Information: Join today and make your research activities more affordable! Technical workshop participation fees and annual registration fees are available at member rates.
Notice: [Important] Announcement of Changes to Registration Fee Payment and Manuscript Upload Procedures for IEICE Technical Meetings
IEICE Technical Committee Submission System
Conference Paper's Information		 Online Proceedings
[Sign in]
Tech. Rep. Archives
 Go Top Page Go Previous   [Japanese] / [English] 

Paper Abstract and Keywords
Presentation 2014-06-20 15:45
Analysis of Conductive and Inductive Noise Couplings on TEG Chip with Magnetic Thin Film
Sho Muroga, Fan Peng, Satoshi Tanaka (Tohoku Univ.), Tomomitsu Kitamura (Renesas SP Drivers), Hiroaki Matsui (Renesaselectronics), Naoya Azuma, Shunsuke Shimazaki, Junpei Kosaka, Makoto Nagata (Kobe Univ.), Masahiro Yamaguchi (Tohoku Univ.) EMCJ2014-16
Abstract (in Japanese) (See Japanese page) 
(in English) (Not available yet)
Keyword (in Japanese) (See Japanese page) 
(in English) / / / / / / /  
Reference Info. IEICE Tech. Rep., vol. 114, no. 93, EMCJ2014-16, pp. 55-58, June 2014.
Paper # EMCJ2014-16 
Date of Issue 2014-06-13 (EMCJ) 
ISSN Print edition: ISSN 0913-5685    Online edition: ISSN 2432-6380
Copyright
and
reproduction		 All rights are reserved and no part of this publication may be reproduced or transmitted in any form or by any means, electronic or mechanical, including photocopy, recording, or any information storage and retrieval system, without permission in writing from the publisher. Notwithstanding, instructors are permitted to photocopy isolated articles for noncommercial classroom use without fee. (License No.: 10GA0019/12GB0052/13GB0056/17GB0034/18GB0034)
Download PDF EMCJ2014-16

Conference Information
Committee EMCJ IEE-EMC  
Conference Date 2014-06-20 - 2014-06-20 
Place (in Japanese) (See Japanese page) 
Place (in English) Kobe Univ. 
Topics (in Japanese) (See Japanese page) 
Topics (in English) PCB, Information Security, EMC 
Paper Information
Registration To EMCJ 
Conference Code 2014-06-EMCJ-EMC 
Language Japanese 
Title (in Japanese) (See Japanese page) 
Sub Title (in Japanese) (See Japanese page) 
Title (in English) Analysis of Conductive and Inductive Noise Couplings on TEG Chip with Magnetic Thin Film 
Sub Title (in English)  
Keyword(1)  
Keyword(2)  
Keyword(3)  
Keyword(4)  
Keyword(5)  
Keyword(6)  
Keyword(7)  
Keyword(8)  
1st Author's Name Sho Muroga  
1st Author's Affiliation Tohoku University (Tohoku Univ.)
2nd Author's Name Fan Peng  
2nd Author's Affiliation Tohoku University (Tohoku Univ.)
3rd Author's Name Satoshi Tanaka  
3rd Author's Affiliation Tohoku University (Tohoku Univ.)
4th Author's Name Tomomitsu Kitamura  
4th Author's Affiliation Renesas SP Drivers Inc. (Renesas SP Drivers)
5th Author's Name Hiroaki Matsui  
5th Author's Affiliation Renesaselectronics Corporation (Renesaselectronics)
6th Author's Name Naoya Azuma  
6th Author's Affiliation Kobe University (Kobe Univ.)
7th Author's Name Shunsuke Shimazaki  
7th Author's Affiliation Kobe University (Kobe Univ.)
8th Author's Name Junpei Kosaka  
8th Author's Affiliation Kobe University (Kobe Univ.)
9th Author's Name Makoto Nagata  
9th Author's Affiliation Kobe University (Kobe Univ.)
10th Author's Name Masahiro Yamaguchi  
10th Author's Affiliation Tohoku University (Tohoku Univ.)
11th Author's Name  
11th Author's Affiliation ()
12th Author's Name  
12th Author's Affiliation ()
13th Author's Name  
13th Author's Affiliation ()
14th Author's Name  
14th Author's Affiliation ()
15th Author's Name  
15th Author's Affiliation ()
16th Author's Name  
16th Author's Affiliation ()
17th Author's Name  
17th Author's Affiliation ()
18th Author's Name  
18th Author's Affiliation ()
19th Author's Name  
19th Author's Affiliation ()
20th Author's Name  
20th Author's Affiliation ()
21st Author's Name  
21st Author's Affiliation ()
22nd Author's Name  
22nd Author's Affiliation ()
23rd Author's Name  
23rd Author's Affiliation ()
24th Author's Name  
24th Author's Affiliation ()
25th Author's Name  
25th Author's Affiliation ()
26th Author's Name / /
26th Author's Affiliation ()
()
27th Author's Name / /
27th Author's Affiliation ()
()
28th Author's Name / /
28th Author's Affiliation ()
()
29th Author's Name / /
29th Author's Affiliation ()
()
30th Author's Name / /
30th Author's Affiliation ()
()
31st Author's Name / /
31st Author's Affiliation ()
()
32nd Author's Name / /
32nd Author's Affiliation ()
()
33rd Author's Name / /
33rd Author's Affiliation ()
()
34th Author's Name / /
34th Author's Affiliation ()
()
35th Author's Name / /
35th Author's Affiliation ()
()
36th Author's Name / /
36th Author's Affiliation ()
()
Speaker Author-1 
Date Time 2014-06-20 15:45:00 
Presentation Time 25 minutes 
Registration for EMCJ 
Paper # EMCJ2014-16 
Volume (vol) vol.114 
Number (no) no.93 
Page pp.55-58 
#Pages 4 
Date of Issue 2014-06-13 (EMCJ) 

[Return to Top Page]

[Return to IEICE Web Page]
The Institute of Electronics, Information and Communication Engineers (IEICE), Japan