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Paper Abstract and Keywords
Presentation 2015-03-06 15:20
A Technique for Improving Isolation of Devices Using Surface-Mounted Resistors and a Metal Plate
Yasuo Morimoto, Takeshi Yuasa (Mitsubishi Electric), Kenji Maeda, Norio Takeuchi (Mitsubishi Electric Engineering), Yukihiro Tahara (Mitsubishi Electric) EMCJ2014-107
Abstract (in Japanese) (See Japanese page) 
(in English) When RF-devices are enclosed in a large metal case, coupling between a circuit and another circuit via the resonant cavity modes of the case may disturb module operation. A novel technique to achieve high isolation for RF-modules is presented. The technique consists of a metal plate covering some devices and several chip resistors connected with the plate. And it is also effective in non-cutoff structures, such as millimeter wave modules. In a cavity of 10 mm × 10 mm × 3mm having dominant resonant of 21 GHz, the high isolation up to 36GHz is confirmed by electromagnetic simulation. A consideration of the measurement results demonstrates high isolation up to 27GHz. In this paper, we explain how to give high isolation, the measurements and the consideration.
Keyword (in Japanese) (See Japanese page) 
(in English) shild / module / package / isolation / surface mount device / metal plate cover / chip resistor /  
Reference Info. IEICE Tech. Rep., vol. 114, no. 503, EMCJ2014-107, pp. 29-34, March 2015.
Paper # EMCJ2014-107 
Date of Issue 2015-02-27 (EMCJ) 
ISSN Print edition: ISSN 0913-5685    Online edition: ISSN 2432-6380
Copyright
and
reproduction		 All rights are reserved and no part of this publication may be reproduced or transmitted in any form or by any means, electronic or mechanical, including photocopy, recording, or any information storage and retrieval system, without permission in writing from the publisher. Notwithstanding, instructors are permitted to photocopy isolated articles for noncommercial classroom use without fee. (License No.: 10GA0019/12GB0052/13GB0056/17GB0034/18GB0034)
Download PDF EMCJ2014-107

Conference Information
Committee EMCJ  
Conference Date 2015-03-06 - 2015-03-06 
Place (in Japanese) (See Japanese page) 
Place (in English) Kikai-Shinko-Kaikan Bldg. 
Topics (in Japanese) (See Japanese page) 
Topics (in English) EMC, etc. 
Paper Information
Registration To EMCJ 
Conference Code 2015-03-EMCJ 
Language Japanese 
Title (in Japanese) (See Japanese page) 
Sub Title (in Japanese) (See Japanese page) 
Title (in English) A Technique for Improving Isolation of Devices Using Surface-Mounted Resistors and a Metal Plate 
Sub Title (in English)  
Keyword(1) shild  
Keyword(2) module  
Keyword(3) package  
Keyword(4) isolation  
Keyword(5) surface mount device  
Keyword(6) metal plate cover  
Keyword(7) chip resistor  
Keyword(8)  
1st Author's Name Yasuo Morimoto  
1st Author's Affiliation Mitsubishi Electric Corporation (Mitsubishi Electric)
2nd Author's Name Takeshi Yuasa  
2nd Author's Affiliation Mitsubishi Electric Corporation (Mitsubishi Electric)
3rd Author's Name Kenji Maeda  
3rd Author's Affiliation Mitsubishi Electric Engineering Company Limited (Mitsubishi Electric Engineering)
4th Author's Name Norio Takeuchi  
4th Author's Affiliation Mitsubishi Electric Engineering Company Limited (Mitsubishi Electric Engineering)
5th Author's Name Yukihiro Tahara  
5th Author's Affiliation Mitsubishi Electric Corporation (Mitsubishi Electric)
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Speaker Author-1 
Date Time 2015-03-06 15:20:00 
Presentation Time 25 minutes 
Registration for EMCJ 
Paper # EMCJ2014-107 
Volume (vol) vol.114 
Number (no) no.503 
Page pp.29-34 
#Pages 6 
Date of Issue 2015-02-27 (EMCJ) 

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