Information: Join today and make your research activities more affordable! Technical workshop participation fees and annual registration fees are available at member rates.
Notice: [Important] Announcement of Changes to Registration Fee Payment and Manuscript Upload Procedures for IEICE Technical Meetings
IEICE Technical Committee Submission System
Conference Paper's Information		 Online Proceedings
[Sign in]
Tech. Rep. Archives
 Go Top Page Go Previous   [Japanese] / [English] 

Paper Abstract and Keywords
Presentation 2018-02-16 14:35
Terminal Plating to Lower the Insertion Force of Multiway Connectors
Akihiro Katoh (AutoNetworks Tech.), Hajime Watanabe (SWS), Yoshifumi Saka, Kingo Furukawa, Yasushi Saitoh (AutoNetworks Tech.), Tomoyuki Sakata (SWS) R2017-63 EMD2017-55
Abstract (in Japanese) (See Japanese page) 
(in English) Recent advancement in automotive electronic control systems is remarkable. Since the number of electronic control units and circuits used in these systems has increased, multi-pole connectors are used for wire harness. Due to the use of multi-pole connectors, the connector insertion force is so high that assembly operation couldn’t work. Therefore the development of the plating on the terminal which can lower the insertion force and coefficient of friction is increasingly required. We have developed a tin(Sn) alloy plating in order to reduce the friction coefficient of tin plating which is widely used in terminal, and succeeded in reducing the insertion force of terminals by restraining adhesive and abrasive wear.
Keyword (in Japanese) (See Japanese page) 
(in English) Low Insertion Force / Low friction characteristic / Contact resistance / Plating / Sn-Pd / / /  
Reference Info. IEICE Tech. Rep., vol. 117, no. 438, EMD2017-55, pp. 13-18, Feb. 2018.
Paper # EMD2017-55 
Date of Issue 2018-02-09 (R, EMD) 
ISSN Print edition: ISSN 0913-5685    Online edition: ISSN 2432-6380
Copyright
and
reproduction		 All rights are reserved and no part of this publication may be reproduced or transmitted in any form or by any means, electronic or mechanical, including photocopy, recording, or any information storage and retrieval system, without permission in writing from the publisher. Notwithstanding, instructors are permitted to photocopy isolated articles for noncommercial classroom use without fee. (License No.: 10GA0019/12GB0052/13GB0056/17GB0034/18GB0034)
Download PDF R2017-63 EMD2017-55

Conference Information
Committee EMD R  
Conference Date 2018-02-16 - 2018-02-16 
Place (in Japanese) (See Japanese page) 
Place (in English) Sumitomo Wiring Systems 
Topics (in Japanese) (See Japanese page) 
Topics (in English)  
Paper Information
Registration To EMD 
Conference Code 2018-02-EMD-R 
Language Japanese 
Title (in Japanese) (See Japanese page) 
Sub Title (in Japanese) (See Japanese page) 
Title (in English) Terminal Plating to Lower the Insertion Force of Multiway Connectors 
Sub Title (in English)  
Keyword(1) Low Insertion Force  
Keyword(2) Low friction characteristic  
Keyword(3) Contact resistance  
Keyword(4) Plating  
Keyword(5) Sn-Pd  
Keyword(6)  
Keyword(7)  
Keyword(8)  
1st Author's Name Akihiro Katoh  
1st Author's Affiliation AutoNetworks Technologies,Ltd. (AutoNetworks Tech.)
2nd Author's Name Hajime Watanabe  
2nd Author's Affiliation Sumitomo Wiring Systems, Ltd. (SWS)
3rd Author's Name Yoshifumi Saka  
3rd Author's Affiliation AutoNetworks Technologies,Ltd. (AutoNetworks Tech.)
4th Author's Name Kingo Furukawa  
4th Author's Affiliation AutoNetworks Technologies,Ltd. (AutoNetworks Tech.)
5th Author's Name Yasushi Saitoh  
5th Author's Affiliation AutoNetworks Technologies,Ltd. (AutoNetworks Tech.)
6th Author's Name Tomoyuki Sakata  
6th Author's Affiliation Sumitomo Wiring Systems, Ltd. (SWS)
7th Author's Name  
7th Author's Affiliation ()
8th Author's Name  
8th Author's Affiliation ()
9th Author's Name  
9th Author's Affiliation ()
10th Author's Name  
10th Author's Affiliation ()
11th Author's Name  
11th Author's Affiliation ()
12th Author's Name  
12th Author's Affiliation ()
13th Author's Name  
13th Author's Affiliation ()
14th Author's Name  
14th Author's Affiliation ()
15th Author's Name  
15th Author's Affiliation ()
16th Author's Name  
16th Author's Affiliation ()
17th Author's Name  
17th Author's Affiliation ()
18th Author's Name  
18th Author's Affiliation ()
19th Author's Name  
19th Author's Affiliation ()
20th Author's Name  
20th Author's Affiliation ()
21st Author's Name  
21st Author's Affiliation ()
22nd Author's Name  
22nd Author's Affiliation ()
23rd Author's Name  
23rd Author's Affiliation ()
24th Author's Name  
24th Author's Affiliation ()
25th Author's Name  
25th Author's Affiliation ()
26th Author's Name / /
26th Author's Affiliation ()
()
27th Author's Name / /
27th Author's Affiliation ()
()
28th Author's Name / /
28th Author's Affiliation ()
()
29th Author's Name / /
29th Author's Affiliation ()
()
30th Author's Name / /
30th Author's Affiliation ()
()
31st Author's Name / /
31st Author's Affiliation ()
()
32nd Author's Name / /
32nd Author's Affiliation ()
()
33rd Author's Name / /
33rd Author's Affiliation ()
()
34th Author's Name / /
34th Author's Affiliation ()
()
35th Author's Name / /
35th Author's Affiliation ()
()
36th Author's Name / /
36th Author's Affiliation ()
()
Speaker Author-1 
Date Time 2018-02-16 14:35:00 
Presentation Time 25 minutes 
Registration for EMD 
Paper # R2017-63, EMD2017-55 
Volume (vol) vol.117 
Number (no) no.437(R), no.438(EMD) 
Page pp.13-18 
#Pages 6 
Date of Issue 2018-02-09 (R, EMD) 

[Return to Top Page]

[Return to IEICE Web Page]
The Institute of Electronics, Information and Communication Engineers (IEICE), Japan