Information: Join today and make your research activities more affordable! Technical workshop participation fees and annual registration fees are available at member rates.
Notice: [Important] Announcement of Changes to Registration Fee Payment and Manuscript Upload Procedures for IEICE Technical Meetings
IEICE Technical Committee Submission System
Conference Paper's Information
Online Proceedings
[Sign in]
Tech. Rep. Archives
 Go Top Page Go Previous   [Japanese] / [English] 

Paper Abstract and Keywords
Presentation 2016-01-28 10:20
Reduction Technique of Radiation noise from power supply layers in PCB using Attached Resistor Method -- Examination of optimum Resistance value --
Ryuji Minami, Shinichi Sasaki (Saga Univ.) EMCJ2015-106
Abstract (in Japanese) (See Japanese page) 
(in English) Recently, information devices has high performance and the high-speed. Therefore, the radiation noise from the power supply layers in PCB has increased. We have suggested a method attaching resistor between power supply layers at the substrate edge to reduce radiation noise. This time, evaluate the optimum resistance value for reducing power supply noise.
As a result, Matching values of the characteristic impedance is not optimal for power supply noise reduction.
Keyword (in Japanese) (See Japanese page) 
(in English) Printed Circuit Board / Radiation noise / power supply noise / Resistance attaching method / / / /  
Reference Info. IEICE Tech. Rep., vol. 115, no. 427, EMCJ2015-106, pp. 19-22, Jan. 2016.
Paper # EMCJ2015-106 
Date of Issue 2016-01-21 (EMCJ) 
ISSN Print edition: ISSN 0913-5685    Online edition: ISSN 2432-6380
Copyright
and
reproduction
All rights are reserved and no part of this publication may be reproduced or transmitted in any form or by any means, electronic or mechanical, including photocopy, recording, or any information storage and retrieval system, without permission in writing from the publisher. Notwithstanding, instructors are permitted to photocopy isolated articles for noncommercial classroom use without fee. (License No.: 10GA0019/12GB0052/13GB0056/17GB0034/18GB0034)
Download PDF EMCJ2015-106

Conference Information
Committee EMCJ WPT  
Conference Date 2016-01-28 - 2016-01-29 
Place (in Japanese) (See Japanese page) 
Place (in English) Kumamoto National Colle. Technology 
Topics (in Japanese) (See Japanese page) 
Topics (in English) Communication, Wireless Power Transmission, EMC 
Paper Information
Registration To EMCJ 
Conference Code 2016-01-EMCJ-WPT 
Language Japanese 
Title (in Japanese) (See Japanese page) 
Sub Title (in Japanese) (See Japanese page) 
Title (in English) Reduction Technique of Radiation noise from power supply layers in PCB using Attached Resistor Method 
Sub Title (in English) Examination of optimum Resistance value 
Keyword(1) Printed Circuit Board  
Keyword(2) Radiation noise  
Keyword(3) power supply noise  
Keyword(4) Resistance attaching method  
Keyword(5)  
Keyword(6)  
Keyword(7)  
Keyword(8)  
1st Author's Name Ryuji Minami  
1st Author's Affiliation Saga University (Saga Univ.)
2nd Author's Name Shinichi Sasaki  
2nd Author's Affiliation Saga University (Saga Univ.)
3rd Author's Name  
3rd Author's Affiliation ()
4th Author's Name  
4th Author's Affiliation ()
5th Author's Name  
5th Author's Affiliation ()
6th Author's Name  
6th Author's Affiliation ()
7th Author's Name  
7th Author's Affiliation ()
8th Author's Name  
8th Author's Affiliation ()
9th Author's Name  
9th Author's Affiliation ()
10th Author's Name  
10th Author's Affiliation ()
11th Author's Name  
11th Author's Affiliation ()
12th Author's Name  
12th Author's Affiliation ()
13th Author's Name  
13th Author's Affiliation ()
14th Author's Name  
14th Author's Affiliation ()
15th Author's Name  
15th Author's Affiliation ()
16th Author's Name  
16th Author's Affiliation ()
17th Author's Name  
17th Author's Affiliation ()
18th Author's Name  
18th Author's Affiliation ()
19th Author's Name  
19th Author's Affiliation ()
20th Author's Name  
20th Author's Affiliation ()
21st Author's Name  
21st Author's Affiliation ()
22nd Author's Name  
22nd Author's Affiliation ()
23rd Author's Name  
23rd Author's Affiliation ()
24th Author's Name  
24th Author's Affiliation ()
25th Author's Name  
25th Author's Affiliation ()
26th Author's Name / /
26th Author's Affiliation ()
()
27th Author's Name / /
27th Author's Affiliation ()
()
28th Author's Name / /
28th Author's Affiliation ()
()
29th Author's Name / /
29th Author's Affiliation ()
()
30th Author's Name / /
30th Author's Affiliation ()
()
31st Author's Name / /
31st Author's Affiliation ()
()
32nd Author's Name / /
32nd Author's Affiliation ()
()
33rd Author's Name / /
33rd Author's Affiliation ()
()
34th Author's Name / /
34th Author's Affiliation ()
()
35th Author's Name / /
35th Author's Affiliation ()
()
36th Author's Name / /
36th Author's Affiliation ()
()
Speaker Author-1 
Date Time 2016-01-28 10:20:00 
Presentation Time 25 minutes 
Registration for EMCJ 
Paper # EMCJ2015-106 
Volume (vol) vol.115 
Number (no) no.427 
Page pp.19-22 
#Pages
Date of Issue 2016-01-21 (EMCJ) 


[Return to Top Page]

[Return to IEICE Web Page]


The Institute of Electronics, Information and Communication Engineers (IEICE), Japan