| Paper Abstract and Keywords |
| Presentation |
2017-10-27 11:20
High Accuracy Lens Assembly Technologies for downsizing of multi-lane integrated optical module Keita Mochizuki, Tadashi Murao, Yoshiyuki Kamo, Nobuyuki Yasui, Masatomo Mikuni, Koji Kamiyama, Takahiro Yoshimoto, Daisuke Echizenya, Masaya Shimono, Chinatsu Sanda, Hidekazu Kodera, Masamichi Nogami (Mitsubishi Electric) OCS2017-51 OPE2017-83 LQE2017-56 |
| Abstract |
(in Japanese) |
(See Japanese page) |
| (in English) |
Two precise lens-assembly techniques based on the adhesive bonding and hammering were proposed. These techniques allow us to realize a compact 100GbE TOSA 15.1 mm(L) x 6.5 mm(W) x 5.6 mm(H) which is suitable for the QSFP28 form factor. The measured DC output powers were more than +4.0 dBm which fully achieve the target value of +0.9 dBm with the large margin. The estimated OMAs met the ER4 specification of 100GbE standardization. |
| Keyword |
(in Japanese) |
(See Japanese page) |
| (in English) |
100GbE / TOSA / Lens assembly technology / Laser hammering / Adhesive / / / |
| Reference Info. |
IEICE Tech. Rep., vol. 117, no. 265, LQE2017-56, pp. 77-80, Oct. 2017. |
| Paper # |
LQE2017-56 |
| Date of Issue |
2017-10-19 (OCS, OPE, LQE) |
| ISSN |
Print edition: ISSN 0913-5685 Online edition: ISSN 2432-6380 |
Copyright and reproduction |
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| Download PDF |
OCS2017-51 OPE2017-83 LQE2017-56 |