Information: Join today and make your research activities more affordable! Technical workshop participation fees and annual registration fees are available at member rates.
Notice: [Important] Announcement of Changes to Registration Fee Payment and Manuscript Upload Procedures for IEICE Technical Meetings
IEICE Technical Committee Submission System
Conference Paper's Information
Online Proceedings
[Sign in]
Tech. Rep. Archives
 Go Top Page Go Previous   [Japanese] / [English] 

Paper Abstract and Keywords
Presentation 2015-12-18 11:40
Experimental Study on Magnetic Leakage from Junctions of High Shielding Materials
Soichiro Yahagi, Ryosuke Suga, Tomoki Uwano, Osamu Hashimoto (Aoyama Gakuin Univ.) EMCJ2015-94
Abstract (in Japanese) (See Japanese page) 
(in English) A shielding metal case generally has some junctions of metal plates and electromagnetic field leak from the junctions because of their contact resistance.
The leaked electromagnetic field deteriorates the original shielding effect of the cases.
In this study, the shielding effect versus metal thickness of the metal case was evaluated in kHz band.
A 300 mm cubic case was employed as example of metal cases having junctions and it was composed of aluminum frame and copper plates.
As a result, the leakage affected the shielding effect when the case was made of high-shielding thick metal plates.
To reduce the contact resistance due to the gaps on the junctions, the influence of the material and flatness of the frame on the shielding effect was discussed.
Keyword (in Japanese) (See Japanese page) 
(in English) Shielding effect / Metal case / Junctions / Gaps / Contact resistance / kHz bands / /  
Reference Info. IEICE Tech. Rep., vol. 115, no. 377, EMCJ2015-94, pp. 25-28, Dec. 2015.
Paper # EMCJ2015-94 
Date of Issue 2015-12-11 (EMCJ) 
ISSN Print edition: ISSN 0913-5685    Online edition: ISSN 2432-6380
Copyright
and
reproduction
All rights are reserved and no part of this publication may be reproduced or transmitted in any form or by any means, electronic or mechanical, including photocopy, recording, or any information storage and retrieval system, without permission in writing from the publisher. Notwithstanding, instructors are permitted to photocopy isolated articles for noncommercial classroom use without fee. (License No.: 10GA0019/12GB0052/13GB0056/17GB0034/18GB0034)
Download PDF EMCJ2015-94

Conference Information
Committee EMCJ IEE-EMC  
Conference Date 2015-12-18 - 2015-12-18 
Place (in Japanese) (See Japanese page) 
Place (in English) TOYOTA CENTRAL R&D LABS., INC. 
Topics (in Japanese) (See Japanese page) 
Topics (in English) Power electronics, EMC 
Paper Information
Registration To EMCJ 
Conference Code 2015-12-EMCJ-EMC 
Language Japanese 
Title (in Japanese) (See Japanese page) 
Sub Title (in Japanese) (See Japanese page) 
Title (in English) Experimental Study on Magnetic Leakage from Junctions of High Shielding Materials 
Sub Title (in English)  
Keyword(1) Shielding effect  
Keyword(2) Metal case  
Keyword(3) Junctions  
Keyword(4) Gaps  
Keyword(5) Contact resistance  
Keyword(6) kHz bands  
Keyword(7)  
Keyword(8)  
1st Author's Name Soichiro Yahagi  
1st Author's Affiliation Aoyama Gakuin University (Aoyama Gakuin Univ.)
2nd Author's Name Ryosuke Suga  
2nd Author's Affiliation Aoyama Gakuin University (Aoyama Gakuin Univ.)
3rd Author's Name Tomoki Uwano  
3rd Author's Affiliation Aoyama Gakuin University (Aoyama Gakuin Univ.)
4th Author's Name Osamu Hashimoto  
4th Author's Affiliation Aoyama Gakuin University (Aoyama Gakuin Univ.)
5th Author's Name  
5th Author's Affiliation ()
6th Author's Name  
6th Author's Affiliation ()
7th Author's Name  
7th Author's Affiliation ()
8th Author's Name  
8th Author's Affiliation ()
9th Author's Name  
9th Author's Affiliation ()
10th Author's Name  
10th Author's Affiliation ()
11th Author's Name  
11th Author's Affiliation ()
12th Author's Name  
12th Author's Affiliation ()
13th Author's Name  
13th Author's Affiliation ()
14th Author's Name  
14th Author's Affiliation ()
15th Author's Name  
15th Author's Affiliation ()
16th Author's Name  
16th Author's Affiliation ()
17th Author's Name  
17th Author's Affiliation ()
18th Author's Name  
18th Author's Affiliation ()
19th Author's Name  
19th Author's Affiliation ()
20th Author's Name  
20th Author's Affiliation ()
21st Author's Name  
21st Author's Affiliation ()
22nd Author's Name  
22nd Author's Affiliation ()
23rd Author's Name  
23rd Author's Affiliation ()
24th Author's Name  
24th Author's Affiliation ()
25th Author's Name  
25th Author's Affiliation ()
26th Author's Name / /
26th Author's Affiliation ()
()
27th Author's Name / /
27th Author's Affiliation ()
()
28th Author's Name / /
28th Author's Affiliation ()
()
29th Author's Name / /
29th Author's Affiliation ()
()
30th Author's Name / /
30th Author's Affiliation ()
()
31st Author's Name / /
31st Author's Affiliation ()
()
32nd Author's Name / /
32nd Author's Affiliation ()
()
33rd Author's Name / /
33rd Author's Affiliation ()
()
34th Author's Name / /
34th Author's Affiliation ()
()
35th Author's Name / /
35th Author's Affiliation ()
()
36th Author's Name / /
36th Author's Affiliation ()
()
Speaker Author-1 
Date Time 2015-12-18 11:40:00 
Presentation Time 20 minutes 
Registration for EMCJ 
Paper # EMCJ2015-94 
Volume (vol) vol.115 
Number (no) no.377 
Page pp.25-28 
#Pages
Date of Issue 2015-12-11 (EMCJ) 


[Return to Top Page]

[Return to IEICE Web Page]


The Institute of Electronics, Information and Communication Engineers (IEICE), Japan