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| Presentation | 2016-11-17 15:30 A Study on Electro Chemical Migration Test for Printed Circuit Board Sadanori Ito (Itoken)  R2016-52 |
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| Abstract | (in Japanese) | (See Japanese page) |
| (in English) | The electro chemical migration which shorts the electric circuit occurs under the various use condition such as High Temperature - High Humidity/ Temperature-Humidity Cycle/ Dew condensation Cycle / High Temperature. So, not the unique standard test method but the test method against the suitable purpose is needed. Considering the occurred mechanism via the various electro chemical migration examples, we study the necessary test method and the evaluation method for the soldering printed circuit board |
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| Keyword | (in Japanese) | (See Japanese page) |
| (in English) | Electro Chemical Migration / Temperature-Humidity Cycle test / Dew condensation Cycle test / / / / / | |
| Reference Info. | IEICE Tech. Rep., vol. 116, no. 301, R2016-52, pp. 19-22, Nov. 2016. | |
| Paper # | R2016-52 | |
| Date of Issue | 2016-11-10 (R) | |
| ISSN | Print edition: ISSN 0913-5685 Online edition: ISSN 2432-6380 | |
| Copyright and reproduction |
All rights are reserved and no part of this publication may be reproduced or transmitted in any form or by any means, electronic or mechanical, including photocopy, recording, or any information storage and retrieval system, without permission in writing from the publisher. Notwithstanding, instructors are permitted to photocopy isolated articles for noncommercial classroom use without fee. (License No.: 10GA0019/12GB0052/13GB0056/17GB0034/18GB0034) | |
| Download PDF | R2016-52 |
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| Conference Information | |
| Committee | R |
| Conference Date | 2016-11-17 - 2016-11-17 |
| Place (in Japanese) | (See Japanese page) |
| Place (in English) | Osaka Central Electric Club Bldg. |
| Topics (in Japanese) | (See Japanese page) |
| Topics (in English) | Reliability for semiconductors and electronics devices, Overall reliability engineering (co-organized by Reliability Engineering Association of Japan Kansai Branch) |
| Paper Information | |
| Registration To | R |
| Conference Code | 2016-11-R |
| Language | Japanese without English title) |
| Title (in Japanese) | (See Japanese page) |
| Sub Title (in Japanese) | (See Japanese page) |
| Title (in English) | A Study on Electro Chemical Migration Test for Printed Circuit Board |
| Sub Title (in English) | |
| Keyword(1) | Electro Chemical Migration |
| Keyword(2) | Temperature-Humidity Cycle test |
| Keyword(3) | Dew condensation Cycle test |
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| 1st Author's Name | Sadanori Ito |
| 1st Author's Affiliation | Itoken Office (Itoken) |
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| Speaker | Author-1 |
| Date Time | 2016-11-17 15:30:00 |
| Presentation Time | 25 minutes |
| Registration for | R |
| Paper # | R2016-52 |
| Volume (vol) | vol.116 |
| Number (no) | no.301 |
| Page | pp.19-22 |
| #Pages | 4 |
| Date of Issue | 2016-11-10 (R) |
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