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Paper Abstract and Keywords
Presentation 2014-06-20 13:25
A Fundamental Study on Derivation of EMI from Through Silicon Vias (TSV)
Masashi Kawakami, Kenji Hashimoto (UEC), Kimitoshi Murano (Tokai Univ.), Yoshio Kami, Fengchao Xiao (UEC) EMCJ2014-14
Abstract (in Japanese) (See Japanese page) 
(in English) In recent years, through-silicon via (TSV) technology has attracted attention in the field of 3D packaging technology.
However, research of EMC on TSV is just beginning.
In this report, we have proposed an equivalent circuit model based on a distributed constant circuit simulating the TSV pairs to theoretically derive radiation EMI from TSV.
The radiated electric fields is derived from the vector potential by using the equivalent circuit model.
Keyword (in Japanese) (See Japanese page) 
(in English) TSV / Equivalent circuit / Vector potential / / / / /  
Reference Info. IEICE Tech. Rep., vol. 114, no. 93, EMCJ2014-14, pp. 25-30, June 2014.
Paper # EMCJ2014-14 
Date of Issue 2014-06-13 (EMCJ) 
ISSN Print edition: ISSN 0913-5685    Online edition: ISSN 2432-6380
Copyright
and
reproduction		 All rights are reserved and no part of this publication may be reproduced or transmitted in any form or by any means, electronic or mechanical, including photocopy, recording, or any information storage and retrieval system, without permission in writing from the publisher. Notwithstanding, instructors are permitted to photocopy isolated articles for noncommercial classroom use without fee. (License No.: 10GA0019/12GB0052/13GB0056/17GB0034/18GB0034)
Download PDF EMCJ2014-14

Conference Information
Committee EMCJ IEE-EMC  
Conference Date 2014-06-20 - 2014-06-20 
Place (in Japanese) (See Japanese page) 
Place (in English) Kobe Univ. 
Topics (in Japanese) (See Japanese page) 
Topics (in English) PCB, Information Security, EMC 
Paper Information
Registration To EMCJ 
Conference Code 2014-06-EMCJ-EMC 
Language Japanese 
Title (in Japanese) (See Japanese page) 
Sub Title (in Japanese) (See Japanese page) 
Title (in English) A Fundamental Study on Derivation of EMI from Through Silicon Vias (TSV) 
Sub Title (in English)  
Keyword(1) TSV  
Keyword(2) Equivalent circuit  
Keyword(3) Vector potential  
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1st Author's Name Masashi Kawakami  
1st Author's Affiliation The University of Electro-Communications (UEC)
2nd Author's Name Kenji Hashimoto  
2nd Author's Affiliation The University of Electro-Communications (UEC)
3rd Author's Name Kimitoshi Murano  
3rd Author's Affiliation Tokai University (Tokai Univ.)
4th Author's Name Yoshio Kami  
4th Author's Affiliation The University of Electro-Communications (UEC)
5th Author's Name Fengchao Xiao  
5th Author's Affiliation The University of Electro-Communications (UEC)
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Speaker Author-1 
Date Time 2014-06-20 13:25:00 
Presentation Time 25 minutes 
Registration for EMCJ 
Paper # EMCJ2014-14 
Volume (vol) vol.114 
Number (no) no.93 
Page pp.25-30 
#Pages 6 
Date of Issue 2014-06-13 (EMCJ) 

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