IEICE Technical Committee Submission System
Conference Paper's Information
Online Proceedings
[Sign in]
Tech. Rep. Archives
 Go Top Page Go Previous   [Japanese] / [English] 

Paper Abstract and Keywords
Presentation 2014-12-22 16:35
Quantitative detection of copper surface cracks by terahertz reflection imaging
Seiya Takahashi, Tadao Tanabe, Kensaku Maeda, Tomoyuki Hamano, Kaori Nakajima, Yutaka Oyama (Tohoku Univ.) ED2014-105 Link to ES Tech. Rep. Archives: ED2014-105
Abstract (in Japanese) (See Japanese page) 
(in English) Terahertz wave has been expected to be a novel non-destructive inspection tool especially for metals shielded by insulating polymer, for example insulated copper cables and painted steel because terahertz wave has high transmittance for polymers and high reflectance from metals. Terahertz reflection imaging was applied to copper plate sample that had been artificially cracked. It was shown that a crack in the copper plate surface can be clearly seen by a decrease in the intensity of the reflected signal, and that variable size crack can be quantitatively detected. This result will be useful for terahertz practical application as a non-destructive inspection tool.
Keyword (in Japanese) (See Japanese page) 
(in English) Terahertz waves / Imaging / Non-destructive inspection / / / / /  
Reference Info. IEICE Tech. Rep., vol. 114, no. 387, ED2014-105, pp. 39-43, Dec. 2014.
Paper # ED2014-105 
Date of Issue 2014-12-15 (ED) 
ISSN Print edition: ISSN 0913-5685    Online edition: ISSN 2432-6380
Copyright
and
reproduction
All rights are reserved and no part of this publication may be reproduced or transmitted in any form or by any means, electronic or mechanical, including photocopy, recording, or any information storage and retrieval system, without permission in writing from the publisher. Notwithstanding, instructors are permitted to photocopy isolated articles for noncommercial classroom use without fee. (License No.: 10GA0019/12GB0052/13GB0056/17GB0034/18GB0034)
Download PDF ED2014-105 Link to ES Tech. Rep. Archives: ED2014-105

Conference Information
Committee ED  
Conference Date 2014-12-22 - 2014-12-23 
Place (in Japanese) (See Japanese page) 
Place (in English)  
Topics (in Japanese) (See Japanese page) 
Topics (in English)  
Paper Information
Registration To ED 
Conference Code 2014-12-ED 
Language Japanese 
Title (in Japanese) (See Japanese page) 
Sub Title (in Japanese) (See Japanese page) 
Title (in English) Quantitative detection of copper surface cracks by terahertz reflection imaging 
Sub Title (in English)  
Keyword(1) Terahertz waves  
Keyword(2) Imaging  
Keyword(3) Non-destructive inspection  
Keyword(4)  
Keyword(5)  
Keyword(6)  
Keyword(7)  
Keyword(8)  
1st Author's Name Seiya Takahashi  
1st Author's Affiliation Tohoku University (Tohoku Univ.)
2nd Author's Name Tadao Tanabe  
2nd Author's Affiliation Tohoku University (Tohoku Univ.)
3rd Author's Name Kensaku Maeda  
3rd Author's Affiliation Tohoku University (Tohoku Univ.)
4th Author's Name Tomoyuki Hamano  
4th Author's Affiliation Tohoku University (Tohoku Univ.)
5th Author's Name Kaori Nakajima  
5th Author's Affiliation Tohoku University (Tohoku Univ.)
6th Author's Name Yutaka Oyama  
6th Author's Affiliation Tohoku University (Tohoku Univ.)
7th Author's Name  
7th Author's Affiliation ()
8th Author's Name  
8th Author's Affiliation ()
9th Author's Name  
9th Author's Affiliation ()
10th Author's Name  
10th Author's Affiliation ()
11th Author's Name  
11th Author's Affiliation ()
12th Author's Name  
12th Author's Affiliation ()
13th Author's Name  
13th Author's Affiliation ()
14th Author's Name  
14th Author's Affiliation ()
15th Author's Name  
15th Author's Affiliation ()
16th Author's Name  
16th Author's Affiliation ()
17th Author's Name  
17th Author's Affiliation ()
18th Author's Name  
18th Author's Affiliation ()
19th Author's Name  
19th Author's Affiliation ()
20th Author's Name  
20th Author's Affiliation ()
Speaker Author-1 
Date Time 2014-12-22 16:35:00 
Presentation Time 25 minutes 
Registration for ED 
Paper # ED2014-105 
Volume (vol) vol.114 
Number (no) no.387 
Page pp.39-43 
#Pages
Date of Issue 2014-12-15 (ED) 


[Return to Top Page]

[Return to IEICE Web Page]


The Institute of Electronics, Information and Communication Engineers (IEICE), Japan