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| Presentation | 2014-07-11 13:35 Effect of adding bypass capacitors between partially formed power and ground layers and resulting PCB noise reduction Takahide Nozaki, Hideyuki Nakanishi, Akihiro Tanaka (RITA Electronics)  EMCJ2014-26 EMD2014-23 Link to ES Tech. Rep. Archives: EMD2014-23 |
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| Abstract | (in Japanese) | (See Japanese page) |
| (in English) | In the power supply to the semiconductor on PCB, we verified that the radiation noise can be reduced by forming power and ground opposite site, and that the transfer impedance (Z21) is effective as this parameter. Moreover, we verified reduction of the radiation noise by using a bypass capacitor together. By forming the power supply GND opposing part, and, by adding the bypass capacitor, it is possible to reduce the radiation noise of the power supply system. Further, radiation noise has been found to have a correlation with the Z21. | |
| Keyword | (in Japanese) | (See Japanese page) |
| (in English) | noise / transfer impedance / bypass capacitors / / / / / | |
| Reference Info. | IEICE Tech. Rep., vol. 114, no. 135, EMCJ2014-26, pp. 1-5, July 2014. | |
| Paper # | EMCJ2014-26 | |
| Date of Issue | 2014-07-04 (EMCJ, EMD) | |
| ISSN | Print edition: ISSN 0913-5685 Online edition: ISSN 2432-6380 | |
| Copyright and reproduction |
All rights are reserved and no part of this publication may be reproduced or transmitted in any form or by any means, electronic or mechanical, including photocopy, recording, or any information storage and retrieval system, without permission in writing from the publisher. Notwithstanding, instructors are permitted to photocopy isolated articles for noncommercial classroom use without fee. (License No.: 10GA0019/12GB0052/13GB0056/17GB0034/18GB0034) | |
| Download PDF | EMCJ2014-26 EMD2014-23 Link to ES Tech. Rep. Archives: EMD2014-23 |
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| Conference Information | |
| Committee | EMCJ EMD |
| Conference Date | 2014-07-11 - 2014-07-11 |
| Place (in Japanese) | (See Japanese page) |
| Place (in English) | Kikai-Shinko-Kaikan Bldg. |
| Topics (in Japanese) | (See Japanese page) |
| Topics (in English) | Discharge, Electronic Packaging, EMC |
| Paper Information | |
| Registration To | EMCJ |
| Conference Code | 2014-07-EMCJ-EMD |
| Language | Japanese |
| Title (in Japanese) | (See Japanese page) |
| Sub Title (in Japanese) | (See Japanese page) |
| Title (in English) | Effect of adding bypass capacitors between partially formed power and ground layers and resulting PCB noise reduction |
| Sub Title (in English) | |
| Keyword(1) | noise |
| Keyword(2) | transfer impedance |
| Keyword(3) | bypass capacitors |
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| 1st Author's Name | Takahide Nozaki |
| 1st Author's Affiliation | RITA Electronics, Ltd. (RITA Electronics) |
| 2nd Author's Name | Hideyuki Nakanishi |
| 2nd Author's Affiliation | RITA Electronics, Ltd. (RITA Electronics) |
| 3rd Author's Name | Akihiro Tanaka |
| 3rd Author's Affiliation | RITA Electronics, Ltd. (RITA Electronics) |
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| Speaker | Author-1 |
| Date Time | 2014-07-11 13:35:00 |
| Presentation Time | 25 minutes |
| Registration for | EMCJ |
| Paper # | EMCJ2014-26, EMD2014-23 |
| Volume (vol) | vol.114 |
| Number (no) | no.135(EMCJ), no.136(EMD) |
| Page | pp.1-5 |
| #Pages | 5 |
| Date of Issue | 2014-07-04 (EMCJ, EMD) |
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