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Paper Abstract and Keywords
Presentation 2016-01-20 09:00
A Chip Evaluation of the Heat Generation in 3D stacked LSI
Tatsuya Wada, Kimiyosi Usami (Shibaura IT) VLD2015-87 CPSY2015-119 RECONF2015-69
Abstract (in Japanese) (See Japanese page) 
(in English) Heat is one of the problems in the three-dimensional stacking technology of LSI. We have developed a three-dimensional stacked chip equipped with the heat generation circuit and the temperature monitor circuit, to evaluate the effect of the heat generated in the chip by the stacked structure. By stack number is four stages from three-stage, temperature around the heating circuit by 0.56 watts consumed at the center of the uppermost stage is raised 1.7 degrees Celsius, and by 0.40 watts consumed at the corner of the uppermost stage is raised 6.5 degrees Celsius.
Keyword (in Japanese) (See Japanese page) 
(in English) 3D stacked LSI / Thermal Monitor / heating / / / / /  
Reference Info. IEICE Tech. Rep., vol. 115, no. 398, VLD2015-87, pp. 85-90, Jan. 2016.
Paper # VLD2015-87 
Date of Issue 2016-01-12 (VLD, CPSY, RECONF) 
ISSN Print edition: ISSN 0913-5685    Online edition: ISSN 2432-6380
Copyright
and
reproduction		 All rights are reserved and no part of this publication may be reproduced or transmitted in any form or by any means, electronic or mechanical, including photocopy, recording, or any information storage and retrieval system, without permission in writing from the publisher. Notwithstanding, instructors are permitted to photocopy isolated articles for noncommercial classroom use without fee. (License No.: 10GA0019/12GB0052/13GB0056/17GB0034/18GB0034)
Download PDF VLD2015-87 CPSY2015-119 RECONF2015-69

Conference Information
Committee VLD CPSY RECONF IPSJ-SLDM IPSJ-ARC  
Conference Date 2016-01-19 - 2016-01-21 
Place (in Japanese) (See Japanese page) 
Place (in English) Hiyoshi Campus, Keio University 
Topics (in Japanese) (See Japanese page) 
Topics (in English) FPGA Applications, etc 
Paper Information
Registration To VLD 
Conference Code 2016-01-VLD-CPSY-RECONF-SLDM-ARC 
Language Japanese 
Title (in Japanese) (See Japanese page) 
Sub Title (in Japanese) (See Japanese page) 
Title (in English) A Chip Evaluation of the Heat Generation in 3D stacked LSI 
Sub Title (in English)  
Keyword(1) 3D stacked LSI  
Keyword(2) Thermal Monitor  
Keyword(3) heating  
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1st Author's Name Tatsuya Wada  
1st Author's Affiliation Shibaura Institute of Technology (Shibaura IT)
2nd Author's Name Kimiyosi Usami  
2nd Author's Affiliation Shibaura Institute of Technology (Shibaura IT)
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Speaker Author-1 
Date Time 2016-01-20 09:00:00 
Presentation Time 25 minutes 
Registration for VLD 
Paper # VLD2015-87, CPSY2015-119, RECONF2015-69 
Volume (vol) vol.115 
Number (no) no.398(VLD), no.399(CPSY), no.400(RECONF) 
Page pp.85-90 
#Pages 6 
Date of Issue 2016-01-12 (VLD, CPSY, RECONF) 

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