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Paper Abstract and Keywords
Presentation 2017-05-19 13:20
[Invited Talk] 2.5D Method of Modeling and Simulation for Signal/Power Integrity of High Speed Electronics
En-Xiao Liu, Siping Gao, Hui Min Lee (A*STAR IHPC) EMCJ2017-19
Abstract (in Japanese) (See Japanese page) 
(in English) Electromagnetic characteristics related to signal integrity (SI), power integrity (PI) and EMC has become an essential design consideration for modern high-speed electronics. Relentless increase in the operation frequency, and high integrated co-existence of analogue, digital and RF components are only making the situation worse. Besides experiments and testing, modeling and simulation plays an indispensible role in modern high speed electronic design.
This talk will first present a survey of 2.5D methodologies, which are based on modal decomposition principle, for efficient modeling of electronic packages and multilayer printed circuit boards (PCB). It then reports the latest development of 2D discontinuous Galerkin method (2D DGTD) based 2.5D methodology for analysis of signal and power integrity in multilayer PCBs. Moreover, the recent study of handling narrow slots in the power-ground planes by a hybrid 1D- and 2D- DGTD method is also presented. Numerical examples are given with simulation results compared against measurement as well as full-wave simulation results.
Keyword (in Japanese) (See Japanese page) 
(in English) modeling and simulation / signal integrity / power integrity / modal decomposition / 2.5D method / DGTD / /  
Reference Info. IEICE Tech. Rep., vol. 117, no. 32, EMCJ2017-19, pp. 67-67, May 2017.
Paper # EMCJ2017-19 
Date of Issue 2017-05-11 (EMCJ) 
ISSN Print edition: ISSN 0913-5685    Online edition: ISSN 2432-6380
Copyright
and
reproduction		 All rights are reserved and no part of this publication may be reproduced or transmitted in any form or by any means, electronic or mechanical, including photocopy, recording, or any information storage and retrieval system, without permission in writing from the publisher. Notwithstanding, instructors are permitted to photocopy isolated articles for noncommercial classroom use without fee. (License No.: 10GA0019/12GB0052/13GB0056/17GB0034/18GB0034)
Notes on Review This article is a technical report without peer review, and its polished version will be published elsewhere.
Download PDF EMCJ2017-19

Conference Information
Committee EMCJ IEE-EMC IEE-MAG  
Conference Date 2017-05-18 - 2017-05-19 
Place (in Japanese) (See Japanese page) 
Place (in English) Nanyang Technological University 
Topics (in Japanese) (See Japanese page) 
Topics (in English) EMC Joint Workshop, 2017, Singapore 
Paper Information
Registration To EMCJ 
Conference Code 2017-05-EMCJ-EMC-MAG 
Language English 
Title (in Japanese) (See Japanese page) 
Sub Title (in Japanese) (See Japanese page) 
Title (in English) 2.5D Method of Modeling and Simulation for Signal/Power Integrity of High Speed Electronics 
Sub Title (in English)  
Keyword(1) modeling and simulation  
Keyword(2) signal integrity  
Keyword(3) power integrity  
Keyword(4) modal decomposition  
Keyword(5) 2.5D method  
Keyword(6) DGTD  
Keyword(7)  
Keyword(8)  
1st Author's Name En-Xiao Liu  
1st Author's Affiliation A*STAR Institute of High Performance Computing (A*STAR IHPC)
2nd Author's Name Siping Gao  
2nd Author's Affiliation A*STAR Institute of High Performance Computing (A*STAR IHPC)
3rd Author's Name Hui Min Lee  
3rd Author's Affiliation A*STAR Institute of High Performance Computing (A*STAR IHPC)
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Speaker Author-1 
Date Time 2017-05-19 13:20:00 
Presentation Time 50 minutes 
Registration for EMCJ 
Paper # EMCJ2017-19 
Volume (vol) vol.117 
Number (no) no.32 
Page p.67 
#Pages 1 
Date of Issue 2017-05-11 (EMCJ) 

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