yuichi Ohsita, Masayuki Murata (Osaka Univ) IN2013-20 |
Abstract |
(in Japanese) |
(See Japanese page) |
(in English) |
In a data center, servers cooperate with each other to handle a large amount of data. As the size of data increases, the energy consumption of the data center increases. To reduce the energy consumption of the data center, an architecture called on-chip data center has been proposed. In this architecture, a large number of CPUs are deployed on a single chip and connected by using Network on Chip (NoC). %However, the network structure suitable to the on-chip data center has not been discussed sufficiently.
In this paper, we focus on the 3-D network-on-chip, which reduce the energy consumption compared with 2-D network-on-chip. Then, we deploy packet switches and circuit switches, to accommodate the traffic between servers on the chip efficiently.
In this paper, we discuss the network structure by the following points; (1) connection between switches of different layers, (2) the layer of the switches connected to servers, and (3) the arrangement of switches on each layer.
We evaluate the energy consumption and the latency between servers. The result clarifies that to reduce the energy consumption and the latency, (1) switches on all layers should be connected to the switch on a certain layer, (2) all servers should connect to the switch on the same layer, and (3) all switches on each layer should be the same kind of switch. |
Keyword |
(in Japanese) |
(See Japanese page) |
(in English) |
NoC / data center / power consumption / latency / 3D on-chip network / / / |
Reference Info. |
IEICE Tech. Rep., vol. 113, no. 36, IN2013-20, pp. 49-54, May 2013. |
Paper # |
IN2013-20 |
Date of Issue |
2013-05-09 (IN) |
ISSN |
Print edition: ISSN 0913-5685 Online edition: ISSN 2432-6380 |
Copyright and reproduction |
All rights are reserved and no part of this publication may be reproduced or transmitted in any form or by any means, electronic or mechanical, including photocopy, recording, or any information storage and retrieval system, without permission in writing from the publisher. Notwithstanding, instructors are permitted to photocopy isolated articles for noncommercial classroom use without fee. (License No.: 10GA0019/12GB0052/13GB0056/17GB0034/18GB0034) |
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IN2013-20 |
Conference Information |
Committee |
RCS IN |
Conference Date |
2013-05-16 - 2013-05-17 |
Place (in Japanese) |
(See Japanese page) |
Place (in English) |
Kikai-Shinko-Kaikan Bldg. |
Topics (in Japanese) |
(See Japanese page) |
Topics (in English) |
Wireless Internet, Multi-hop network, Mesh network, Network coding, Cross layer technique, Wireless communication, etc. |
Paper Information |
Registration To |
IN |
Conference Code |
2013-05-RCS-IN |
Language |
Japanese |
Title (in Japanese) |
(See Japanese page) |
Sub Title (in Japanese) |
(See Japanese page) |
Title (in English) |
Evaluation of 3D on-chip network structures suitable to a data center |
Sub Title (in English) |
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Keyword(1) |
NoC |
Keyword(2) |
data center |
Keyword(3) |
power consumption |
Keyword(4) |
latency |
Keyword(5) |
3D on-chip network |
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1st Author's Name |
Takahide Ikeda |
1st Author's Affiliation |
Osaka University (Osaka Univ) |
2nd Author's Name |
Yuichi Ohsita |
2nd Author's Affiliation |
Osaka University (Osaka Univ) |
3rd Author's Name |
Masayuki Murata |
3rd Author's Affiliation |
Osaka University (Osaka Univ) |
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Speaker |
Author-1 |
Date Time |
2013-05-17 11:10:00 |
Presentation Time |
25 minutes |
Registration for |
IN |
Paper # |
IN2013-20 |
Volume (vol) |
vol.113 |
Number (no) |
no.36 |
Page |
pp.49-54 |
#Pages |
6 |
Date of Issue |
2013-05-09 (IN) |
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