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Paper Abstract and Keywords
Presentation 2014-01-24 10:50
Exploring the Capability of Linux Ethernet Bonding from the Application Perspective
Hoang Tran Viet, Toan Nguyen Duc (Hanoi Univ. of Science and Tech.), Kien Nguyen, Quang Tran Minh, Shigeki Yamada (NII) CQ2013-71
Abstract (in Japanese) (See Japanese page) 
(in English) Linux Ethernet bonding is a feature that allows grouping multiple physical network interfaces into a logical one, aiming to improve fault tolerance and network throughput. Although Linux bonding has been deployed in various network scenarios, its performance has not been well investigated. Addressing the problem, in this paper we present an evaluation of Linux bonding in order to explore its capabilities in a real testbed. Different from other works, in the evaluation we consider the traffic flows of network applications as well as examine various modes supported by Linux bonding. The evaluation results show that Linux bonding can provide the flow switch-over time - the duration of traffic flow discontinuation due to a network failure - as small as 10 milliseconds. Moreover, in a non-f?ailure scenario with file transfer protocol (FTP), the Linux machines with bonding reduce the time of file transfer process to nearly a half comparing to the one in case of without bonding.
Keyword (in Japanese) (See Japanese page) 
(in English) Bonding / Linux / Fault Tolerance / Interface Aggregation / Link Aggregation / switch-over / Load balancing / Throughput  
Reference Info. IEICE Tech. Rep., vol. 113, no. 405, CQ2013-71, pp. 23-28, Jan. 2014.
Paper # CQ2013-71 
Date of Issue 2014-01-17 (CQ) 
ISSN Print edition: ISSN 0913-5685    Online edition: ISSN 2432-6380
Copyright
and
reproduction		 All rights are reserved and no part of this publication may be reproduced or transmitted in any form or by any means, electronic or mechanical, including photocopy, recording, or any information storage and retrieval system, without permission in writing from the publisher. Notwithstanding, instructors are permitted to photocopy isolated articles for noncommercial classroom use without fee. (License No.: 10GA0019/12GB0052/13GB0056/17GB0034/18GB0034)
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Conference Information
Committee CQ  
Conference Date 2014-01-24 - 2014-01-24 
Place (in Japanese) (See Japanese page) 
Place (in English) Tokyo City University 
Topics (in Japanese) (See Japanese page) 
Topics (in English) Audio and video quality, Multi-sensory media quality, SDN (Software-Defined Network), Network service quality, Wireless network quality, Network measurement, general fields 
Paper Information
Registration To CQ 
Conference Code 2014-01-CQ 
Language English 
Title (in Japanese) (See Japanese page) 
Sub Title (in Japanese) (See Japanese page) 
Title (in English) Exploring the Capability of Linux Ethernet Bonding from the Application Perspective 
Sub Title (in English)  
Keyword(1) Bonding  
Keyword(2) Linux  
Keyword(3) Fault Tolerance  
Keyword(4) Interface Aggregation  
Keyword(5) Link Aggregation  
Keyword(6) switch-over  
Keyword(7) Load balancing  
Keyword(8) Throughput  
1st Author's Name Hoang Tran Viet  
1st Author's Affiliation Hanoi University of Science and Technology (Hanoi Univ. of Science and Tech.)
2nd Author's Name Toan Nguyen Duc  
2nd Author's Affiliation Hanoi University of Science and Technology (Hanoi Univ. of Science and Tech.)
3rd Author's Name Kien Nguyen  
3rd Author's Affiliation National Institute of Informatics (NII)
4th Author's Name Quang Tran Minh  
4th Author's Affiliation National Institute of Informatics (NII)
5th Author's Name Shigeki Yamada  
5th Author's Affiliation National Institute of Informatics (NII)
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Speaker Author-1 
Date Time 2014-01-24 10:50:00 
Presentation Time 25 minutes 
Registration for CQ 
Paper # CQ2013-71 
Volume (vol) vol.113 
Number (no) no.405 
Page pp.23-28 
#Pages 6 
Date of Issue 2014-01-17 (CQ) 

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