Information: Join today and make your research activities more affordable! Technical workshop participation fees and annual registration fees are available at member rates.
Notice: [Important] Announcement of Changes to Registration Fee Payment and Manuscript Upload Procedures for IEICE Technical Meetings[Type 1 Only]
IEICE Technical Committee Submission System
Conference Paper's Information
Online Proceedings
[Sign in]
Tech. Rep. Archives
 Go Top Page Go Previous   [Japanese] / [English] 

Paper Abstract and Keywords
Presentation 2017-12-22 15:30
Self-Aligned Double-Gate Cu-MIC Poly-GeSn TFT on a Glass Substrate
Naoki Nishiguchi, Hiroki Utsumi, Akito Hara (Tohoku Gakuin Univ.) EID2017-24 SDM2017-85
Abstract (in Japanese) (See Japanese page) 
(in English) Germanium tin (GeSn) is known as a new semiconductor device material. We used metal induced crystallization (MIC) using copper (Cu) for crystallization of GeSn (Sn=7%) thin film. It was found that quality of Cu-MIC poly-GeSn (Sn=7%) is superior to those of solid-phase crystallization (SPC) poly-GeSn (Sn=7%) and pure poly-Ge thin film. We fabricated double-gate poly-GeSn (Sn=7%) thin-film transistors (TFTs) to reduce off-current and it was found to be mobility of 25 cm2/Vs and on/off ration of 4000.
Keyword (in Japanese) (See Japanese page) 
(in English) thin film transistor / GeSn / Ge / double gate / metal induced crystallization / / /  
Reference Info. IEICE Tech. Rep., vol. 117, no. 373, SDM2017-85, pp. 67-70, Dec. 2017.
Paper # SDM2017-85 
Date of Issue 2017-12-15 (EID, SDM) 
ISSN Print edition: ISSN 0913-5685    Online edition: ISSN 2432-6380
Copyright
and
reproduction
All rights are reserved and no part of this publication may be reproduced or transmitted in any form or by any means, electronic or mechanical, including photocopy, recording, or any information storage and retrieval system, without permission in writing from the publisher. Notwithstanding, instructors are permitted to photocopy isolated articles for noncommercial classroom use without fee. (License No.: 10GA0019/12GB0052/13GB0056/17GB0034/18GB0034)
Download PDF EID2017-24 SDM2017-85

Conference Information
Committee SDM EID  
Conference Date 2017-12-22 - 2017-12-22 
Place (in Japanese) (See Japanese page) 
Place (in English) Kyoto University 
Topics (in Japanese) (See Japanese page) 
Topics (in English) Si, Si-related materials, device process, electron devices, and display technology 
Paper Information
Registration To SDM 
Conference Code 2017-12-SDM-EID 
Language Japanese 
Title (in Japanese) (See Japanese page) 
Sub Title (in Japanese) (See Japanese page) 
Title (in English) Self-Aligned Double-Gate Cu-MIC Poly-GeSn TFT on a Glass Substrate 
Sub Title (in English)  
Keyword(1) thin film transistor  
Keyword(2) GeSn  
Keyword(3) Ge  
Keyword(4) double gate  
Keyword(5) metal induced crystallization  
Keyword(6)  
Keyword(7)  
Keyword(8)  
1st Author's Name Naoki Nishiguchi  
1st Author's Affiliation Tohoku Gakuin University (Tohoku Gakuin Univ.)
2nd Author's Name Hiroki Utsumi  
2nd Author's Affiliation Tohoku Gakuin University (Tohoku Gakuin Univ.)
3rd Author's Name Akito Hara  
3rd Author's Affiliation Tohoku Gakuin University (Tohoku Gakuin Univ.)
4th Author's Name  
4th Author's Affiliation ()
5th Author's Name  
5th Author's Affiliation ()
6th Author's Name  
6th Author's Affiliation ()
7th Author's Name  
7th Author's Affiliation ()
8th Author's Name  
8th Author's Affiliation ()
9th Author's Name  
9th Author's Affiliation ()
10th Author's Name  
10th Author's Affiliation ()
11th Author's Name  
11th Author's Affiliation ()
12th Author's Name  
12th Author's Affiliation ()
13th Author's Name  
13th Author's Affiliation ()
14th Author's Name  
14th Author's Affiliation ()
15th Author's Name  
15th Author's Affiliation ()
16th Author's Name  
16th Author's Affiliation ()
17th Author's Name  
17th Author's Affiliation ()
18th Author's Name  
18th Author's Affiliation ()
19th Author's Name  
19th Author's Affiliation ()
20th Author's Name  
20th Author's Affiliation ()
21st Author's Name  
21st Author's Affiliation ()
22nd Author's Name  
22nd Author's Affiliation ()
23rd Author's Name  
23rd Author's Affiliation ()
24th Author's Name  
24th Author's Affiliation ()
25th Author's Name  
25th Author's Affiliation ()
26th Author's Name / /
26th Author's Affiliation ()
()
27th Author's Name / /
27th Author's Affiliation ()
()
28th Author's Name / /
28th Author's Affiliation ()
()
29th Author's Name / /
29th Author's Affiliation ()
()
30th Author's Name / /
30th Author's Affiliation ()
()
31st Author's Name / /
31st Author's Affiliation ()
()
32nd Author's Name / /
32nd Author's Affiliation ()
()
33rd Author's Name / /
33rd Author's Affiliation ()
()
34th Author's Name / /
34th Author's Affiliation ()
()
35th Author's Name / /
35th Author's Affiliation ()
()
36th Author's Name / /
36th Author's Affiliation ()
()
Speaker Author-1 
Date Time 2017-12-22 15:30:00 
Presentation Time 15 minutes 
Registration for SDM 
Paper # EID2017-24, SDM2017-85 
Volume (vol) vol.117 
Number (no) no.372(EID), no.373(SDM) 
Page pp.67-70 
#Pages 4 
Date of Issue 2017-12-15 (EID, SDM) 


[Return to Top Page]

[Return to IEICE Web Page]

(Line Height for English Pages: 1)

The Institute of Electronics, Information and Communication Engineers (IEICE), Japan