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Paper Abstract and Keywords
Presentation 2015-12-18 13:00
Development of the Geometry of a Heat sink for Improving Heat Transfer
Shinichi Tomiyama (TIRI) DC2015-73
Abstract (in Japanese) (See Japanese page) 
(in English) The heat release system is important for assuring performance, safety, and life of electronic devices. A heat sink and a forced air cooling system using fan is one of the heat release system. However bottom of a heat sink and surround electronic devices is low wind speed. So this system cannot solve the heat release problems in electronic devices. We developed a heat sink for speed up wind velocity of bottom of a heat sink and surround electronic devices. The result of temperature measurement, The proposed method suppressed the temperature rise of electronic devices of 3–11% than the conventional method. In this paper, We proposed heat sink about design policy.
Keyword (in Japanese) (See Japanese page) 
(in English) Heat sink / Forced air cooling / Radiation Performance / Thermal-Flow Simulation / / / /  
Reference Info. IEICE Tech. Rep., vol. 115, no. 382, DC2015-73, pp. 1-4, Dec. 2015.
Paper # DC2015-73 
Date of Issue 2015-12-11 (DC) 
ISSN Print edition: ISSN 0913-5685    Online edition: ISSN 2432-6380
Copyright
and
reproduction		 All rights are reserved and no part of this publication may be reproduced or transmitted in any form or by any means, electronic or mechanical, including photocopy, recording, or any information storage and retrieval system, without permission in writing from the publisher. Notwithstanding, instructors are permitted to photocopy isolated articles for noncommercial classroom use without fee. (License No.: 10GA0019/12GB0052/13GB0056/17GB0034/18GB0034)
Download PDF DC2015-73

Conference Information
Committee DC  
Conference Date 2015-12-18 - 2015-12-18 
Place (in Japanese) (See Japanese page) 
Place (in English) Kurieito Mulakami (Murakami City) 
Topics (in Japanese) (See Japanese page) 
Topics (in English)  
Paper Information
Registration To DC 
Conference Code 2015-12-DC 
Language Japanese 
Title (in Japanese) (See Japanese page) 
Sub Title (in Japanese) (See Japanese page) 
Title (in English) Development of the Geometry of a Heat sink for Improving Heat Transfer 
Sub Title (in English)  
Keyword(1) Heat sink  
Keyword(2) Forced air cooling  
Keyword(3) Radiation Performance  
Keyword(4) Thermal-Flow Simulation  
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1st Author's Name Shinichi Tomiyama  
1st Author's Affiliation Tokyo Metropolitan Technology Research Institute (TIRI)
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Speaker Author-1 
Date Time 2015-12-18 13:00:00 
Presentation Time 20 minutes 
Registration for DC 
Paper # DC2015-73 
Volume (vol) vol.115 
Number (no) no.382 
Page pp.1-4 
#Pages 4 
Date of Issue 2015-12-11 (DC) 

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