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Paper Abstract and Keywords
Presentation 2015-03-06 15:45
Effects of On-Board Noise Remedy at IC Chip Level Noise Reduction -- A Case Study in LTE-Class IC Chip --
Junpei Kousaka, Shunsuke Shimazaki, Noriyuki Miura (Kobe Univ.), Sho Muroga, Satoshi Tanaka, Masahiro Yamaguchi (Tohoku Univ.), Makoto Nagata (Kobe Univ.) EMCJ2014-108
Abstract (in Japanese) (See Japanese page) 
(in English) Digital circuits in a mobile communication IC Chip become more enormous for LTE class design. This potentially causes the undesigned noise coupling in the receiver circuit and leads to the deterioration of overall system communication quality. In this study, noise reduction techniques have been explored. A prototype chip having a digital noise generator, LTE-class wireless receiver circuit and on-chip voltage waveform monitor, EMI tester, and the system level simulator for measuring communication quality are prepared for this study. We measured and analyzed the effect of three terminal capacitor on the chip and board level noise coupling. As a result, it exhibits a noise reduction effect of 5dB at the system level in the 2GHz band used in LTE. This will improve communication quality.
Keyword (in Japanese) (See Japanese page) 
(in English) EMC / LTE / Digital Circuit / Noise / Three Terminal Capacitor / / /  
Reference Info. IEICE Tech. Rep., vol. 114, no. 503, EMCJ2014-108, pp. 35-40, March 2015.
Paper # EMCJ2014-108 
Date of Issue 2015-02-27 (EMCJ) 
ISSN Print edition: ISSN 0913-5685    Online edition: ISSN 2432-6380
Copyright
and
reproduction		 All rights are reserved and no part of this publication may be reproduced or transmitted in any form or by any means, electronic or mechanical, including photocopy, recording, or any information storage and retrieval system, without permission in writing from the publisher. Notwithstanding, instructors are permitted to photocopy isolated articles for noncommercial classroom use without fee. (License No.: 10GA0019/12GB0052/13GB0056/17GB0034/18GB0034)
Download PDF EMCJ2014-108

Conference Information
Committee EMCJ  
Conference Date 2015-03-06 - 2015-03-06 
Place (in Japanese) (See Japanese page) 
Place (in English) Kikai-Shinko-Kaikan Bldg. 
Topics (in Japanese) (See Japanese page) 
Topics (in English) EMC, etc. 
Paper Information
Registration To EMCJ 
Conference Code 2015-03-EMCJ 
Language Japanese 
Title (in Japanese) (See Japanese page) 
Sub Title (in Japanese) (See Japanese page) 
Title (in English) Effects of On-Board Noise Remedy at IC Chip Level Noise Reduction 
Sub Title (in English) A Case Study in LTE-Class IC Chip 
Keyword(1) EMC  
Keyword(2) LTE  
Keyword(3) Digital Circuit  
Keyword(4) Noise  
Keyword(5) Three Terminal Capacitor  
Keyword(6)  
Keyword(7)  
Keyword(8)  
1st Author's Name Junpei Kousaka  
1st Author's Affiliation Kobe University (Kobe Univ.)
2nd Author's Name Shunsuke Shimazaki  
2nd Author's Affiliation Kobe University (Kobe Univ.)
3rd Author's Name Noriyuki Miura  
3rd Author's Affiliation Kobe University (Kobe Univ.)
4th Author's Name Sho Muroga  
4th Author's Affiliation Tohoku University (Tohoku Univ.)
5th Author's Name Satoshi Tanaka  
5th Author's Affiliation Tohoku University (Tohoku Univ.)
6th Author's Name Masahiro Yamaguchi  
6th Author's Affiliation Tohoku University (Tohoku Univ.)
7th Author's Name Makoto Nagata  
7th Author's Affiliation Kobe University (Kobe Univ.)
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Speaker Author-1 
Date Time 2015-03-06 15:45:00 
Presentation Time 25 minutes 
Registration for EMCJ 
Paper # EMCJ2014-108 
Volume (vol) vol.114 
Number (no) no.503 
Page pp.35-40 
#Pages 6 
Date of Issue 2015-02-27 (EMCJ) 

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