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Paper Abstract and Keywords
Presentation 2015-01-27 14:25
[Invited Talk] Three-Dimensional Integrated CMOS Image Sensors with Pixel-Parallel A/D Converters Fabricated by Direct Bonding of SOI Layers
Masahide Goto, Kei Hagiwara, Yoshinori Iguchi, Hiroshi Ohtake (NHK), Takuya Saraya, Masaharu Kobayashi, Eiji Higurashi, Hiroshi Toshiyoshi, Toshiro Hiramoto (The Univ. of Tokyo) SDM2014-141
Abstract (in Japanese) (See Japanese page) 
(in English) We report the first demonstration of three-dimensional (3D) integrated CMOS image sensors with pixel-parallel A/D converters (ADCs), thereby meeting the demand for high resolution and high frame rate imaging. Photodiode (PD) and inverter layers were directly bonded with the damascened Au electrodes to provide each pixel with in-pixel A/D conversion. We designed ADC with a pulse frequency output and fabricated a prototype sensor with 64 pixels. The developed sensor successfully captured video images and confirmed excellent linearity with a wide dynamic range of more than 80 dB, which showed feasibility of pixel-level 3D integration for high-performance CMOS image sensors.
Keyword (in Japanese) (See Japanese page) 
(in English) Image sensor / A/D Conversion / 3D Integration / SOI / / / /  
Reference Info. IEICE Tech. Rep., vol. 114, no. 421, SDM2014-141, pp. 25-28, Jan. 2015.
Paper # SDM2014-141 
Date of Issue 2015-01-20 (SDM) 
ISSN Print edition: ISSN 0913-5685    Online edition: ISSN 2432-6380
Copyright
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reproduction		 All rights are reserved and no part of this publication may be reproduced or transmitted in any form or by any means, electronic or mechanical, including photocopy, recording, or any information storage and retrieval system, without permission in writing from the publisher. Notwithstanding, instructors are permitted to photocopy isolated articles for noncommercial classroom use without fee. (License No.: 10GA0019/12GB0052/13GB0056/17GB0034/18GB0034)
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Conference Information
Committee SDM  
Conference Date 2015-01-27 - 2015-01-27 
Place (in Japanese) (See Japanese page) 
Place (in English) Kikai-Shinko-Kaikan Bldg. 
Topics (in Japanese) (See Japanese page) 
Topics (in English)  
Paper Information
Registration To SDM 
Conference Code 2015-01-SDM 
Language Japanese 
Title (in Japanese) (See Japanese page) 
Sub Title (in Japanese) (See Japanese page) 
Title (in English) Three-Dimensional Integrated CMOS Image Sensors with Pixel-Parallel A/D Converters Fabricated by Direct Bonding of SOI Layers 
Sub Title (in English)  
Keyword(1) Image sensor  
Keyword(2) A/D Conversion  
Keyword(3) 3D Integration  
Keyword(4) SOI  
Keyword(5)  
Keyword(6)  
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1st Author's Name Masahide Goto  
1st Author's Affiliation Japan Broadcasting Corporation (NHK)
2nd Author's Name Kei Hagiwara  
2nd Author's Affiliation Japan Broadcasting Corporation (NHK)
3rd Author's Name Yoshinori Iguchi  
3rd Author's Affiliation Japan Broadcasting Corporation (NHK)
4th Author's Name Hiroshi Ohtake  
4th Author's Affiliation Japan Broadcasting Corporation (NHK)
5th Author's Name Takuya Saraya  
5th Author's Affiliation The University of Tokyo (The Univ. of Tokyo)
6th Author's Name Masaharu Kobayashi  
6th Author's Affiliation The University of Tokyo (The Univ. of Tokyo)
7th Author's Name Eiji Higurashi  
7th Author's Affiliation The University of Tokyo (The Univ. of Tokyo)
8th Author's Name Hiroshi Toshiyoshi  
8th Author's Affiliation The University of Tokyo (The Univ. of Tokyo)
9th Author's Name Toshiro Hiramoto  
9th Author's Affiliation The University of Tokyo (The Univ. of Tokyo)
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Speaker Author-1 
Date Time 2015-01-27 14:25:00 
Presentation Time 25 minutes 
Registration for SDM 
Paper # SDM2014-141 
Volume (vol) vol.114 
Number (no) no.421 
Page pp.25-28 
#Pages 4 
Date of Issue 2015-01-20 (SDM) 

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