Information: Join today and make your research activities more affordable! Technical workshop participation fees and annual registration fees are available at member rates.
Notice: [Important] Announcement of Changes to Registration Fee Payment and Manuscript Upload Procedures for IEICE Technical Meetings
IEICE Technical Committee Submission System
Conference Paper's Information		 Online Proceedings
[Sign in]
Tech. Rep. Archives
 Go Top Page Go Previous   [Japanese] / [English] 

Paper Abstract and Keywords
Presentation 2017-10-20 10:00
Analysis of crosstalk between slot lines placed in a printed circuit board with finite size
Teruo Tobana, Yoji Isota (Akita Pref. Univ.) EMCJ2017-44 MW2017-96 EST2017-59
Abstract (in Japanese) (See Japanese page) 
(in English) On the high density printed circuit board (PCB) with a large elements, the effect of some ground slots, such as clearance halls of vias or ground defects, was concerned.In this paper, we calculated electromagnetic coupling between two ground slots placed closely on a PCB using multi-conductor transmission lines method. To calculate crosstalk between the ground slots, we proposed the method of calculating electromagnetic fields excited by a slot placed on a ground with finite width using spectral domain approach. And, we derived the per-unit-length mutual capacitance and inductance between two slots using transverse electromagnetic wave analyzed by proposed method. We showed the validity of results using proposed method by comparing with the results of FDTD method when operating frequency is high.
Keyword (in Japanese) (See Japanese page) 
(in English) coupling / multiconductor-transmission-line / ground slot / ground of finite size / / / /  
Reference Info. IEICE Tech. Rep., vol. 117, no. 243, EMCJ2017-44, pp. 99-103, Oct. 2017.
Paper # EMCJ2017-44 
Date of Issue 2017-10-12 (EMCJ, MW, EST) 
ISSN Print edition: ISSN 0913-5685    Online edition: ISSN 2432-6380
Copyright
and
reproduction		 All rights are reserved and no part of this publication may be reproduced or transmitted in any form or by any means, electronic or mechanical, including photocopy, recording, or any information storage and retrieval system, without permission in writing from the publisher. Notwithstanding, instructors are permitted to photocopy isolated articles for noncommercial classroom use without fee. (License No.: 10GA0019/12GB0052/13GB0056/17GB0034/18GB0034)
Download PDF EMCJ2017-44 MW2017-96 EST2017-59

Conference Information
Committee MW EMCJ EST  
Conference Date 2017-10-19 - 2017-10-20 
Place (in Japanese) (See Japanese page) 
Place (in English) Yupopo 
Topics (in Japanese) (See Japanese page) 
Topics (in English) Electromagnetic simulation ，EMC, Microwave technologies 
Paper Information
Registration To EMCJ 
Conference Code 2017-10-MW-EMCJ-EST-EMC 
Language Japanese 
Title (in Japanese) (See Japanese page) 
Sub Title (in Japanese) (See Japanese page) 
Title (in English) Analysis of crosstalk between slot lines placed in a printed circuit board with finite size 
Sub Title (in English)  
Keyword(1) coupling  
Keyword(2) multiconductor-transmission-line  
Keyword(3) ground slot  
Keyword(4) ground of finite size  
Keyword(5)  
Keyword(6)  
Keyword(7)  
Keyword(8)  
1st Author's Name Teruo Tobana  
1st Author's Affiliation Akita Prefectural University (Akita Pref. Univ.)
2nd Author's Name Yoji Isota  
2nd Author's Affiliation Akita Prefectural University (Akita Pref. Univ.)
3rd Author's Name  
3rd Author's Affiliation ()
4th Author's Name  
4th Author's Affiliation ()
5th Author's Name  
5th Author's Affiliation ()
6th Author's Name  
6th Author's Affiliation ()
7th Author's Name  
7th Author's Affiliation ()
8th Author's Name  
8th Author's Affiliation ()
9th Author's Name  
9th Author's Affiliation ()
10th Author's Name  
10th Author's Affiliation ()
11th Author's Name  
11th Author's Affiliation ()
12th Author's Name  
12th Author's Affiliation ()
13th Author's Name  
13th Author's Affiliation ()
14th Author's Name  
14th Author's Affiliation ()
15th Author's Name  
15th Author's Affiliation ()
16th Author's Name  
16th Author's Affiliation ()
17th Author's Name  
17th Author's Affiliation ()
18th Author's Name  
18th Author's Affiliation ()
19th Author's Name  
19th Author's Affiliation ()
20th Author's Name  
20th Author's Affiliation ()
21st Author's Name  
21st Author's Affiliation ()
22nd Author's Name  
22nd Author's Affiliation ()
23rd Author's Name  
23rd Author's Affiliation ()
24th Author's Name  
24th Author's Affiliation ()
25th Author's Name  
25th Author's Affiliation ()
26th Author's Name / /
26th Author's Affiliation ()
()
27th Author's Name / /
27th Author's Affiliation ()
()
28th Author's Name / /
28th Author's Affiliation ()
()
29th Author's Name / /
29th Author's Affiliation ()
()
30th Author's Name / /
30th Author's Affiliation ()
()
31st Author's Name / /
31st Author's Affiliation ()
()
32nd Author's Name / /
32nd Author's Affiliation ()
()
33rd Author's Name / /
33rd Author's Affiliation ()
()
34th Author's Name / /
34th Author's Affiliation ()
()
35th Author's Name / /
35th Author's Affiliation ()
()
36th Author's Name / /
36th Author's Affiliation ()
()
Speaker Author-1 
Date Time 2017-10-20 10:00:00 
Presentation Time 20 minutes 
Registration for EMCJ 
Paper # EMCJ2017-44, MW2017-96, EST2017-59 
Volume (vol) vol.117 
Number (no) no.243(EMCJ), no.244(MW), no.245(EST) 
Page pp.99-103 
#Pages 5 
Date of Issue 2017-10-12 (EMCJ, MW, EST) 

[Return to Top Page]

[Return to IEICE Web Page]
The Institute of Electronics, Information and Communication Engineers (IEICE), Japan