| Paper Abstract and Keywords |
| Presentation |
2014-01-23 11:00
Robust HTS-SQUID Covered with HTS Film in Flip-Chip Configuration Yoshimi Hatsukade, Keisuke Yoshida, Takahiro Kage, Toshifumi Suzuki, Saburo Tanaka (Toyohashi Univ. of Tech.) SCE2013-39 |
| Abstract |
(in Japanese) |
(See Japanese page) |
| (in English) |
In this paper, we describe recent results to develop robust HTS-SQUIDs based on bicystal SrTiO3 (STO) substrates and YBa2Cu3O7-x (YBCO) films. An alternative HTS film with mesh structure was fabricated and employed to cover an SQUID ring of a HTS-SQUID magnetometer with the same mesh structure in a flip-chip configuration. We expected the film would work as a superconducting shield to suppress change of the critical current Ic of the SQUID due to environmental magnetic noise, including the Earth’s field. We applied DC and AC magnetic fields to the SQUID, in order to measure the SQUID’s parameters such as Ic, voltage depth Vpp, flux noise level, and threshold DC field, at which the Ic was changed. Many of the SQUID’s parameters were improved with the HTS film. As for the threshold DC field, Ic of the SQUID changed at a DC field greater than about 140 T with the HTS film. In an AC field at 10 MHz, the voltage depth Vpp and flux noise level of the SQUID with the HTS film degraded at lower amplitude of the AC field than the bare SQUID without the HTS film. |
| Keyword |
(in Japanese) |
(See Japanese page) |
| (in English) |
HTS-SQUID / Robustness in magnetic field / alternative HTS film / Josephson junction / Meissner effect / / / |
| Reference Info. |
IEICE Tech. Rep., vol. 113, no. 401, SCE2013-39, pp. 25-29, Jan. 2014. |
| Paper # |
SCE2013-39 |
| Date of Issue |
2014-01-16 (SCE) |
| ISSN |
Print edition: ISSN 0913-5685 Online edition: ISSN 2432-6380 |
Copyright and reproduction |
All rights are reserved and no part of this publication may be reproduced or transmitted in any form or by any means, electronic or mechanical, including photocopy, recording, or any information storage and retrieval system, without permission in writing from the publisher. Notwithstanding, instructors are permitted to photocopy isolated articles for noncommercial classroom use without fee. (License No.: 10GA0019/12GB0052/13GB0056/17GB0034/18GB0034) |
| Download PDF |
SCE2013-39 |
| Conference Information |
| Committee |
SCE |
| Conference Date |
2014-01-23 - 2014-01-24 |
| Place (in Japanese) |
(See Japanese page) |
| Place (in English) |
Kikaishinkou-kaikan Bldg. |
| Topics (in Japanese) |
(See Japanese page) |
| Topics (in English) |
Thin film, device technologies and their applications, etc. |
| Paper Information |
| Registration To |
SCE |
| Conference Code |
2014-01-SCE |
| Language |
Japanese |
| Title (in Japanese) |
(See Japanese page) |
| Sub Title (in Japanese) |
(See Japanese page) |
| Title (in English) |
Robust HTS-SQUID Covered with HTS Film in Flip-Chip Configuration |
| Sub Title (in English) |
|
| Keyword(1) |
HTS-SQUID |
| Keyword(2) |
Robustness in magnetic field |
| Keyword(3) |
alternative HTS film |
| Keyword(4) |
Josephson junction |
| Keyword(5) |
Meissner effect |
| Keyword(6) |
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| Keyword(7) |
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| Keyword(8) |
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| 1st Author's Name |
Yoshimi Hatsukade |
| 1st Author's Affiliation |
Toyohashi University of Technology (Toyohashi Univ. of Tech.) |
| 2nd Author's Name |
Keisuke Yoshida |
| 2nd Author's Affiliation |
Toyohashi University of Technology (Toyohashi Univ. of Tech.) |
| 3rd Author's Name |
Takahiro Kage |
| 3rd Author's Affiliation |
Toyohashi University of Technology (Toyohashi Univ. of Tech.) |
| 4th Author's Name |
Toshifumi Suzuki |
| 4th Author's Affiliation |
Toyohashi University of Technology (Toyohashi Univ. of Tech.) |
| 5th Author's Name |
Saburo Tanaka |
| 5th Author's Affiliation |
Toyohashi University of Technology (Toyohashi Univ. of Tech.) |
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| Speaker |
Author-1 |
| Date Time |
2014-01-23 11:00:00 |
| Presentation Time |
25 minutes |
| Registration for |
SCE |
| Paper # |
SCE2013-39 |
| Volume (vol) |
vol.113 |
| Number (no) |
no.401 |
| Page |
pp.25-29 |
| #Pages |
5 |
| Date of Issue |
2014-01-16 (SCE) |