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Paper Abstract and Keywords
Presentation 2014-12-15 15:50
Ultrasonic Welding of Electronic Parts and Devices Using a Long and Thin Complex Transverse Vibration Welding Tip -- Ultrasonic complex vibration welding of narrow and deep welding positions --
Jiromaru Tsujino (Kanagawa Univ./Asahi EMS) US2014-70
Abstract (in Japanese) (See Japanese page) 
(in English) Ultrasonic complex vibration welding was applied for deep and narrow area of electronic parts positioned at long distance from the vibration system. Usually, electric resistance welding or laser welding methods are used to weld such part, but there are possible defect caused by melted and sparked metal particles radiated from welding position. To overcome the defect and make possible to join such deep area, 20 kHz and 27 kHz ultrasonic complex vibration systems using 2.0- and 3.0-mm-diameter, 70- to 100-mm-long hard metal and tungsten welding tips were developed. Using the ultrasonic complex vibration systems, various metal specimens including copper, nickel clad copper terminal and steel or nickel coated steel cases were successfully welded with weld strength almost equal to these material strength. Using ultrasonic complex vibration welding with elliptical to circular vibration locus, required vibration amplitude, static pressure and welding time decrease significantly and stable and uniform welding become possible independent of welding direction. And also, damage of specimen by vibration decreases and larger weld strength obtained compared with conventional ultrasonic welding using linear vibration. Ultrasonic welding is clean and energy-saving method.
Keyword (in Japanese) (See Japanese page) 
(in English) Ultrasonic welding for deep and narrow area / Ultrasonic complex vibration welding / Ultrasonic welding of nickel, copper and aluminum terminal / Ultrasonic welding of inner bottom of nickel coated steel case / Ultrasonic welding of various electronic parts / Hard metal welding tip / /  
Reference Info. IEICE Tech. Rep., vol. 114, no. 363, US2014-70, pp. 29-34, Dec. 2014.
Paper # US2014-70 
Date of Issue 2014-12-08 (US) 
ISSN Print edition: ISSN 0913-5685    Online edition: ISSN 2432-6380
Copyright
and
reproduction		 All rights are reserved and no part of this publication may be reproduced or transmitted in any form or by any means, electronic or mechanical, including photocopy, recording, or any information storage and retrieval system, without permission in writing from the publisher. Notwithstanding, instructors are permitted to photocopy isolated articles for noncommercial classroom use without fee. (License No.: 10GA0019/12GB0052/13GB0056/17GB0034/18GB0034)
Download PDF US2014-70

Conference Information
Committee US  
Conference Date 2014-12-15 - 2014-12-15 
Place (in Japanese) (See Japanese page) 
Place (in English) Tokyo Institute of Technology, Suzukakedai Campus 
Topics (in Japanese) (See Japanese page) 
Topics (in English) High Power Ultrasound, General 
Paper Information
Registration To US 
Conference Code 2014-12-US 
Language English (Japanese title is available) 
Title (in Japanese) (See Japanese page) 
Sub Title (in Japanese) (See Japanese page) 
Title (in English) Ultrasonic Welding of Electronic Parts and Devices Using a Long and Thin Complex Transverse Vibration Welding Tip 
Sub Title (in English) Ultrasonic complex vibration welding of narrow and deep welding positions 
Keyword(1) Ultrasonic welding for deep and narrow area  
Keyword(2) Ultrasonic complex vibration welding  
Keyword(3) Ultrasonic welding of nickel, copper and aluminum terminal  
Keyword(4) Ultrasonic welding of inner bottom of nickel coated steel case  
Keyword(5) Ultrasonic welding of various electronic parts  
Keyword(6) Hard metal welding tip  
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Keyword(8)  
1st Author's Name Jiromaru Tsujino  
1st Author's Affiliation Kanagawa University/Asahi EMS Co. Ltd (Kanagawa Univ./Asahi EMS)
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Speaker Author-1 
Date Time 2014-12-15 15:50:00 
Presentation Time 25 minutes 
Registration for US 
Paper # US2014-70 
Volume (vol) vol.114 
Number (no) no.363 
Page pp.29-34 
#Pages 6 
Date of Issue 2014-12-08 (US) 

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