Paper Abstract and Keywords |
Presentation |
2015-10-16 13:25
Fabrication of flexible organic transistors by ultrasonic welding Tokuyuki Koh, Tatsuhiko Sasaki, Yota Yamazaki, Masatoshi Sakai, Yugo Okada, Hiroshi Yamauchi (Chiba Univ.), Yuichi Sadamitsu, Shoji Shinamura (Nippon Kayaku), Kazuhiro Kudo (Chiba Univ.) OME2015-43 Link to ES Tech. Rep. Archives: OME2015-43 |
Abstract |
(in Japanese) |
(See Japanese page) |
(in English) |
Printing process is one of the deposition technique of the organic semiconductor layer for making organic flexible devices. This method is considered as better approach for the mass production of flexible electronic devices because organic semiconductor film pattern are formed in a large area and high speed under atmospheric pressure by printing technology. However, all of conventional printing process inevitably causes an emission of organic solvents and its vapor, which result in both high environmental load and high cost for solvent recovery from the viewpoint of industry. We have proposed ultrasonic welding method and fabricated flexible organic field effect transistors on plastic films. |
Keyword |
(in Japanese) |
(See Japanese page) |
(in English) |
Ultrasonic welding / Flexible / Plastic electronics / C8-BTBT / C10-DNTT / OFET / Solvent-free printing / |
Reference Info. |
IEICE Tech. Rep., vol. 115, no. 255, OME2015-43, pp. 7-10, Oct. 2015. |
Paper # |
OME2015-43 |
Date of Issue |
2015-10-09 (OME) |
ISSN |
Print edition: ISSN 0913-5685 Online edition: ISSN 2432-6380 |
Copyright and reproduction |
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OME2015-43 Link to ES Tech. Rep. Archives: OME2015-43 |
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