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Paper Abstract and Keywords
Presentation 2016-11-17 15:30
A Study on Electro Chemical Migration Test for Printed Circuit Board
Sadanori Ito (Itoken) R2016-52
Abstract (in Japanese) (See Japanese page) 
(in English) The electro chemical migration which shorts the electric circuit occurs under the various use condition such as High Temperature - High Humidity/ Temperature-Humidity Cycle/ Dew condensation Cycle / High Temperature. So, not the unique standard test method but the test method against the suitable purpose is needed.
Considering the occurred mechanism via the various electro chemical migration examples, we study the necessary test method and the evaluation method for the soldering printed circuit board
Keyword (in Japanese) (See Japanese page) 
(in English) Electro Chemical Migration / Temperature-Humidity Cycle test / Dew condensation Cycle test / / / / /  
Reference Info. IEICE Tech. Rep., vol. 116, no. 301, R2016-52, pp. 19-22, Nov. 2016.
Paper # R2016-52 
Date of Issue 2016-11-10 (R) 
ISSN Print edition: ISSN 0913-5685    Online edition: ISSN 2432-6380
All rights are reserved and no part of this publication may be reproduced or transmitted in any form or by any means, electronic or mechanical, including photocopy, recording, or any information storage and retrieval system, without permission in writing from the publisher. Notwithstanding, instructors are permitted to photocopy isolated articles for noncommercial classroom use without fee. (License No.: 10GA0019/12GB0052/13GB0056/17GB0034/18GB0034)
Download PDF R2016-52

Conference Information
Committee R  
Conference Date 2016-11-17 - 2016-11-17 
Place (in Japanese) (See Japanese page) 
Place (in English) Osaka Central Electric Club Bldg. 
Topics (in Japanese) (See Japanese page) 
Topics (in English) Reliability for semiconductors and electronics devices, Overall reliability engineering (co-organized by Reliability Engineering Association of Japan Kansai Branch) 
Paper Information
Registration To R 
Conference Code 2016-11-R 
Language Japanese without English title) 
Title (in Japanese) (See Japanese page) 
Sub Title (in Japanese) (See Japanese page) 
Title (in English) A Study on Electro Chemical Migration Test for Printed Circuit Board 
Sub Title (in English)  
Keyword(1) Electro Chemical Migration  
Keyword(2) Temperature-Humidity Cycle test  
Keyword(3) Dew condensation Cycle test  
1st Author's Name Sadanori Ito  
1st Author's Affiliation Itoken Office (Itoken)
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Speaker Author-1 
Date Time 2016-11-17 15:30:00 
Presentation Time 25 minutes 
Registration for R 
Paper # R2016-52 
Volume (vol) vol.116 
Number (no) no.301 
Page pp.19-22 
Date of Issue 2016-11-10 (R) 

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