Information: Join today and make your research activities more affordable! Technical workshop participation fees and annual registration fees are available at member rates.
Notice: [Important] Announcement of Changes to Registration Fee Payment and Manuscript Upload Procedures for IEICE Technical Meetings
IEICE Technical Committee Submission System
Conference Paper's Information		 Online Proceedings
[Sign in]
Tech. Rep. Archives
 Go Top Page Go Previous   [Japanese] / [English] 

Paper Abstract and Keywords
Presentation 2016-01-22 10:05
[Invited Talk] Reliability Results of 4 million Micro Bump Interconnections of 3D Stacked 16 M Pixel Image Sensor
Yoshiaki Takemoto, Naohiro Takazawa, Mitsuhiro Tsukimura, Haruhisa Saito, Toru Kondo, Hideki Kato, Jun Aoki, Kenji Kobayashi, Shunsuke Suzuki, Yuichi Gomi, Seisuke Matsuda, Yoshitaka Tadaki (Olympus) SDM2015-108
Abstract (in Japanese) (See Japanese page) 
(in English) We evaluated the reliability of 3D stacked CMOS image sensors (CISs) with 4 million micro bump inter-connections at a 7.6-um pitch bonded with wafer bonding technology. This 3D stacked technology was proved to have no negative effect on CIS characteristics and to provide a high density and narrow pitched in-pixel connection with high reliability, no defects, and no deteriorations over a 1000-cycle heat cycle test and 1000-hour high temperature and high humidity test. This CIS sensor has a set of readout circuits in each substrate, which enable us to detect any connection failure among 4 million micro bumps between substrates individually. These results show that this 3D technology has enough reliability for application to products.
Keyword (in Japanese) (See Japanese page) 
(in English) CMOS Image Sensor / 3D Stacked structure / Micro-Bump / Reliability / / / /  
Reference Info. IEICE Tech. Rep., vol. 115, no. 417, SDM2015-108, pp. 1-4, Jan. 2016.
Paper # SDM2015-108 
Date of Issue 2016-01-15 (SDM) 
ISSN Print edition: ISSN 0913-5685    Online edition: ISSN 2432-6380
Copyright
and
reproduction		 All rights are reserved and no part of this publication may be reproduced or transmitted in any form or by any means, electronic or mechanical, including photocopy, recording, or any information storage and retrieval system, without permission in writing from the publisher. Notwithstanding, instructors are permitted to photocopy isolated articles for noncommercial classroom use without fee. (License No.: 10GA0019/12GB0052/13GB0056/17GB0034/18GB0034)
Download PDF SDM2015-108

Conference Information
Committee SDM  
Conference Date 2016-01-22 - 2016-01-22 
Place (in Japanese) (See Japanese page) 
Place (in English) Sanjo Conference Hall, The University of Tokyo 
Topics (in Japanese) (See Japanese page) 
Topics (in English) Interconnects, Package and related materials 
Paper Information
Registration To SDM 
Conference Code 2016-01-SDM 
Language Japanese 
Title (in Japanese) (See Japanese page) 
Sub Title (in Japanese) (See Japanese page) 
Title (in English) Reliability Results of 4 million Micro Bump Interconnections of 3D Stacked 16 M Pixel Image Sensor 
Sub Title (in English)  
Keyword(1) CMOS Image Sensor  
Keyword(2) 3D Stacked structure  
Keyword(3) Micro-Bump  
Keyword(4) Reliability  
Keyword(5)  
Keyword(6)  
Keyword(7)  
Keyword(8)  
1st Author's Name Yoshiaki Takemoto  
1st Author's Affiliation Olympus Corporation (Olympus)
2nd Author's Name Naohiro Takazawa  
2nd Author's Affiliation Olympus Corporation (Olympus)
3rd Author's Name Mitsuhiro Tsukimura  
3rd Author's Affiliation Olympus Corporation (Olympus)
4th Author's Name Haruhisa Saito  
4th Author's Affiliation Olympus Corporation (Olympus)
5th Author's Name Toru Kondo  
5th Author's Affiliation Olympus Corporation (Olympus)
6th Author's Name Hideki Kato  
6th Author's Affiliation Olympus Corporation (Olympus)
7th Author's Name Jun Aoki  
7th Author's Affiliation Olympus Corporation (Olympus)
8th Author's Name Kenji Kobayashi  
8th Author's Affiliation Olympus Corporation (Olympus)
9th Author's Name Shunsuke Suzuki  
9th Author's Affiliation Olympus Corporation (Olympus)
10th Author's Name Yuichi Gomi  
10th Author's Affiliation Olympus Corporation (Olympus)
11th Author's Name Seisuke Matsuda  
11th Author's Affiliation Olympus Corporation (Olympus)
12th Author's Name Yoshitaka Tadaki  
12th Author's Affiliation Olympus Corporation (Olympus)
13th Author's Name  
13th Author's Affiliation ()
14th Author's Name  
14th Author's Affiliation ()
15th Author's Name  
15th Author's Affiliation ()
16th Author's Name  
16th Author's Affiliation ()
17th Author's Name  
17th Author's Affiliation ()
18th Author's Name  
18th Author's Affiliation ()
19th Author's Name  
19th Author's Affiliation ()
20th Author's Name  
20th Author's Affiliation ()
21st Author's Name  
21st Author's Affiliation ()
22nd Author's Name  
22nd Author's Affiliation ()
23rd Author's Name  
23rd Author's Affiliation ()
24th Author's Name  
24th Author's Affiliation ()
25th Author's Name  
25th Author's Affiliation ()
26th Author's Name / /
26th Author's Affiliation ()
()
27th Author's Name / /
27th Author's Affiliation ()
()
28th Author's Name / /
28th Author's Affiliation ()
()
29th Author's Name / /
29th Author's Affiliation ()
()
30th Author's Name / /
30th Author's Affiliation ()
()
31st Author's Name / /
31st Author's Affiliation ()
()
32nd Author's Name / /
32nd Author's Affiliation ()
()
33rd Author's Name / /
33rd Author's Affiliation ()
()
34th Author's Name / /
34th Author's Affiliation ()
()
35th Author's Name / /
35th Author's Affiliation ()
()
36th Author's Name / /
36th Author's Affiliation ()
()
Speaker Author-1 
Date Time 2016-01-22 10:05:00 
Presentation Time 35 minutes 
Registration for SDM 
Paper # SDM2015-108 
Volume (vol) vol.115 
Number (no) no.417 
Page pp.1-4 
#Pages 4 
Date of Issue 2016-01-15 (SDM) 

[Return to Top Page]

[Return to IEICE Web Page]
The Institute of Electronics, Information and Communication Engineers (IEICE), Japan