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Paper Abstract and Keywords
Presentation 2016-01-22 16:00
[Invited Talk] Packaging Material for 2.5D/3D TSV Integration
Kazuyuki Mitsukura, Tatsuya Makino, Keiichi Hatakeyama (Hitachi Chemical), Kenneth June Rebibis, Andy Miller, Eric Beyne (IMEC) SDM2015-118
Abstract (in Japanese) (See Japanese page) 
(in English) (Not available yet)
Keyword (in Japanese) (See Japanese page) 
(in English) / / / / / / /  
Reference Info. IEICE Tech. Rep., vol. 115, no. 417, SDM2015-118, pp. 45-47, Jan. 2016.
Paper # SDM2015-118 
Date of Issue 2016-01-15 (SDM) 
ISSN Print edition: ISSN 0913-5685    Online edition: ISSN 2432-6380
Copyright
and
reproduction		 All rights are reserved and no part of this publication may be reproduced or transmitted in any form or by any means, electronic or mechanical, including photocopy, recording, or any information storage and retrieval system, without permission in writing from the publisher. Notwithstanding, instructors are permitted to photocopy isolated articles for noncommercial classroom use without fee. (License No.: 10GA0019/12GB0052/13GB0056/17GB0034/18GB0034)
Download PDF SDM2015-118

Conference Information
Committee SDM  
Conference Date 2016-01-22 - 2016-01-22 
Place (in Japanese) (See Japanese page) 
Place (in English) Sanjo Conference Hall, The University of Tokyo 
Topics (in Japanese) (See Japanese page) 
Topics (in English) Interconnects, Package and related materials 
Paper Information
Registration To SDM 
Conference Code 2016-01-SDM 
Language Japanese 
Title (in Japanese) (See Japanese page) 
Sub Title (in Japanese) (See Japanese page) 
Title (in English) Packaging Material for 2.5D/3D TSV Integration 
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1st Author's Name Kazuyuki Mitsukura  
1st Author's Affiliation Hitachi Chemical (Hitachi Chemical)
2nd Author's Name Tatsuya Makino  
2nd Author's Affiliation Hitachi Chemical (Hitachi Chemical)
3rd Author's Name Keiichi Hatakeyama  
3rd Author's Affiliation Hitachi Chemical (Hitachi Chemical)
4th Author's Name Kenneth June Rebibis  
4th Author's Affiliation Interuniversity Micro Electronics Center (IMEC)
5th Author's Name Andy Miller  
5th Author's Affiliation Interuniversity Micro Electronics Center (IMEC)
6th Author's Name Eric Beyne  
6th Author's Affiliation Interuniversity Micro Electronics Center (IMEC)
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Speaker Author-1 
Date Time 2016-01-22 16:00:00 
Presentation Time 35 minutes 
Registration for SDM 
Paper # SDM2015-118 
Volume (vol) vol.115 
Number (no) no.417 
Page pp.45-47 
#Pages 3 
Date of Issue 2016-01-15 (SDM) 

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