Paper Abstract and Keywords |
Presentation |
2015-06-20 14:00
On the Evaluation Board AISTino equipped with the Fourth Flex Power FPGA chip with SOTB transistors Hanpei Koike, Masakazu Hioki, Yasuhiro Ogasahara (AIST), Hayato Ishigaki, Toshiyuki Tsutsumi (Meiji Univ.), Tadashi Nakagawa, Toshihiro Sekigawa (AIST) RECONF2015-22 |
Abstract |
(in Japanese) |
(See Japanese page) |
(in English) |
Flex Power FPGA utilizes threshold voltage programmability to reduce its static power by the body bias control of circuit blocks in the FPGA. We have been developing a series of Flex Power FPGA chips using SOTB (Silicon On Thin BOX) transistor so far. The last 4th chip is functionally enhanced, in order to embed it on the evaluation board, and to enable practical use and evaluation by mapping more practical application circuits, pulling out of basic data measuring as a experimental chip. A new evaluation board called AISTino, which is equipped with the new chip, has been also developed. In this paper, we are going to describe the overview of them. |
Keyword |
(in Japanese) |
(See Japanese page) |
(in English) |
SOTB / FPGA / Body Bias Control / Static Power Reduction / Low Voltage Operation / Minimum Energy Operation / / |
Reference Info. |
IEICE Tech. Rep., vol. 115, no. 109, RECONF2015-22, pp. 119-124, June 2015. |
Paper # |
RECONF2015-22 |
Date of Issue |
2015-06-12 (RECONF) |
ISSN |
Print edition: ISSN 0913-5685 Online edition: ISSN 2432-6380 |
Copyright and reproduction |
All rights are reserved and no part of this publication may be reproduced or transmitted in any form or by any means, electronic or mechanical, including photocopy, recording, or any information storage and retrieval system, without permission in writing from the publisher. Notwithstanding, instructors are permitted to photocopy isolated articles for noncommercial classroom use without fee. (License No.: 10GA0019/12GB0052/13GB0056/17GB0034/18GB0034) |
Notes on Review |
This article is a technical report without peer review, and its polished version will be published elsewhere. |
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RECONF2015-22 |
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