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Paper Abstract and Keywords
Presentation 2018-01-19 15:20
Examination of reduction technique for radiation noise from the power supply layers in PCB -- Evaluation by actual measurement --
Kazuki Fueta, shiniti Sasaki (Saga Univ.) EMCJ2017-103
Abstract (in Japanese) (See Japanese page) 
(in English) Recently, by high-speed switching of transistors in LSI, the radiation noise from the power supply layers in PCB has increased. We have suggested a method attaching resistor to reduce radiation noise. The method is effective for the power supply layers with grid pattern. In this research, the effectiveness of the resistance addition method was confirmed by actually manufacturing the substrate and measuring the radiation noise. As a result of actual measurement, resistance addition method was effective. However, in the relationship between resistance addition pitch and frequency, results different from simulation were obtained.
Keyword (in Japanese) (See Japanese page) 
(in English) Printed Circuit Board / Radiation noise / Power supply noise / Resistance attaching method / / / /  
Reference Info. IEICE Tech. Rep., vol. 117, no. 384, EMCJ2017-103, pp. 89-92, Jan. 2018.
Paper # EMCJ2017-103 
Date of Issue 2018-01-11 (EMCJ) 
ISSN Print edition: ISSN 0913-5685    Online edition: ISSN 2432-6380
Copyright
and
reproduction		 All rights are reserved and no part of this publication may be reproduced or transmitted in any form or by any means, electronic or mechanical, including photocopy, recording, or any information storage and retrieval system, without permission in writing from the publisher. Notwithstanding, instructors are permitted to photocopy isolated articles for noncommercial classroom use without fee. (License No.: 10GA0019/12GB0052/13GB0056/17GB0034/18GB0034)
Download PDF EMCJ2017-103

Conference Information
Committee EMCJ  
Conference Date 2018-01-18 - 2018-01-19 
Place (in Japanese) (See Japanese page) 
Place (in English)  
Topics (in Japanese) (See Japanese page) 
Topics (in English) Communication, PCB, Information Security, EMC 
Paper Information
Registration To EMCJ 
Conference Code 2018-01-EMCJ 
Language Japanese 
Title (in Japanese) (See Japanese page) 
Sub Title (in Japanese) (See Japanese page) 
Title (in English) Examination of reduction technique for radiation noise from the power supply layers in PCB 
Sub Title (in English) Evaluation by actual measurement 
Keyword(1) Printed Circuit Board  
Keyword(2) Radiation noise  
Keyword(3) Power supply noise  
Keyword(4) Resistance attaching method  
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1st Author's Name Kazuki Fueta  
1st Author's Affiliation Saga University (Saga Univ.)
2nd Author's Name shiniti Sasaki  
2nd Author's Affiliation Saga University (Saga Univ.)
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Speaker Author-1 
Date Time 2018-01-19 15:20:00 
Presentation Time 25 minutes 
Registration for EMCJ 
Paper # EMCJ2017-103 
Volume (vol) vol.117 
Number (no) no.384 
Page pp.89-92 
#Pages 4 
Date of Issue 2018-01-11 (EMCJ) 

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