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Paper Abstract and Keywords
Presentation 2013-08-29 11:35
Low-crosstalk and high-modulation bandwidth operation of flip-chip interconnection EADFB laser array module
Shigeru Kanazawa, Takeshi Fujisawa, Kiyoto Takahata, Akira Ohki, Ryuzo Iga, Hiroyuki Ishii (NTT) R2013-34 EMD2013-40 CPM2013-59 OPE2013-63 LQE2013-33
Abstract (in Japanese) (See Japanese page) 
(in English) We developed the first EADFB laser array module with new flip-chip interconnects which provide low crosstalk and high modulation bandwidth. Under four-channel simultaneous operation, the 100GBASE-LR4 mask margin of the flip-chip interconnection module was improved up to 24% compared with that of a wire interconnection module.
Keyword (in Japanese) (See Japanese page) 
(in English) １００GigabitEthernet / semiconductor laser / EADFB laser / flip-chip interconnection / / / /  
Reference Info. IEICE Tech. Rep., vol. 113, no. 190, LQE2013-33, pp. 31-34, Aug. 2013.
Paper # LQE2013-33 
Date of Issue 2013-08-22 (R, EMD, CPM, OPE, LQE) 
ISSN Print edition: ISSN 0913-5685    Online edition: ISSN 2432-6380
Copyright
and
reproduction		 All rights are reserved and no part of this publication may be reproduced or transmitted in any form or by any means, electronic or mechanical, including photocopy, recording, or any information storage and retrieval system, without permission in writing from the publisher. Notwithstanding, instructors are permitted to photocopy isolated articles for noncommercial classroom use without fee. (License No.: 10GA0019/12GB0052/13GB0056/17GB0034/18GB0034)
Download PDF R2013-34 EMD2013-40 CPM2013-59 OPE2013-63 LQE2013-33

Conference Information
Committee OPE LQE CPM EMD R  
Conference Date 2013-08-29 - 2013-08-30 
Place (in Japanese) (See Japanese page) 
Place (in English) sun-refre Hakodate 
Topics (in Japanese) (See Japanese page) 
Topics (in English)  
Paper Information
Registration To LQE 
Conference Code 2013-08-OPE-LQE-CPM-EMD-R 
Language Japanese 
Title (in Japanese) (See Japanese page) 
Sub Title (in Japanese) (See Japanese page) 
Title (in English) Low-crosstalk and high-modulation bandwidth operation of flip-chip interconnection EADFB laser array module 
Sub Title (in English)  
Keyword(1) １００GigabitEthernet  
Keyword(2) semiconductor laser  
Keyword(3) EADFB laser  
Keyword(4) flip-chip interconnection  
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1st Author's Name Shigeru Kanazawa  
1st Author's Affiliation Nippon Telegraph and Telephone Corporation (NTT)
2nd Author's Name Takeshi Fujisawa  
2nd Author's Affiliation Nippon Telegraph and Telephone Corporation (NTT)
3rd Author's Name Kiyoto Takahata  
3rd Author's Affiliation Nippon Telegraph and Telephone Corporation (NTT)
4th Author's Name Akira Ohki  
4th Author's Affiliation Nippon Telegraph and Telephone Corporation (NTT)
5th Author's Name Ryuzo Iga  
5th Author's Affiliation Nippon Telegraph and Telephone Corporation (NTT)
6th Author's Name Hiroyuki Ishii  
6th Author's Affiliation Nippon Telegraph and Telephone Corporation (NTT)
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Speaker Author-1 
Date Time 2013-08-29 11:35:00 
Presentation Time 25 minutes 
Registration for LQE 
Paper # R2013-34, EMD2013-40, CPM2013-59, OPE2013-63, LQE2013-33 
Volume (vol) vol.113 
Number (no) no.186(R), no.187(EMD), no.188(CPM), no.189(OPE), no.190(LQE) 
Page pp.31-34 
#Pages 4 
Date of Issue 2013-08-22 (R, EMD, CPM, OPE, LQE) 

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